NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. (54 pos. shown) ■Overview 1.2mm Continuous miniaturization of personal mobile devices created a need for a low profile, high density interconnection system.In the same time, the demand for higher currents and higher reliability Flexible Printed Circuits has also increased. Hirose meets all these challenges with introduction of this connector. ■Features 4.0mm 24.2mm ●FPC temporary retention 1. Low profile, small PCB mounting area, weight reduction Protruding only 1.2 mm above the board the connector occupies 50% less area than comparable type having contacts spaced on 0.5 mm centers. Creative design, coupled with high manufacturing capabilities resulted in extremely low weight of the connector. FPC temporary hold protrusion 2. Higher current carrying capacity Contact spacing of 0.4 mm allows production of wider and simpler pattern of conductive traces on FPC. FPC notch 3. FPC temporary hold and verification of correct insertion The connector has built-in FPC hold protrusions allowing the tactile feel of the correct FPC insertion and holding it in position before closing of the actuator. Temporary hold-FPC fully inserted 4. Uses standard 0.2 mm thick FPC 5. One-finger operation of the actuator Proven (in several other Hirose's connectors!) Flip-Lock rotating actuator assures reliable mechanical and electrical connection with FPC, confirming it with a definite tactile feel. 6. Board placement with automatic equipment ●Wider FPC conductive traces 0.4mm 0.27mm 0.3mm 0.1mm Flat top surface and packaging on the tape-and reel allows the use of vacuum nozzles. Standard reel contains 2,500 connectors. 7. Environmental considerations The center cores of the embossed tape reels are made of Styrofoam. 8. Variety of contact positions 0.4 mm pitch FPC 0.3 mm pitch FPC Available with 10, 40, 54, 57 and 60 pos. ■Applications Mobile phones, PDA’s, digital cameras, digital video cameras, LCD connections, plasma displays (PDP), camera modules and other compact devices requiring Flexible Printed Circuit connections using high reliability ultra-small profile connectors Metal fittings on each side do not protrude out allowing side-byside mounting of the connectors or closer component placement. Metal fitting 2004.7 1 ■Product Specifications Rated current 0.4 A DC Rated voltage 40 V AC Rating Operating temperature range -55ç to +85ç (Note 1) Operating humidity range Relative humidity 90% max. (No condensation) Recommended FPC Thickness: = 0.2±0.03mm tin-lead plated (Note 3) Item Specification Storage temperature range -10ç to +50ç (Note 2) Storage humidity range Relative humidity 90% max. Conditions 1. Insulation resistance 500 M ø min. 2. Withstanding voltage No flashover or insulation breakdown. 100 m ohms max. 3. Contact resistance * Including FPC conductor resistance Contact resistance: 100 m ø max. 4. Durability (insertion/ withdrawal) No damage, cracks, or parts dislocation. No electrical discontinuity of 1 µs or more. Contact resistance: 100 m ø max. 5. Vibration No damage, cracks, or parts dislocation. No electrical discontinuity of 1 µs. min. Contact resistance: 100 m ø max. 6. Shock No damage, cracks, or parts dislocation. Contact resistance: 100 m ø max. 7. Humidity Insulation resistance: 50 M ø min. (Steady state) No damage, cracks, or parts dislocation. Contact resistance: 100 m ø max. Insulation resistance: 50 M ø min. 8. Temperature cycle No damage, cracks, or parts dislocation. 9. Resistance to No deformation of components affecting performance. soldering heat 100 V DC 120 V AC /one minute 1 mA 20 cycles Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 10 cycle in each of the 3 directions. Acceleration of 981 m/s2, 6ms duration, sine half-wave waveform, 3 cycles / each of 3 axis 96 hours at temperature of 40ç and humidity of 90% to 95%.RH Temperature: -55ç / +15ç to +35ç / +85ç / +15ç to +35ç Time: 30 / 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow: At the recommended temperature profile Manual soldering: 350ç±5ç for 5 seconds Note 1: Includes temperature rise caused by current flow. Note 2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Note 3: When using FPC with gold plated contact pads the connector contacts must be also gold plated : Select the (05) plating code. ■Materials Part Material Finish Remarks Insulator Actuator Contacts Metal fittings LCP LCP Phosphor bronze Phosphor bronze Color: Black Color: Dark brown Tin-lead plated (Note 3) Tin plated(No-lead) ------------------------------------------- ■Ordering information FH27 - 54S - 0.4 - SH (05) 1 2 3 4 1 Series name: FH27 2 No. of contacts 3 2 Number of contacts: 10, 40, 54, 57, 60 Contact pitch: 0.4 mm 5 4 Terminal type SH: SMT horizontal mounting type (05): Gold plated (51): Tin-lead plated 5 Plating code UL94V-0 BOperation and Precautions Operation 1.FPC insertion procedure. Connector installed on the board. Precautions 1 Do not apply excessive force or use any type of tool to operate the actuator. 1 1) Lift up the actuator. Use thumb or index finger. 2 Fully insert the FPC in the connector parallel to mounting surface, with 2 The connector will assure reliable performance when the actuator is the exposed conductive traces facing down. open to 130˚maximum. Do not exceed this angle, as this may cause permanent damage to the connector. Over 130° FPC conductor surface (Bottom side) 3 Rotate down the actuator until firmly closed. It is critical that the 3 Exercise caution when applying upward force to the connected FPC. inserted FPC is not moved and remains fully inserted. 2.FPC removal 1 Lift up the actuator. Carefully withdraw the FPC. 3 ■Connector Dimension A B H 3.5 (3.9) 0.5 ×Number of contacts (0.15) 0.15 H 0.4 A** Polarizing mark indicator Number of contacts indicator 1.2 (2.2) 4 0 0 K (1.7) (0.15) 2 1 0.15MAX (C: FPC insertion slot dimension) D 3 2 1 0.15MAX Notes 1 The coplanarity of each terminal lead is within 0.1. 2 The contact terminal lead position indicates the dimension from the K surface, the bottom surface of the insulator body. 3 Slight variations in color of the plastic compounds do not affect form, fit or function of the connector. 4 Some versions may have material removed from this area. No affect on form, fit or function of the connector. Unit: mm Part Number CL No. Number of Contacts A B C D FH27-10S-0.4SH CL580-0004-0 10 06.6 03.6 05.24 06.0 FH27-40S-0.4SH CL580-0005-3 40 18.6 15.6 17.24 18.0 FH27-54S-0.4SH CL580-0001-2 54 24.2 21.2 22.84 23.6 FH27-57S-0.4SH CL580-0003-8 57 25.4 22.4 24.04 24.8 FH27-60S-0.4SH CL580-0006-6 60 26.6 23.6 25.24 26.0 Tape and reel packaging (2,500 pieces/reel). Order by number of reels. 4 BRecommended PCB mounting pattern and metal mask dimensions (0.2) (0.225) Outline of the connector 0.55±0.05 (0.175) F±0.05 (3.5) (0.25) 1.4±0.05 (0.25) 2.25±0.05 (0.2) 0.4 R 0.23±0.03(Land) 0.04 R 0.2±0.01(Metal mask) Recommended metal mask thickness: .t=0.12 (0.5) 0.8±0.05 E 0.55±0.05 BRecommended FPC Dimensions G±0.05 E±0.03 3.2MIN(Stiffener) 2 2.7MIN 0. .2 R0 2.2 R R0.2MAX 2-R0.25MAX 0.2±0.03 1.9±0.1 2- 0.27±0.03 0.13±0.03 0.4±0.03 1.2±0.05 0.8±0.07 0.2±0.05 0.8±0.07 2 0.5MIN (0.07) Covering film layer H±0.05 G±0.05 (0.07) 1 Polyamide and thermally hardening adhesive is recommended as the materials for the stiffener. 2 Overlap between covering film layer and stiffener is 0.5mm min. Unit: mm Part Number CL No. Number of Contacts E F G H FH27-10S-0.4SH CL580-0004-0 10 03.6 05.5 05.2 04.01 FH27-40S-0.4SH CL580-0005-3 40 15.6 17.5 17.2 16.01 FH27-54S-0.4SH CL580-0001-2 54 21.2 23.1 22.8 21.61 FH27-57S-0.4SH CL580-0003-8 57 22.4 24.3 24.0 22.81 FH27-60S-0.4SH CL580-0006-6 60 23.6 25.5 25.2 24.01 Tape and tape reel packaging (2,500 pieces/reel). Order by number of reels. 5 BPackaging Specification ●Embossed Carrier Tape Dimensions ●Tape width up to 24mm . ●Tape width 32mm and over. N±0.1 M±0.1 L±0.3 (P) (P) N±0.1 1.75±0.1 Ø1 .5 + 0 0 .1 12±0.1 L±0.3 + 0 0 .1 .5 Ø1 (2) (0.3) 2±0.15 4±0.1 12±0.1 1.75±0.1 2±0.15 4±0.1 (2) (0.3) (4.2) (5.2) Unreeling direction 1.5+0.1 0 (4.2) 1.7 +0.1 0 Unreeling direction (5.2) ●Reel Dimensions (Q) End portion No connector inserted (10 pockets min.) Mounting portion (Ø80) (Ø380) Ø1 3 (2) Lead portion (400mm min.) Embossed carrier tape No connector inserted (10 pockets min.) Top cover tape Unit: mm Part Number CL No. Number of Contacts L M N P Q FH27-10S-0.4SH CL580-0004-0 10 16.0 ------- 07.5 06.9 16.5 FH27-40S-0.4SH CL580-0005-3 40 32.0 28.4 14.2 18.9 32.5 FH27-54S-0.4SH CL580-0001-2 54 44.0 40.4 20.2 24.5 44.5 FH27-57S-0.4SH CL580-0003-8 57 44.0 40.4 20.2 25.7 44.5 FH27-60S-0.4SH CL580-0006-6 60 44.0 40.4 20.2 26.9 44.5 2,500 pieces per reel. 6 BRecommended Temperature Profile ●Using Typical Solder Paste 5 sec. max. 250 240ç Temperature(ç) 200 200ç 160ç 150 150ç 100 HRS test conditions Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part SENSBY NR-2) Environment :Room air Solder composition :Paste, 63%Sn/37%Pb (Senju Metal Industry, Co., Ltd.’s Part Number: OZ63-201C-50-9) Test board :Glass epoxy 40mm∞100mm∞1.6mm thick Land dimensions:0.23mm∞0.8mm Metal mask :0.2∞0.8∞0.12mm thick 50 25ç The temperature profiles are based on the above conditions. (30 sec.) (60sec.) 90 sec. to 120 sec. 0 Preheating Start (20 sec. to 30 sec.) In individual applications the actual temperature may vary, Soldering depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment Time (Seconds) manufacturer for specific recommendations. ●Using Lead-free Solder Paste MAX 250ç HRS test condition 250 230ç Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part Number: Temperature(ç) 200 200ç SENSBY NR-2) Environment :Room air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu 150 150ç (Senju Metal Industry, Co., Ltd.’s Part Number: M705-221CM5-42-10.5) 100 Test board :Glass epoxy 70mm∞80mm∞1.6mm thick Metal mask :0.2∞0.8∞0.12mm thick Land dimensions:0.23mm∞08mm 50 25ç (60sec.) 90 sec. to 120 sec. (60 sec.) The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, 0 Start Preheating Time (Seconds) Soldering depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. 7 BFPC Construction (Recommended Specifications) 1. Using Single-sided FPC Top side Material Name Covering layer film Material Thickness (µm) Polyamide 1 mil thick. 25 Cover adhesive 25 Surface treatment Tin-lead plated Copper foil Cu 5 1/2oz 35 Base adhesive Base film 25 Polyamide 1 mil thick 25 Reinforcement material adhesive Thermosetting adhesive Stiffener 30 Polyamide 3 mil thick 75 Total 195 Bottom side 2. Using Double-sided FPC Material Name Top side Covering layer film Material Thickness (µm) Polyamide 1 mil thick Cover adhesive 25 Surface treatment Tin-lead plated Through-hole copper Cu Copper foil Cu 1/2oz Polyamide 1 mil thick Bottom side 25 18 Cu 1/2oz Cover adhesive Covering layer film 18 18 Base adhesive Copper foil 5 15 Base adhesive Base film 25 18 25 Polyamide 1 mil thick 25 Reinforcement material adhesive Thermosetting adhesive 25 Stiffener 25 Polyamide 1 mil thick Total 199 To prevent release of the lock due to FPC bending, use of the FPC with copper foil on bottom side is not recommended. ® 8 5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933 http://www.hirose.com http://www.hirose-connectors.com The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.