LTC4300-1/LTC4300-2 Hot Swappable 2-Wire Bus Buffers U DESCRIPTIO FEATURES ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ The LTC®4300 series hot swappable 2-wire bus buffers allow I/O card insertion into a live backplane without corruption of the data and clock busses. When the connection is made, the LTC4300-1/LTC4300-2 provide bidirectional buffering, keeping the backplane and card capacitances isolated. Rise-time accelerator circuitry* allows the use of weaker DC pull-up currents while still meeting rise-time requirements. During insertion, the SDA and SCL lines are precharged to 1V to minimize bus disturbances. Bidirectional Buffer for SDA and SCL Lines Increases Fanout Prevents SDA and SCL Corruption During Live Board Insertion and Removal from Backplane Isolates Input SDA and SCL Lines from Output Compatible with I2CTM, I2C Fast Mode and SMBus Standards (Up to 400kHz Operation) Small MSOP 8-Pin Package Low ICC Chip Disable: <1µA (LTC4300-1) READY Open Drain Output (LTC4300-1) 1V Precharge on all SDA and SCL Lines Supports Clock Stretching, Arbitration and Synchronization 5V to 3.3V Level Translation (LTC4300-2) High Impedance SDA, SCL Pins for VCC = 0V The LTC4300-1 incorporates a CMOS threshold digital ENABLE input pin, which forces the part into a low current mode when driven to ground and sets normal operation when driven to VCC. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. The LTC4300-2 replaces the ENABLE pin with a dedicated supply voltage pin, VCC2, for the card side, providing level shifting between 3.3V and 5V systems. Both the backplane and card may be powered with supply voltages ranging from 2.7V to 5.5V, with no contraints on which supply voltage is higher. The LTC4300-2 also replaces the READY pin with a digital CMOS input pin, ACC, which enables and disables the rise-time accelerator currents. U APPLICATIO S ■ ■ ■ ■ Hot Board Insertion Servers Capacitance Buffer/Bus Extender Desktop Computer , LTC and LT are registered trademarks of Linear Technology Corporation. I2C is a trademark of Philips Electronics N. V. *U.S. Patent No. 6,650,174 The LTC4300 is available in a small 8-pin MSOP package. U TYPICAL APPLICATIO Input–Output Connection t PLH VCC 3.3V R1 24k C1 0.01µF R2 24k 3 SCLIN R3 24k 8 2 C2* 7 OUTPUT SIDE 50pF INPUT SIDE 150pF SDAOUT C5* C3* 1 *CAPACITORS NOT REQUIRED IF BUS IS SUFFICIENTLY LOADED SCLOUT C4* 6 SDAIN R4 24k LTC4300-1 5 READY ENABLE GND 4 4300-1/2 TA01 sn430012 430012fs 1 LTC4300-1/LTC4300-2 U W W W ABSOLUTE AXI U RATI GS U W U PACKAGE/ORDER I FOR ATIO (Note 1) VCC to GND .................................................... – 0.5 to 7V VCC2 to GND (LTC4300-2) ............................. – 0.5 to 7V SDAIN, SCLIN, SDAOUT, SCLOUT ................. – 0.5 to 7V READY, ENABLE (LTC4300-1) ....................... – 0.5 to 7V ACC (LTC4300-2) .......................................... – 0.5 to 7V Operating Temperature Range LTC4300-1C/LTC4300-2C ....................... 0°C to 70°C LTC4300-1I/LTC4300-2I .................... – 40°C to 85°C Storage Temperature Range ................. – 65°C to 125°C Lead Temperature (Soldering, 10 sec).................. 300°C ORDER PART NUMBER TOP VIEW ENABLE/VCC2* SCLOUT SCLIN GND 1 2 3 4 8 7 6 5 VCC SDAOUT SDAIN READY/ACC* LTC4300-1CMS8 LTC4300-1IMS8 LTC4300-2CMS8 LTC4300-2IMS8 MS8 PART MARKING MS8 PACKAGE 8-LEAD PLASTIC MSOP *LTC4300-2 TJMAX = 125°C, θJA = 200°C/W LTUB LTUC LTVJ LTVK Consult LTC marketing for parts specified with wider operating temperature ranges. ELECTRICAL CHARACTERISTICS The ● denotes the specifications which apply over the full operating temperature range, otherwise specfications are at TA = 25°C. VCC = 2.7V to 5.5V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Power Supply VCC Positive Supply Voltage ICC Supply Current VCC = 5.5V, VSDAIN = VSCLIN = 0V, LTC4300-1 ISD Supply Current in Shutdown Mode VENABLE = 0V, LTC4300-1 VCC2 Card Side Supply Voltage LTC4300-2 IVCC1 VCC Supply Current VSDAIN = VSCLIN = 0V, VCC1 = VCC2 = 5.5V, LTC4300-2 IVCC2 VCC2 Supply Current VSDAOUT = VSCLOUT = 0V, VCC1 = VCC2 = 5.5V, LTC4300-2 ● 2.7 5.5 2.8 ● 6 2.7 mA µA 0.1 ● V 5.5 V 1.8 3.6 mA 1.2 2.4 mA Start-Up Circuitry VPRE Precharge Voltage tIDLE Bus Idle Time VEN ENABLE Threshold Voltage LTC4300-1 VDIS Disable Threshold Voltage LTC4300-1, ENABLE Pin IEN ENABLE Input Current ENABLE from 0V to VCC, LTC4300-1 ±0.1 tPHL ENABLE Delay, On-Off LTC4300-1 100 ns READY Delay, Off-On LTC4300-1 10 ns ENABLE Delay, Off-On LTC4300-1 80 µs tPLH SDA, SCL Floating ● 0.8 1.0 1.2 V ● 50 95 150 µs 0.5 • VCC 0.9 • VCC V 0.1 • VCC 0.5 • VCC V ±1 µA READY Delay, On-Off LTC4300-1 10 µs IOFF READY OFF State Leakage Current LTC4300-1 ±0.1 µA VOL READY Output Low Voltage IPULLUP = 3mA, LTC4300-1 ● 0.4 V sn430012 430012fs 2 LTC4300-1/LTC4300-2 ELECTRICAL CHARACTERISTICS The ● denotes the specifications which apply over the full operating temperature range, otherwise specfications are at TA = 25°C. VCC = 2.7V to 5.5V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP 1 2 0.3 • VCC2 0.5 • VCC2 MAX UNITS Rise-Time Accelerators IPULLUPAC Transient Boosted Pull-Up Current Positive Transition on SDA,SCL, VCC = 2.7V, Slew Rate = 1.25V/µs (Note 2), LTC4300-2, ACC = 0.7 • VCC2, VCC2 = 2.7V mA VACCDIS Accelerator Disable Threshold LTC4300-2 VACCEN Accelerator Enable Threshold LTC4300-2 0.5 • VCC2 0.7 • VCC2 V IVACC ACC Input Current LTC4300-2 ±0.1 ±1 µA tPDOFF ACC Delay, On/Off LTC4300-2 5 V ns Input-Output Connection VOS Input-Output Offset Voltage 10k to VCC on SDA, SCL, VCC = 3.3V (Note 3), LTC4300-2, VCC2 = 3.3V, VIN = 0.2V fSCL, SDA Operating Frequency Guaranteed by Design, Not Subject to Test CIN Digital Input Capacitance Guaranteed by Design, Not Subject to Test VOL Output Low Voltage, Input = 0V SDA, SCL Pins, ISINK = 3mA, VCC = 2.7V, VCC2 = 2.7V, LTC4300-2 ILEAK Input Leakage Current SDA, SCL Pins = VCC = 5.5V, LTC4300-2, VCC2 = 5.5V ● 0 75 0 ● 0 150 mV 400 kHz 10 pF 0.4 V ±5 µA 400 kHz Timing Characteristics fI2C I2C Operating Frequency (Note 4) 0 tBUF Bus Free Time Between Stop and Start Condition (Note 4) 1.3 µs thD,STA Hold Time After (Repeated) Start Condition (Note 4) 0.6 µs tsu,STA Repeated Start Condition Setup Time (Note 4) 0.6 µs tsu,STO Stop Condition Setup Time (Note 4) 0.6 µs thD, DAT Data Hold Time (Note 4) 300 ns tsu, DAT Data Setup Time (Note 4) 100 ns tLOW Clock Low Period (Note 4) 1.3 µs tHIGH Clock High Period (Note 4) 0.6 µs tf Clock, Data Fall Time (Notes 4, 5) 20 + 0.1 • CB 300 ns tr Clock, Data Rise Time (Notes 4, 5) 20 + 0.1 • CB 300 ns Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired Note 2: IPULLUPAC varies with temperature and VCC voltage, as shown in the Typical Performance Characteristics section. Note 3: The connection circuitry always regulates its output to a higher voltage than its input. The magnitude of this offset voltage as a function of the pullup resistor and VCC voltage is shown in the Typical Performance Characteristics section. Note 4: Guaranteed by design, not subject to test. Note 5: CB = total capacitance of one bus line in pF. sn430012 430012fs 3 LTC4300-1/LTC4300-2 U W TYPICAL PERFOR A CE CHARACTERISTICS Input – Output tPHL vs Temperature (LTC4300-1) ICC vs Temperature (LTC4300-1) 3.0 100 VCC = 2.7V 2.9 VCC = 5.5V 80 VCC = 3.3V 2.7 t PHL (ns) ICC (mA) 2.8 2.6 2.5 VCC = 2.7V 60 40 VCC = 5.5V 2.4 20 CIN = COUT = 100pF RPULLUPIN = RPULLUPOUT = 10k 2.3 2.2 –50 –25 0 25 50 TEMPERATURE (°C) 75 0 –50 100 –25 0 25 50 TEMPERATURE (°C) 75 4300-1/2 G01 4300-1/2 G02 IPULLUPAC vs Temperature Connection Circuitry VOUT – VIN 12 300 VCC = 5V 8 6 VCC = 3V 4 TA = 25°C VIN = 0V 250 VOUT – VIN (mV) IPULLUPAC (mA) 10 100 200 150 100 VCC = 5V 2 50 VCC = 3.3V VCC = 2.7V 0 –50 –25 0 25 50 TEMPERATURE (°C) 75 100 4300-1/2 G03 0 0 10,000 20,000 30,000 RPULLUP (Ω) 40,000 4300-1/2 G04 sn430012 430012fs 4 LTC4300-1/LTC4300-2 U U U PI FU CTIO S ENABLE/VCC2 (Pin 1): Chip Enable Pin/Card Supply Voltage. For the LTC4300-1, this is a digital CMOS threshold input pin. Grounding this pin puts the part in a low current (<1µA) mode. It also disables the rise-time accelerators, disables the bus precharge circuitry, drives READY low, isolates SDAIN from SDAOUT and isolates SCLIN from SCLOUT. Drive ENABLE all the way to VCC for normal operation. Connect ENABLE to VCC if this feature is not being used. For the LTC4300-2, this is the supply voltage for the devices on the card I2C busses. Connect pull-up resistors from SDAOUT and SCLOUT to this pin. Place a bypass capacitor of at least 0.01µF close to this pin for best results. SCLOUT (Pin 2): Serial Clock Output. Connect this pin to the SCL bus on the card. See Figures 3 and 4 for bus pullup resistance and capacitance requirements. SCLIN (Pin 3): Serial Clock Input. Connect this pin to the SCL bus on the backplane. See Figures 3 and 4 for bus pullup resistance and capacitance requirements. GND (Pin 4): Ground. Connect this pin to a ground plane for best results. READY/ACC (Pin 5): Connection Flag/Rise-Time Accelerator Control. For the LTC4300-1, this is an open-drain NMOS output which pulls low when either ENABLE is low or the start-up sequence described in the Operation section has not been completed. READY goes high when ENABLE is high and start-up is complete. Connect a 10k resistor from this pin to VCC to provide the pull up. For the LTC4300-2, this is a CMOS threshold digital input pin that enables and disables the rise-time accelerators on all four SDA and SCL pins. Drive ACC all the way to the VCC2 supply voltage to enable all four accelerators; drive ACC to ground to turn them off. SDAIN (Pin 6): Serial Data Input. Connect this pin to the SDA bus on the backplane. See Figures 3 and 4 for bus pull-up resistance and capacitance requirements. SDAOUT (Pin 7): Serial Data Output. Connect this pin to the SDA bus on the card. See Figures 3 and 4 for bus pullup resistance and capacitance requirements. VCC (Pin 8): Main Input Power Supply from Backplane. This is the supply voltage for the devices on the backplane I2C busses. Connect pull-up resistors from SDAIN and SCLIN to this pin. Place a bypass capacitor of at least 0.01µF close to this pin for best results. sn430012 430012fs 5 LTC4300-1/LTC4300-2 W BLOCK DIAGRA (LTC4300-1) 2-Wire Bus Buffer and Hot SwapTM Controller 2mA 2mA SLEW RATE DECTECTOR SLEW RATE DECTECTOR 8 VCC BACKPLANE-TO-CARD CONNECTION SDAIN 6 4 SDAOUT 7 CONNECT CONNECT CONNECT ENABLE 100k RCH1 100k RCH3 1V PRECHARGE 100k RCH2 100k RCH4 2mA 2mA SLEW RATE DECTECTOR SLEW RATE DECTECTOR BACKPLANE-TO-CARD CONNECTION SCLIN 3 CONNECT 2 SCLOUT + CONNECT – 0.55VCC/ 0.45VCC + + – – STOP BIT AND BUS IDLE 0.5µA + 0.55VCC/ 0.45VCC UVLO ENABLE 1 – 5 READY 20pF CONNECT 95µs DELAY RD QB 4 GND S 0.5pF CONNECT 4300-1 BD Hot Swap is a trademark of Linear Technology Corporation. sn430012 430012fs 6 LTC4300-1/LTC4300-2 W BLOCK DIAGRA (LTC4300-2) 2-Wire Bus Buffer and Hot Swap Controller VCC 8 2mA ACC 2mA SLEW RATE DECTECTOR 1 VCC2 SLEW RATE DECTECTOR BACKPLANE-TO-CARD CONNECTION SDAIN 6 CONNECT 4 SDAOUT 7 CONNECT CONNECT 100k RCH1 100k RCH3 1V PRECHARGE 100k RCH2 100k RCH4 2mA ACC 2mA SLEW RATE DECTECTOR SLEW RATE DECTECTOR 5 ACC BACKPLANE-TO-CARD CONNECTION SCLIN 3 CONNECT 2 SCLOUT + CONNECT – + + – – 0.55VCC2/ 0.45VCC2 STOP BIT AND BUS IDLE 0.5µA + 0.55VCC/ 0.45VCC UVLO – 20pF CONNECT CONNECT 95µs DELAY RD QB S 4 GND 0.5pF 4300-2 BD sn430012 430012fs 7 LTC4300-1/LTC4300-2 U OPERATIO Start-Up When the LTC4300 first receives power on its VCC pin, either during power-up or during hot swapping, it starts in an undervoltage lockout (UVLO) state, ignoring any activity on the SDA and SCL pins until VCC rises above 2.5V. For the LTC4300-2, the part also waits for VCC2 to rise above 2V. This ensures that the part does not try to function until it has enough voltage to do so. During this time, the 1V precharge circuitry is also active and forces 1V through 100k nominal resistors to the SDA and SCL pins. Because the I/O card is being plugged into a live backplane, the voltage on the backplane SDA and SCL busses may be anywhere between 0V and VCC. Precharging the SCL and SDA pins to 1V minimizes the worst-case voltage differential these pins will see at the moment of connection, therefore minimizing the amount of disturbance caused by the I/O card. Once the LTC4300 comes out of UVLO, it assumes that SDAIN and SCLIN have been hot swapped into a live system and that SDAOUT and SCLOUT are being powered up at the same time as itself. Therefore, it looks for either a stop bit or bus idle condition on the backplane side to indicate the completion of a data transaction. When either one occurs, the part also verifies that both the SDAOUT and SCLOUT voltages are high. When all of these conditions are met, the input-to-output connection circuitry is activated, joining the SDA and SCL busses on the I/O card with those on the backplane. Connection Circuitry Once the connection circuitry is activated, the functionality of the SDAIN and SDAOUT pins is identical. A low forced on either pin at any time results in both pin voltages being low. SDAIN and SDAOUT enter a logic high state only when all devices on both SDAIN and SDAOUT force a high. The same is true for SCLIN and SCLOUT. This important feature ensures that clock stretching, clock arbitration and the acknowledge protocol always work, regardless of how the devices in the system are tied to the LTC4300. Another key feature of the connection circuitry is that it provides bidirectional buffering, keeping the backplane and card capacitances isolated. Because of this isolation, the waveforms on the backplane busses look slightly different than the corresponding card bus waveforms, as described here. Input to Output Offset Voltage When a logic low voltage, VLOW1, is driven on any of the LTC4300’s data or clock pins, the LTC4300 regulates the voltage on the other side of the chip (call it VLOW2) to a slightly higher voltage, as directed by the following equation: VLOW2 = VLOW1 + 50mV + (VCC/R) • 100 where R is the bus pull-up resistance in ohms. For example, if a device is forcing SDAOUT to 10mV and if VCC = 3.3V and the pull-up resistor R on SDAIN is 10k, then the voltage on SDAIN = 10mV + 50mV + (3.3/10000) • 100 = 93mV. See the Typical Performance Characteristics section for curves showing the offset voltage as a function of VCC and R. Propagation Delays During a rising edge, the rise-time on each side is determined by the combined pull-up current of the LTC4300 boost current and the bus resistor and the equivalent capacitance on the line. If the pull-up currents are the same, a difference in rise-time occurs which is directly proportional to the difference in capacitance between the two sides. This effect is displayed in Figure 1 for VCC = 3.3V and a 10k pull-up resistor on each side (50pF on one side and 150pF on the other). Since the output side has less capacitance than the input, it rises faster and the effective tPLH is negative. There is a finite propagation delay, tPHL, through the connection circuitry for falling waveforms. Figure 2 shows the falling edge waveforms for the same VCC, pull-up resistors and equivalent capacitance conditions as used in Figure 1. An external NMOS device pulls down the voltage on the side with 150pF capacitance; the LTC4300 pulls down the voltage on the opposite side, with a delay of 55ns. This delay is always positive and is a function of supply voltage, temperature and the pull-up resistors and equivalent bus capacitances on both sides of the bus. The Typical Performance Characteristics section shows tPHL sn430012 430012fs 8 LTC4300-1/LTC4300-2 U OPERATIO as a function of temperature and voltage for 10k pull-up resistors and 100pF equivalent capacitance on both sides of the part. By comparison with Figure 2, the VCC = 3.3V curve shows that increasing the capacitance from 50pF to 150pF results in a tPHL increase from 55ns to 75ns. Larger output capacitances translate to longer delays (up to 150ns). Users must quantify the difference in propagation times for a rising edge vs a falling edge in their systems and adjust setup and hold times accordingly. Rise-Time Accelerators Once connection has been established, rise-time accelerator circuits on all four SDA and SCL pins are activated. These allow the user to choose weaker DC pull-up currents on the bus, reducing power consumption while still meeting system rise-time requirements. During positive bus transitions, the LTC4300 switches in 2mA of current to quickly slew the SDA and SCL lines once their DC voltages exceed 0.6V. Using a general rule of 20pF of capacitance for every device on the bus (10pF for the device and 10pF for interconnect), choose a pull-up current so that the bus will rise on its own at a rate of at least 1.25V/µs to guarantee activation of the accelerators. For example, assume an SMBus system with VCC = 3V, a 10k pull-up resistor and equivalent bus capacitance of 200pF. The rise-time of an SMBus system is calculated from (VIL(MAX) – 0.15V) to (VIH(MIN) + 0.15V), or 0.65V to 2.25V. It takes an RC circuit 0.92 time constants to traverse this voltage for a 3V supply; in this case, 0.92 • (10k • 200pF) = 1.85µs. Thus, the system exceeds the maximum allowed rise-time of 1µs by 85%. However, using the rise-time accelerators, which are activated at a OUTPUT SIDE 50pF INPUT SIDE 150pF Figure 1. Input–Output Connection t PLH DC threshold of below 0.65V, the worst-case rise-time is: (2.25V – 0.65V) • 200pF/1mA = 320ns, which meets the 1µs rise-time requirement. READY Digital Output (LTC4300-1) This pin provides a digital flag which is low when either ENABLE is low or the start-up sequence described earlier in this section has not been completed. READY goes high when ENABLE is high and start-up is complete. The pin is driven by an open drain pull-down capable of sinking 3mA while holding 0.4V on the pin. Connect a resistor of 10k to VCC to provide the pull-up. This feature is available for the LTC4300-1 only. ENABLE Low Current Disable (LTC4300-1) Grounding the ENABLE pin disconnects the backplane side from the card side, disables the rise-time accelerators, drives READY low, disables the bus precharge circuitry and puts the part in a near-zero current state. When the pin voltage is driven all the way to VCC, the part waits for data transactions on both the backplane and card sides to be complete (as described in the Start-Up section) before reconnecting the two sides. This feature is available for the LTC4300-1 only. ACC Boost Current Enable (LTC4300-2) Users having lightly loaded systems may wish to disable the rise-time accelerators. Driving this pin to ground turns off the rise-time accelerators on all four SDA and SCL pins. Driving this pin to the VCC2 voltage enables normal operation of the rise-time accelerators, as described in the RiseTime Accelerators section above. This feature is available for the LTC4300-2 only. INPUT SIDE 150pF OUTPUT SIDE 50pF Figure 2. Input–Output Connection t PHL sn430012 430012fs 9 LTC4300-1/LTC4300-2 U W U U APPLICATIO S I FOR ATIO Resistor Pull-Up Value Selection The system pull-up resistors must be strong enough to provide a positive slew rate of 1.25V/µs on the SDA and SCL pins, in order to activate the boost pull-up currents during rising edges. Choose maximum resistor value R using the formula: R ≤ (VCC(MIN) – 0.6) (800,000) / C where R is the pull-up resistor value in ohms, VCC(MIN) is the minimum VCC voltage and C is the equivalent bus capacitance in picofarads (pF). In addition, regardless of the bus capacitance, always choose R ≤ 16k for VCC = 5.5V maximum, R ≤ 24k for VCC␣ =␣ 3.6V maximum. The start-up circuitry requires logic high voltages on SDAOUT and SCLOUT to connect the backplane to the card, and these pull-up values are needed to overcome the precharge voltage. See the curves in Figures 3 and 4 for guidance in resistor pull-up selection. Minimum SDA and SCL Capacitance Requirements The LTC4300 I/O connection circuitry requires a minimum capacitance loading on the SDA and SCL pins in order to function properly. The value of this capacitance is a function of VCC and the bus pull-up resistance. Estimate the bus capacitance on both the backplane and the card data and clock busses, and refer to Figures 3 and 4 to choose appropriate pull-up resistor values. Note from the figures that 5V systems must have at least 47pF capacitance on their busses and 3.3V systems must have at least 22pF capacitance for proper operation of the LTC4300. For applications with less capacitance, add a capacitor to ground to ensure these minimum capacitance conditions. Hot Swapping and Capacitance Buffering Application Figures 5 through 8 illustrate the usage of the LTC4300 in applications that take advantage of both its hot swapping and capacitance buffering features. In all of these applications, note that if the I/O cards were plugged directly into the backplane, all of the backplane and card capacitances would add directly together, making rise- and fall-time requirements difficult to meet. Placing a LTC4300 on the edge of each card, however, isolates the card capacitance from the backplane. For a given I/O card, the LTC4300 drives the capacitance of everything on the card and the backplane must drive only the capacitance of the LTC4300, which is less than 10pF. Figure 5 shows the LTC4300-1 in a CompactPCI TM configuration. Connect V CC to the output of one of the CompactPCI power supply hot swap circuits and connect ENABLE to the short “board enable” pin. VCC is monitored by a filtered UVLO circuit. With the VCC voltage powering up after all other pins have established connection, the UVLO circuit ensures that the backplane and card data and clock busses are not connected until the transients asso20 30 25 20 15 RMAX = 16k 15 RPULLUP (kΩ) RPULLUP (kΩ) RMAX = 24k RISE-TIME > 300ns RISE-TIME > 300ns 10 RECOMMENDED PULL-UP 10 RECOMMENDED PULL-UP 5 5 0 0 0 100 200 CBUS (pF) 300 400 4300-1/2 F03 Figure 3. Bus Requirements for 3.3V Systems 0 100 200 CBUS (pF) 300 400 4300-1/2 F04 Figure 4. Bus Requirements for 5V Systems CompactPCI is a trademark of the PCI Industrial Computer Manufacturers Group. sn430012 430012fs 10 LTC4300-1/LTC4300-2 U W U U APPLICATIO S I FOR ATIO ciated with hot swapping have settled. Owing to their small capacitance, the SDAIN and SCLIN pins cause minimal disturbance on the backplane busses when they make contact with the connector. Figure 6 shows the LTC4300-2 in a CompactPCI configuration. The LTC4300-2 receives its VCC voltage from one of the long “early power” pins. Because this power is not switched, add a 5Ω to 10Ω resistor between the VCC pins of the connector and the LTC4300-2, as shown in the figure. In addition, make sure that the VCC bypassing on the backplane is large compared to the 0.01µF bypass capacitor on the card. Establishing early power VCC ensures that the 1V precharge voltage is present at the SDAIN and SCLIN pins before they make contact. Connect VCC2 to the output of one of the CompactPCI power supply hot swap circuits. VCC2 is monitored by a filtered UVLO circuit. With the VCC2 voltage powering up after all other pins have established connection, the UVLO circuit ensures that the backplane and card data and clock busses are not connected until the transients associated with hot swapping have settled. Figure 7 shows the LTC4300-1 in a PCI application, where all of the pins have the same length. In this case, connect an RC series circuit on the I/O card between VCC and ENABLE. An RC product of 10ms provides a filter to prevent the LTC4300-1 from becoming activated until the transients associated with hot swapping have settled. Figure 8 shows the LTC4300-2 in an application where the user has a custom connector with pins of three different lengths available. Making VCC2 the shortest pin ensures that all other pins are firmly connected before VCC2 receives any voltage. A filtered UVLO circuit on VCC2 ensures that the VCC2 pin is firmly connected before the LTC4300-2 connects the backplane to the card. Repeater/Bus Extender Application Users who wish to connect two 2-wire systems separated by a distance can do so by connecting two LTC4300-1s back-to-back, as shown in Figure 9. The I2C specification allows for 400pF maximum bus capacitance, severely limiting the length of the bus. The SMBus specification places no restriction on bus capacitance, but the limited impedances of devices connected to the bus require systems to remain small if rise- and fall-time specifications are to be met. The strong pull-up and pull-down impedances of the LTC4300-1 are capable of meeting riseand fall-time specifications for one nanofarad of capacitance, thus allowing much more interconnect distance. In this situation, the differential ground voltage between the two systems may limit the allowed distance, because a valid logic low voltage with respect to the ground at one end of the system may violate the allowed VOL specification with respect to the ground at the other end. In addition, the connection circuitry offset voltages of the back-to-back LTC4300-1s add together, directly contributing to the same problem. Systems with Disparate Supply Voltages (LTC4300-1) In large 2-wire systems, the VCC voltages seen by devices at various points in the system can differ by a few hundred millivolts or more. This situation is well modelled by a series resistor in the VCC line, as shown in Figure 10. For proper operation of the LTC4300-1, make sure that VCC(BUS) ≥ VCC(LTC4300) – 0.5V. 5V to 3.3V Level Translator and Power Supply Redundancy (LTC4300-2) Systems requiring different supply voltages for the backplane side and the card side can use the LTC4300-2, as shown in Figure 11. The pull-up resistors on the card side connect from SDAOUT to SCLOUT to VCC2, and those on the backplane side connect from SDAIN and SCLIN to VCC. The LTC4300-2 functions for voltages ranging from 2.7V to 5.5V on both VCC and VCC2. There is no constraint on the voltage magnitudes of VCC and VCC2 with respect to each other. This application also provides power supply redundancy. If either the VCC or VCC2 voltage falls below its UVLO threshold, the LTC4300-2 disconnects the backplane from the card, so that the side that is still powered can continue to function. sn430012 430012fs 11 LTC4300-1/LTC4300-2 U W U U APPLICATIO S I FOR ATIO VCC R1 10k BD_SEL SDA STAGGERED CONNECTOR SCL R2 10k BACKPLANE CONNECTOR STAGGERED CONNECTOR BACKPLANE I/O PERIPHERAL CARD 1 POWER SUPPLY HOT SWAP C1 0.01µF ENABLE SDAIN SCLIN R4 10k R5 10k R6 10k VCC SDAOUT CARD_SDA LTC4300-1 U1 SCLOUT CARD_SCL GND READY I/O PERIPHERAL CARD 2 POWER SUPPLY HOT SWAP C3 0.01µF ENABLE SDAIN SCLIN R8 10k R9 10k R10 10k VCC SDAOUT CARD2_SDA LTC4300-1 U2 SCLOUT CARD2_SCL GND READY STAGGERED CONNECTOR • • • I/O PERIPHERAL CARD N POWER SUPPLY HOT SWAP C5 0.01µF ENABLE SDAIN SCLIN R12 10k R13 10k R14 10k VCC SDAOUT CARDN_SDA LTC4300-1 U3 SCLOUT CARDN_SCL GND READY 4300-1/2 F05 NOTE: APPLICATION ASSUMES BUS CAPACITANCES WITHIN “PROPER OPERATION” REGION OF FIGURES 3 AND 4 Figure 5. Hot Swapping Multiple I/O Cards into a Backplane Using the LTC4300-1 in a CompactPCI System sn430012 430012fs 12 LTC4300-1/LTC4300-2 U W U U APPLICATIO S I FOR ATIO VCC2 BD_SEL VCC SDA SCL R2 10k STAGGERED CONNECTOR R1 10k BACKPLANE CONNECTOR STAGGERED CONNECTOR BACKPLANE I/O PERIPHERAL CARD 1 POWER SUPPLY HOT SWAP C1 0.01µF 5.1Ω R5 10k R6 10k VCC2 SDAOUT CARD_SDA LTC4300-2 U1 SCLOUT CARD_SCL VCC SDAIN R4 10k SCLIN ACC GND C2 0.01µF I/O PERIPHERAL CARD 2 POWER SUPPLY HOT SWAP C3 0.01µF 5.1Ω R9 10k R10 10k VCC2 SDAOUT CARD2_SDA LTC4300-2 U2 SCLOUT CARD2_SCL VCC SDAIN R8 10k SCLIN ACC GND C4 0.01µF STAGGERED CONNECTOR • • • I/O PERIPHERAL CARD N POWER SUPPLY HOT SWAP C5 0.01µF 5.1Ω R13 10k R14 10k VCC2 SDAOUT CARDN_SDA LTC4300-2 U3 SCLOUT CARDN_SCL VCC SDAIN R12 10k SCLIN C6 0.01µF GND ACC 4300-1/2 F06 NOTE: APPLICATION ASSUMES BUS CAPACITANCES WITHIN “PROPER OPERATION” REGION OF FIGURES 3 AND 4 Figure 6. Hot Swapping Multiple I/O Cards into a Backplane Using the LTC4300-2 in a CompactPCI System sn430012 430012fs 13 LTC4300-1/LTC4300-2 U W U U APPLICATIO S I FOR ATIO BACKPLANE BACKPLANE CONNECTOR I/O PERIPHERAL CARD 1 VCC R1 10k R2 10k C1 0.01µF R3 100k SDAIN SCL SCLIN R5 10k R6 10k VCC SDAOUT CARD_SDA LTC4300-1 U1 SCLOUT CARD_SCL ENABLE SDA R4 10k READY GND C2 0.1µF I/O PERIPHERAL CARD 2 C3 0.01µF R7 100k R9 10k R10 10k VCC SDAOUT CARD2_SDA LTC4300-1 U2 SCLOUT CARD2_SCL ENABLE SDAIN R8 10k SCLIN READY GND C4 0.1µF 4300-1/2 F07 NOTE: APPLICATION ASSUMES BUS CAPACITANCES WITHIN “PROPER OPERATION” REGION OF FIGURES 3 AND 4 Figure 7. Hot Swapping Multiple I/O Cards into a Backplane Using the LTC4300-1 in a PCI System VCC2 R1 10k VCC SDA SCL R2 10k BACKPLANE CONNECTOR I/O PERIPHERAL CARD 1 STAGGERED CONNECTOR BACKPLANE C1 0.01µF VCC SDAIN SCLIN C2 0.01µF R4 10k R5 10k R6 10k VCC2 SDAOUT CARD_SDA LTC4300-2 U1 SCLOUT CARD_SCL ACC GND STAGGERED CONNECTOR I/O PERIPHERAL CARD 2 C3 0.01µF VCC SDAIN SCLIN C4 0.01µF R8 10k R9 10k R10 10k VCC2 SDAOUT CARD2_SDA LTC4300-2 U2 SCLOUT CARD2_SCL GND ACC 4300-1/2 F08 NOTE: APPLICATION ASSUMES BUS CAPACITANCES WITHIN “PROPER OPERATION” REGION OF FIGURES 3 AND 4 Figure 8. Hot Swapping Multiple I/O Cards into a Backplane Using the LTC4300-2 with a Custom Connector sn430012 430012fs 14 LTC4300-1/LTC4300-2 U U W U APPLICATIO S I FOR ATIO 2-WIRE SYSTEM 1 2-WIRE SYSTEM 2 VCC = 5V VCC C1 0.01µF R1 10k R4 10k C2 0.01µF R5 10k LTC4300-1 R2 R3 5.1k 5.1k R6 10k R7 10k LTC4300-1 VCC R8 10k VCC ENABLE SDAOUT SDAOUT ENABLE SDA1 SDAIN SCLOUT SCLOUT SDAIN SDA1 SCL1 TO OTHER SYSTEM 1 DEVICES SCLIN READY SCLIN SCL1 TO OTHER SYSTEM 2 DEVICES READY GND GND LONG DISTANCE BUS 4300-1/2 F07 NOTE: APPLICATION ASSUMES BUS CAPACITANCES WITHIN “PROPER OPERATION” REGION OF FIGURE 4 Figure 9. Repeater/Bus Extender Application U PACKAGE DESCRIPTION MS8 Package 8-Lead Plastic MSOP (Reference LTC DWG # 05-08-1660) 0.889 ± 0.127 (.035 ± .005) 5.23 (.206) MIN 3.2 – 3.45 (.126 – .136) 0.42 ± 0.04 (.0165 ± .0015) TYP 3.00 ± 0.102 (.118 ± .004) (NOTE 3) 0.65 (.0256) BSC 8 7 6 5 0.52 (.206) REF RECOMMENDED SOLDER PAD LAYOUT 0.254 (.010) 3.00 ± 0.102 (.118 ± .004) NOTE 4 4.88 ± 0.1 (.192 ± .004) DETAIL “A” 0° – 6° TYP GAUGE PLANE 0.53 ± 0.015 (.021 ± .006) DETAIL “A” 1 2 3 4 1.10 (.043) MAX 0.86 (.034) REF 0.18 (.077) SEATING PLANE 0.22 – 0.38 (.009 – .015) 0.65 (.0256) BCS 0.13 ± 0.05 (.005 ± .002) MSOP (MS8) 1001 NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX sn430012 430012fs Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15 LTC4300-1/LTC4300-2 U TYPICAL APPLICATIO S VCC_LOW RDROP VCC R1 10k C2 0.01µF R2 10k R3 10k SDAIN SCL SCLIN R5 10k VCC SDAOUT SDA2 LTC4300-1 U1 SCLOUT SCL2 ENABLE SDA R4 10k READY GND NOTE: APPLICATION ASSUMES BUS CAPACITANCES WITHIN “PROPER OPERATION” REGION OF FIGURES 3 AND 4 4300-1/2 F08 Figure 10. System with Disparate VCC Voltages VCC 5V R1 10k C2 0.01µF R4 10k SDAIN SCL SCLIN SCL C1 0.01µF VCC VCC2 LTC4300-2 U1 CARD_VCC, 3V R3 10k R2 10k SDAOUT CARD_SDA SCLOUT CARD_SCL GND ACC NOTE: APPLICATION ASSUMES BUS CAPACITANCES WITHIN “PROPER OPERATION” REGION OF FIGURES 3 AND 4 4300-1/2 F09 Figure 11. 5V to 3.3V Level Translator RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LTC1380/LTC1393 Single-Ended 8-Channel/Differential 4-Channel Analog Mux with SMBus Interface Low RON: 35Ω Single-Ended/70Ω Differential, Expandable to 32 Single or 16 Differential Channels LTC1427-50 Micropower, 10-Bit Current Output DAC with SMBus Interface Precision 50µA ± 2.5% Tolerance Over Temperature, 4 Selectable SMBus Addresses, DAC Powers up at Zero or Midscale LTC1623 Dual High Side Switch Controller with SMBus Interface 8 Selectable Addresses/16-Channel Capability LTC1663 SMBus Interface 10-Bit Rail-to-Rail Micropower DAC DNL < 0.75LSB Max, 5-Lead SOT-23 Package LTC1694/LTC1694-1 SMBus Accelerator Improved SMBus/I2C Rise-Time, Ensures Data Integrity with Multiple SMBus/I2C Devices LT1786F SMBus Controlled CCFL Switching Regulator 1.25A, 200kHz, Floating or Grounded Lamp Configurations LTC1695 SMBus/I2C Fan Speed Controller in ThinSOTTM 0.75Ω PMOS 180mA Regulator, 6-Bit DAC LTC1840 Dual I2C Fan Speed Controller Two 100µA 8-Bit DACs, Two Tach Inputs, Four GPI0 ThinSOT is a trademark of Linear Technology Corporation. sn430012 430012fs 16 Linear Technology Corporation LT/TP 0602 2K • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LINEAR TECHNOLOGY CORPORATION 2001