Fairchild Semiconductor Product Package Material Disclosure Package Type Weight of Package (grams) Component TSSOP-56 Lead Frame Copper alloy Maximum Minimum Material 2.21E-01 2.08E-01 Weight in grams Substance in material 7.37E-02 Copper Nickel Silicon Magnesium Silver (DP) Encapsulation Epoxy 1.28E-01 Silica Carbon Black Resin Antimony Compound Brominated Compound Plating Solder 8.84E-03 Tin Lead Chip Die Attach or Lead-free Solder 8.84E-03 Silicon and inorganic compounds 1.90E-03 Adhesive 2.22E-04 Tin Silicon and trace metals Silver Resin Wire Bond Gold Wire 1.39E-03 Gold Wt% in finished product min 33.34 32.08 1.00 0.22 0.05 0.00 Wt% in finished product max 35.41 33.66 1.06 0.23 0.05 0.40 CAS # 7440-50-8 7439-89-6 7440-66-6 7439-95-4 7440-22-4 58.07 35.92 0.00 8.98 0.30 61.66 47.89 0.90 20.65 1.80 1309-64-4 0.90 2.39 68541-56-0 1.37 1.17 0.21 1.37 1.37 6.87 5.84 1.03 6.87 6.87 0.84 0.84 0.93 0.93 0.10 0.07 0.02 0.11 0.08 0.03 0.62 0.68 0.62 0.68 7440-31-5 7439-92-1 7440-31-5 7440-21-3 7440-22-4 7440-57-5 Materials Disclosure Disclaimer The information provided in this Materials Disclosure is, to our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. Also, there may not be information included in this statement regarding the minute amounts of dopant and metal materials contained within the electrically active or passive devices contained within the finished product.