FAIRCHILD TSSOP-56

Fairchild Semiconductor Product Package Material Disclosure
Package Type
Weight of
Package (grams)
Component
TSSOP-56
Lead Frame
Copper alloy
Maximum
Minimum
Material
2.21E-01
2.08E-01
Weight in
grams
Substance in
material
7.37E-02
Copper
Nickel
Silicon
Magnesium
Silver (DP)
Encapsulation
Epoxy
1.28E-01
Silica
Carbon Black
Resin
Antimony
Compound
Brominated
Compound
Plating
Solder
8.84E-03
Tin
Lead
Chip
Die Attach
or
Lead-free
Solder
8.84E-03
Silicon and
inorganic
compounds
1.90E-03
Adhesive
2.22E-04
Tin
Silicon and trace
metals
Silver
Resin
Wire Bond
Gold Wire
1.39E-03
Gold
Wt% in
finished
product min
33.34
32.08
1.00
0.22
0.05
0.00
Wt% in
finished
product max
35.41
33.66
1.06
0.23
0.05
0.40
CAS #
7440-50-8
7439-89-6
7440-66-6
7439-95-4
7440-22-4
58.07
35.92
0.00
8.98
0.30
61.66
47.89
0.90
20.65
1.80
1309-64-4
0.90
2.39
68541-56-0
1.37
1.17
0.21
1.37
1.37
6.87
5.84
1.03
6.87
6.87
0.84
0.84
0.93
0.93
0.10
0.07
0.02
0.11
0.08
0.03
0.62
0.68
0.62
0.68
7440-31-5
7439-92-1
7440-31-5
7440-21-3
7440-22-4
7440-57-5
Materials Disclosure Disclaimer
The information provided in this Materials Disclosure is, to our knowledge, correct. However, there is no guarantee to completeness
or accuracy, as some information is derived from data sources outside the company. Also, there may not be information included in
this statement regarding the minute amounts of dopant and metal materials contained within the electrically active or passive devices
contained within the finished product.