PQFP pbfree100

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
August, 2008
% of Total
Pkg. Wt.
Weight (g)
Die
1.11%
0.018
Mold
84.38%
1.350
D/A Epoxy
0.08%
100 PQFP
1.60
Grams
with matte Sn Plating
MSL: 3
Peak Reflow Temp: 245°C
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 3.38 x 3.54 x 0.64 mm
74.00%
5.91%
4.22%
0.25%
1.184
0.095
0.068
0.004
Silica Fused
Epoxy Resin
Phenol Resin
Carbon black
60676-86-0
1309-64-4
Mold Compound Density varies between 1.7 and 2.3 grams/cc
75 to 95% Silica Fused (LSC uses 87.7% in our calculation)
5 to 10% Epoxy Resin (LSC uses 7% in our calculation).
2 to 8% Phenol Resin (LSC uses 5% in our calculation).
0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation)
0.061%
0.015%
0.001
0.0002
Silver-filled Epoxy
Silver (Ag)
other
7440-22-4
-
(silver content: 70-90%; LSC uses 80% in our calculation)
Die attach epoxy Density: 4 grams/cc
0.0012
Wire
0.18%
0.003
Gold (Au)
7440-57-5
1.0 mil wire diameter; 1 wire for each package lead; wire length 3 mm
Lead Plating
1.38%
0.022
Tin (Sn)
7440-31-5
Plating is 100% Sn; thickness is 0.015mm
Leadframe
12.88%
0.206
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Leadframe thickness is nominal (per Case Outline)
96.2% Cu
3.0% Ni
0.65% Si
0.15% Mg
12.39%
0.39%
0.08%
0.02%
0.198
0.0062
0.0013
0.0003
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. C1