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Hittite Microwave Corporation
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LP5 GaAs
20 Alpha Rd
Chelmsford MA 01824
Tel:{978} 250-3343
Fax: {978} 250-3373
Product Information
Product Environmental Data Sheet
Date/Time Revision:
Manufacture site:
Product Number
Product Name
Product Mass
Product Note
March 20, 2008
Chelmsford MA
Generic: LP5, Plastic Encapsulated Microcircuit
Surface Mount GaAs Semiconductor
Grams:
Min 0.055836
Max 0.068244
Nominal
0.06204
Material Composition Information
Component Mateial Part Name
Material
Material Trade Name
A
B
C
D
E
F
Lead Frame
Mold Compound
Epoxy, Die attach
Semiconductor, GaAs
Bond Wire, Gold
Solder, Lead Finish
Copper Lead Frame
Sumitomo EME7730LF
Sumitomo CRM1076DJ
Non- metal, Non- polymer Crystalline Gallium Arsenide
Wire
Metal
Plating Coat
Sn/Pb
Substance
Substance Name
Substance CAS#
Substance Note
A
A1
A2
A3
A4
B
B1
B2
B3
B4
B5
B6
C
C1
C2
C3
C4
C5
D
D1
D2
E
E1
F
F1
F2
Copper Lead Frame
Cu
Fe
Zn
P
Mold Compound
Silica Fused
Epoxy Resin
Phenol Resin
Antimony Trioxide
Brominated Epoxy Resin
Carbon Black
Die Attach Epoxy
Silver
Epoxy Resin
t-Butyl phenyl glycidyl ether
Phenolic hardener
Butyl cellosolve acetate
GaAs Semiconductor
Ga
As
Bond Wire
Gold (Au)
Solder
Tin
Lead
7440-50-8
7439-89-6
7440-66-6
7723-14-0
n/a
n/a
n/a
n/a
0.021664
0.000591
0.000001
0.000000
60676-86-0
(Trade Secret)
(Trade Secret)
1309-64-4
40039-93-8
1333-86-4
n/a
n/a
n/a
n/a
n/a
n/a
7440-22-4
9003-36-5
3101-60-8
92-88-6
112-07-2
Metal
Polymer
Epoxy
Material
Mass (g)
Minimum
Material
Mass (g)
Maximum
0.0223
0.0257
0.0307
0.0341
0.0006
0.0006
0.0003
0.0006
0.0014
0.0014
0.0007
0.0014
Substance
Mass (g)
Minimum
Substance
Mass (g)
Maximum
Percent of product Percent of product
(%) Minimum
(%) Maximum
40.0%
46.0%
1.0%
1.0%
0.5%
1.0%
45.0%
50.0%
2.0%
2.0%
1.0%
2.0%
Percent of
Substance (%)
Minimum
Percent of
Substance (%)
Maximum
0.030096
0.000819
0.000002
0.000001
97.00%
2.30%
0.11%
0.02%
98.00%
2.40%
0.13%
0.04%
0.019263
0.001027
0.000257
0.000026
0.002568
0.000026
0.032416
0.003412
0.002047
0.000307
0.000341
0.000171
75.00%
4.00%
1.00%
0.10%
10.00%
0.10%
95.00%
10.00%
6.00%
0.90%
1.00%
0.50%
n/a
n/a
n/a
n/a
n/a
0.000363
0.000084
0.000028
0.000006
0.000003
0.001160
0.000341
0.000136
0.000027
0.000020
65.00%
15.00%
5.00%
1.00%
0.50%
85.00%
25.00%
10.00%
2.00%
1.50%
1303-00-0/7440-55-3
1303-00-0/7440-38-2
n/a
n/a
0.000257
0.000279
0.000682
0.000737
46.00%
50.00%
50.00%
54.00%
7440-57-5
Die Attach, wirebond
0.000279
0.000682
99.99%
100.00%
7440-31-5
7439-92-1
.
Tin, Lead solder
Tin, Lead solder
0.000469
0.000078
0.001174
0.000218
84.00%
14.00%
86.00%
16.00%
NOTE: CAS in not available for proprietary substances.All percentages are calculated from mass data declared. Material trade names are not applicable to some common
materials for constant composition. When CAS is unavailable, vendor supplier comments such as PROPRIATARY or TRADE SECRET will be documented
Flammability
The plastic mold compound used for this device has been tested for flammability of plastic materials used for parts in devices and appliances
and is classified as UL-94 V0.
Absence of Hazardous Substances
Our material composition policy is to declare all substances intentionally added in our products and documented by our vendors.
Additionally we confirm the following regulated substances known to be in electronics are not intentionally added or knowingly present in
our semiconductor products or product packaging: Cadmium and cadmium compounds, mercury and mercury compounds, hexavalent
chromium compounds, polychlorinated biphenyl (PCB), polychlorinated naphthalenes (PCN), short chain paraffins (CP) (C10-13) (Cl = 50
wt% or more), mirex (perchlordecone), TBBP-A-bis, organic tin compounds (tributyl tin compounds / triphenyl tin compounds) Asbestos,
formaldehyde and Azo compounds.
Product Life Cycle Information
Our devices are often incorporated into printed circuit boards and then assembled with other parts into electronic systems. In the U.S.A.,
end-of-life printed circuit boards {waste}, are considered scrap metal by the Environmental Protection Agency {EPA} when they are
recycled {USEPA Mgt. memo, Regulatory Status or Printed Circuit Boards, Aug 26, 1992}. If any of our products are disposed of as part of
a printed circuit board, the entire assembly is treated as scrap metal. Approved printed circuit recycling companies either have proper
facilities or have access to secondary metal smelters and refiners which can safely recycle scrap electronic components or assemblies
The information presented in this document is believed accurate and reliable. The information provided is a result of review of numerous sources including vendor submitted
datasheets. Data is the most current available to Hittite Microwave Corporation at the time of preparation and is issued as a matter of reference information only. No warranty as to
accuracy or completeness is expressed or implied. The information in this document is subject to change without notice.
Product Environmental Data Sheet