MICREL SY58040UMI

Micrel
×4 CML
ULTRA PRECISION 4×
SWITCH WITH INTERNAL
I/O TERMINATION
SY58040U
Precision Edge™
SY58040U
FEATURES
■ Provides crosspoint switching between any input
pair to any output pair
■ Guaranteed AC performance over temperature and
voltage:
• DC to >5Gbps throughput
• <350ps propagation delay
• <60ps tr / tf times
• <25ps skew (output-to-output)
■ Unique, patent-pending, channel-to-channel
isolation design provides superior crosstalk
performance
■ Ultra-low jitter design:
• <1psrms random jitter
• <10pspp deterministic jitter
• <10pspp total jitter (clock)
• <0.7psrms crosstalk-induced jitter
■ Unique, patent-pending, 50Ω input termination
extended CMVR, and VT pin accepts DC- and ACcoupled differential inputs
■ 400mV CML output swing
■ 50Ω source terminated outputs minimize round-trip
reflections
■ Power supply 2.5V ±5% or 3.3V ±10%
■ –40°C to +85°C temperature range
■ Available in 44-pin (7mm × 7mm) MLF™ package
Precision Edge™
DESCRIPTION
The SY58040U is a low jitter, low skew, high-speed 4×4
crosspoint switch optimized for precision telecom and
enterprise server/storage distribution applications. The
SY58040U distributes clock frequencies from DC to 4GHz,
and data rates to 5Gbps guaranteed over temperature and
voltage.
The SY58040U differential input includes Micrel’s unique,
3-pin input termination architecture that directly interfaces
to any differential signal (AC or DC-coupled) as small as
100mV (200mVpp) without any level shifting or termination
resistor networks in the signal path. The outputs are 50Ω
source-terminated CML with extremely fast rise/fall times
guaranteed to be less than 60ps.
The SY58040U features a patent-pending isolation design
that significantly improves on channel-to-channel crosstalk
performance.
The SY58040U operates from a 2.5V ±5% or 3.3V ±10%
supply and is guaranteed over the full industrial temperature
range of –40°C to +85°C. The SY58040U is part of Micrel’s
high-speed, Precision Edge™ product line.
Data sheets and support documentation can be found on
Micrel’s web site at www.micrel.com.
APPLICATIONS
■
■
■
■
Data communication systems
All SONET/SDH data/clock applications
All Fibre Channel applications
All Gigabit Ethernet applications
Precision Edge is a trademark of Micrel, Inc.
MLF and MicroLeadFrame are trademarks of Amkor Technology, Inc.
M9999-072904
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Rev.: A
1
Amendment: /0
Issue Date: July 2004
SY58040U
Micrel
FUNCTIONAL BLOCK DIAGRAM
IN0
50Ω
VT0
0
50Ω
/IN0
VREF-AC0
1
Q0
2
/Q0
3
IN1
0
50Ω
VT1
50Ω
/IN1
VREF-AC1
1
Q1
2
/Q1
3
0
IN2
50Ω
1
Q2
50Ω
2
/Q2
VT2
/IN2
VREF-AC2
3
0
IN3
50Ω
VT3
1
Q3
2
/Q3
3
50Ω
/IN3
VREF-AC3
SIN0 (CMOS/TTL)
SIN1 (CMOS/TTL)
SOUT0 (CMOS/TTL)
Control
Logic
SOUT1 (CMOS/TTL)
CONF (CMOS/TTL)
LOAD (CMOS/TTL)
TRUTH TABLES
Output Select Address Table
Input Select Address Table
SIN1
SIN0
INPUT
SOUT1
SOUT0
OUTPUT
0
0
IN0
0
0
Q0
0
1
IN1
0
1
Q1
1
0
IN2
1
0
Q2
1
1
IN3
1
1
Q3
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SY58040U
Micrel
PACKAGE/ORDERING INFORMATION
GND
GND
VREF_AC3
IN3
VT3
/IN3
SOUT0
SOUT1
GND
GND
VCC
Ordering Information(1)
44 43 42 41 40 39 38 37 36 35 34
1
33
2
32
3
31
4
30
5
29
6
28
7
27
8
26
9
25
24
10
23
11
12 13 14 15 16 17 18 19 20 21 22
/Q3
Q3
VCC
/Q2
Q2
VCC
/Q1
Q1
VCC
/Q0
Q0
GND
GND
VREF-AC0
/IN0
VT0
IN0
SIN0
SIN1
GND
GND
VCC
VREF_AC2
/IN2
VT2
IN2
CONFIG
VCC
LOAD
/IN1
VT1
IN1
VREF_AC1
SY58040U
SY58040UMI
Package Operating
Type
Range
MLF-44
Industrial
Package
Marking
Lead
Finish
SY58040U
Sn-Pb
SY58040UMITR(2)
MLF-44
Industrial
SY58040U
Sn-Pb
SY58040UMY
MLF-44
Industrial
SY58040U
with “Y”
designator
Pb-free
SY58040UMYTR(2)
MLF-44
Industrial
SY58040U
with “Y”
designator
Pb-free
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC
electricals only.
2. Tape and Reel.
44-Pin MLF™ (MLF-44)
PIN DESCRIPTION
Pin Number
Pin Name
17, 15,
10, 8,
4, 2,
41, 39
IN0, /IN0
IN1, /IN1
IN2, /IN2
IN3, /IN3
Pin Function
Differential Inputs: These input pairs are the differential signal inputs to the device. Inputs accept
AC or DC-coupled signals as small as 100mV. Each pin of a pair internally terminates to a VT pin
through 50Ω. Note that these inputs will default to an indeterminate state if left open. Please refer to
the “Input Interface Applications” section for more details.
16, 9,
3, 40
VT0, VT1
VT2, VT3
Input Termination Center-Tap: Each side of the differential input pair terminates to a VT pin. The VT
pins provide a center-tap to a termination network for maximum interface flexibility. See “Input
Interface Applications” section for more details.
14,
11,
1,
42
VRef_AC0
VRef_AC1
VRef_AC2
VRef_AC3
Reference Voltage: This output biases to VCC–1.2V. It is used when AC coupling the inputs.
Connect VRef-AC output pin to the VT input pin. Bypass each VRef-AC pin with a 0.01µF low ESR
capacitor to VCC. See “Input Interface Applications” section for more details.
18
19
SIN0
SIN1
These single-ended TTL/CMOS-compatible inputs address the data inputs. Note that these inputs
are internally connected to a 25kΩ pull-up resistor and will default to a logic HIGH state if left open.
38
37
SOUT0
SOUT1
These single-ended TTL/CMOS-compatible inputs address the data outputs. Note that these inputs
are internally connected to a 25kΩ pullup resistor and will default to a logic HIGH state if left open.
5
7
CONF,
LOAD
These single-ended TTL/CMOS compatible inputs control the transfer of the addresses to the
internal multiplexers. See “Address Tables” and “Timing Diagram” sections for more details. Note
that these inputs are internally connected to a 25kΩ pull-up resistor and will default to a logic HIGH
state if left open.
Configuration Sequence
1. Load: Loads configuration into buffer, while Configuration Buffer holds existing switch configuration.
2. Configuration: Loads new configuration into the Configuration Buffer and updates switch configuration.
Buffer Mode
The SY58040U defaults to buffer mode (IN-to-Q) if the load and configuration control signals are
floating.
23, 24,
26, 27,
29, 30
32, 33
Q0, /Q0,
Q1, /Q1,
Q2, /Q2,
Q3, /Q3,
6, 22, 25,
28, 31, 34
VCC
12, 13, 20, 21,
GND,
35, 36, 43, 44 Exposed pad
Differential Outputs: These CML output pairs are the outputs of the device. Please refer to the truth
table below for details. Unused output pairs may be left open. Each output is designed to drive
400mV into 100Ω across the pair, or 50Ω to VCC.
Positive power supply. Bypass with 0.1µF//0.01µF low ESR capacitors and place as close to each
VCC pin.
Ground. GND and EPad must both be connected to most negative potential of chip ground.
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SY58040U
Micrel
Absolute Maximum Ratings(1)
Operating Ratings(2)
Power Supply Voltage (VCC ) ...................... –0.5V to +4.0V
Input Voltage (VIN) ......................................... –0.5V to VCC
CML Output Voltage (VOUT) ......... VCC –0.5V to VCC +5.0V
Termination Current(3)
Source or sink current on VT pin ........................ ±100mA
Input Current(3)
Source or sink current on IN, /IN .......................... ±50mA
VREF-AC Current(3)
Source or sink current on IN, /IN ............................ ±2mA
Lead Temperature (soldering, 10 sec.) ..................... 265°C
Storage Temperature Range (TS ) ........... –65°C to +150°C
Power Supply Voltage (VCC) ................. +2.375V to +3.60V
Ambient Temperature Range (TA) ............. –40°C to +85°C
Package Thermal Resistance(4)
MLF™ (θJA)
Still-Air ............................................................. 23°C/W
MLF™ (ψJB)
Junction-to-board ............................................ 12°C/W
DC ELECTRICAL CHARACTERISTICS(5)
TA= –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage
VCC = 2.5V.
2.375
2.5
2.625
V
VCC = 3.3V.
3.0
3.3
3.6
V
225
300
mA
ICC
Power Supply Current
RIN
Input Resistance (IN-to-VT, /IN-to-VT)
40
50
60
Ω
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
80
100
120
Ω
VIH
Input HIGH Voltage
(IN-to-/IN)
VCC–1.6
VCC
V
VIL
Input LOW Voltage
(IN-to-/IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN-to-/IN)
See Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
|IN – /IN|
See Figure 1b.
0.2
VT_IN
IN to VT (IN-to-/IN)
VREF-AC
Output Reference Voltage
No load, max. VCC.
Includes current from internal 50Ω pull-up
on each output.
Note 6
V
1.28
VCC–1.3 VCC–1.2 VCC–1.1
V
V
Notes:
1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. θJA uses 4-layer
in still-air number, unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIH (min), not lower than 1.2V.
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SY58040U
Micrel
CML OUTPUT DC ELECTRICAL CHARACTERISTICS(7)
VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to +85°C; RL = 100Ω across each output pair, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
VOH
Output HIGH Voltage
Q, /Q
VOUT
Output Differential Swing
Q, /Q
See Figure 1a.
325
400
mV
VDIFF_OUT
Differential Output Voltage Swing
Q, /Q
See Figure 1b.
650
800
mV
ROUT
Output Source Impedance
40
50
60
Ω
Min
Typ
Max
Units
VCC
V
0.8
V
30
µA
VCC–0.040 VCC–0.010
Max
Units
VCC
V
LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS(7)
VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIH
Input HIGH Current
IIL
Input LOW Current
Condition
2.0
–125
VIL = 0V.
–300
Note:
7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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5
µA
SY58040U
Micrel
AC ELECTRICAL CHARACTERISTICS(8)
VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to +85°C, RL = 100Ω across each output pair, unless otherwise stated.
Symbol
Parameter
Condition
fMAX
Maximum Operating Frequency
Min
NRZ data
VOUT ≥ 200mV
tpd
Differential Propagation Delay
IN-to-Q
Typ
5
Clock
3
150
Differential Propagation Delay
Temperature Coefficient
tS
Set-Up Time
tH
tSKEW
tJITTER
225
GHz
350
ps
500
ps
225
fs/°C
SIN-to-LOAD
800
ps
SOUT-to-LOAD
800
ps
LOAD-to-CONFIG
800
ps
CONFIG-to-LOAD
950
ps
Hold Time
LOAD-to-SIN, LOAD-to-SOUT
800
ps
Output-to-Output Skew
Note 9
25
ps
Part-to-Part Skew
Note 10
150
ps
Data
Random Jitter (RJ)
Note 11
1
psrms
Deterministic Jitter (DJ)
Note 12
10
pspp
Cycle-to-Cycle Jitter
Note 13
1
psrms
Total Jitter (TJ)
Note 14
10
pspp
Crosstalk-induced Jitter
Note 15
0.7
psrms
60
ps
Clock
t r, t f
Units
Gbps
CONFIG-to-Q
∆tpd Tempco
Max
Output Rise/Fall Time
At full output swing, 20% to 80%.
20
40
Notes:
8. High-frequency AC-parameters are guaranteed by design and characterization.
9. Output-to-output skew is measured between two different outputs under identical input transitions.
10. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the
respective inputs
11. Random jitter is measured with a K28.7 character pattern, measured at <fMAX.
12. Deterministic jitter is measured at 2.5Gbps/3.2Gbps, with both K28.5 and 223–1 PRBS pattern.
13. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn – Tn-1 where T is the time between rising
edges of the output signal.
14. Total jitter definition: with an ideal clock input of frequency <fMAX, no more than one output edge in 1012 output edges will deviate by more than the
specified peak-to-peak jitter value.
15. Crosstalk induced jitter is defined as the added jitter that results from signals applied to two adjacent channels. It is measured at the output while
applying two similar differential clock frequencies that are asynchronous with respect to each other at the inputs.
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SY58040U
Micrel
TYPICAL OPERATING CHARACTERISTICS
VCC = 3.3V, GND = 0, VIN = 100mV, TA = 25°C, unless otherwise stated.
WITHIN DEVICE SKEW (ps)
OUTPUT AMPLITUDE (mV)
440
420
400
380
360
340
320
0
2000
4000
FREQUENCY (MHz)
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6000
20
18
16
14
12
Within-Device Skew
vs. Temperature
(Referenced to Q0)
Q0
Q1
10
8
6
4
2
0
-40 -20
Q2
0
20
Q3
40 60 80 100
TEMPERATURE (°C)
7
Propagation Delay
vs. Temperature
270
PROPAGATION DELAY (ps)
Output Amplitude
vs. Frequency
265
260
255
250
245
F = 200MHz
240
235
-40 -20
0
20
40
60
80 100
TEMPERATURE (°C)
SY58040U
Micrel
FUNCTIONAL CHARACTERISTICS
VCC = 3.3V, GND = 0, VIN = 100mV, TA = 25°C, unless otherwise stated.
622MHz Output
Output Swing
(100mV/div.)
Output Swing
(100mV/div.)
200MHz Output
TIME (100ps/div.)
TIME (200ps/div.)
Output Swing
(200mV/div.)
5Gbps Output (Q – /Q)
TIME (50ps/div.)
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SY58040U
Micrel
SINGLE-ENDED AND DIFFERENTIAL SWINGS
VDIFF_IN,
VDIFF_OUT 800mV (Typ.)
VIN,
VOUT 400mV (Typ.)
Figure 1a. Single-Ended Voltage Swing
Figure 1b. Differential Voltage Swing
INPUT AND OUTPUT STAGES
VCC
VCC
VCC
50Ω
50Ω
50Ω
ZO = 50Ω
/Q
50Ω
ZO = 50Ω
/Q
100Ω
IN
Q
Q
ZO = 50Ω
50Ω
VT
GND
100mA
ZO = 50Ω
DC bias
per application
100mA
50Ω
/IN
Figure 2a. Simplified Differential
Input Stage
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GND
GND
Figure 2b. CML DC-Coupled
(100Ω Termination)
9
Figure 2c. CML AC-Coupled
(50Ω Termination)
SY58040U
Micrel
INPUT INTERFACE APPLICATIONS
VCC
VCC
VCC
IN
IN
LVPECL
VCC
GND
IN
LVPECL
/IN
/IN
SY58040U
0.01µF
/IN
Rpd
VT
SY58040U
Rpd
SY58040U
VCC
GND
NC
VT
VREF-AC
Rpd
CML
VREF-AC
GND
For VCC = 3.3V, Rpd = 50Ω.
For VCC = 2.5V, Rpd = 39Ω.
Figure 3a. LVPECL
Interface (DC-Coupled)
GND
0.01µF
For 3.3V, Rpd = 100Ω.
For 2.5V, Rpd = 50Ω.
NC
VT
NC
VREF-AC
Option: May connect VT to VCC.
Figure 3b. LVPECL
Interface (AC-Coupled)
Figure 3c. CML
Interface (DC-Coupled)
VCC
VCC
IN
CML
IN
/IN
SY58040U
LVDS
/IN
GND
VCC
SY58040U
VT
VREF-AC
0.01µF
Figure 3d. CML
Interface (AC-Coupled)
GND
NC
VT
NC
VREF-AC
Figure 3e. LVDS Interface
RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION
Part Number
Function
Data Sheet Link
SY58040U
Ultra Precision 4×4 CML Crosspoint Switch
with Internal Input/Output Termination
http://www.micrel.com/product-info/products/sy58040u.shtml
MLF™ Application Note
www.amkor.com/products/notes_paper/MLF_AppNote.pdf
New Products and Applications
www.micrel.com/product-info/products/solutions.shtml
HBW Solutions
M9999-072904
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SY58040U
Micrel
44 LEAD MicroLeadFrame™ (MLF-44)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heat Dissipation
VEE
Heavy Copper Plane
VEE
Heavy Copper Plane
PCB Thermal Consideration for 44-Pin MLF™ Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC.
TEL
1849 FORTUNE DRIVE SAN JOSE, CA 95131
+ 1 (408) 944-0800
FAX
+ 1 (408) 474-1000
WEB
USA
http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2004 Micrel, Incorporated.
M9999-072904
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