Revised August 2005 FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch General Description The FSUSB23 is a low power high bandwidth analog switch specifically designed for high speed USB 2.0 applications. The FSUSB23 features very low quiescent current even when the control voltage is lower than the VCC supply. This feature services mobile handset applications well allowing for direct interface with the baseband processor general purpose I/Os. Typical applications involve switching in portables and consumer applications such as cell phones, digital cameras, and notebooks with hubs or controllers. The wide bandwidth (>720MHz) of this switch exceeds the bandwidth needed to pass the 3rd harmonic which results in signals with minimum edge and phase distortion. Superior channel-to-channel crosstalk results in minimal interference. Features O 10PA maximum ICCT current over an expanded control voltage range (VIN = 2.6V, VCC = 3.6V) O Lower Capacitance: Con = 9pF Typ O 7: typical On Resistance (RON) O 3dB bandwidth: > 720MHz O Low power consumption (1PA maximum) O Packaged in: Pb-Free 10-lead MicroPak¥ (1.6mm by 2.1mm) Pb-Free 16-lead DQFN O 7kV I/O to GND ESD performance Applications O Cell phone, PDA, Digital Camera, and Notebook O LCD Monitor, TV, and Set-top Box Ordering Code: Order Package Number Number FSUSB23L10X MAC010A Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm FSUSB23BQX MLP016E Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Package Description Pb-Free package per JEDEC J-STD-020B. MicroPak¥ is a trademark of Fairchild Semiconductor Corporation. © 2005 Fairchild Semiconductor Corporation DS500925 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch August 2005 FSUSB23 Analog Symbol Connection Diagrams Pad Assignments for MicroPak Pin Descriptions (Top View) Pad Assignments for DQFN Pin Name Description OE Bus Switch Enable S Select Input D+, D, Dn+, Dn Data Ports Truth Table S OE Function X H Disconnect L L D+, D = D1n H L D+, D = D2n (Top Through View) www.fairchildsemi.com 2 Recommended Operating Conditions (Note 3) 0.5V to +4.6V Supply Voltage (VCC) 0.5V to VCC + 0.5V DC Switch Voltage (Note 2) DC Input Voltage (VIN) (Note 2) Supply Voltage VCC 0.5v to +4.6V Control Input Voltage 50mA Switch Input Voltage DC Input Diode Current DC Output Current 0V to VCC 0V to VCC 40qC to +85qC Operating Temperature 50mA 65qC to +150qC Storage Temperature 3.0V to 3.6V Thermal Resistance 250qC/w 10 MicroPak ESD (Human Body Model) All Pins 7 KV I/O to GND 7 KV Note 1: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The Recommended Operating Conditions tables will define the conditions for actual device operation. Note 2: The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. DC switch voltage may never exceed 4.6V. Note 3: Control input must be held HIGH or LOW and it must not float. DC Electrical Characteristics (All typical values are @ 25qC unless otherwise specified.) Symbol Parameter TA = 40qC to +85qC VCC (V) VIK Clamp Diode Voltage VIH Input Voltage HIGH 3.0 to 3.6 VIL Input Voltage LOW 3.0 to 3.6 IIN Control Input Leakage IOZ OFF State Leakage RON Switch On Resistance Min Typ Units 1.2 3.0 V 1.2 3.6 0.50 V r1.0 r1.0 PA PA 6.0 9.0 7.0 10.0 : 3.0 Delta RON (Note 5) IIN = 18mA V (Note 4) 'RON Conditions Max 3.0 0.3 2.0 RON Flatness RON Flatness (Note 4) 3.0 ICC Quiescent Supply Current 3.6 1.0 ICCT Increase in ICC Current per 3.6 10.0 : : PA PA Control Voltage and VCC Levels VIN = 0V to VCC 0 d Dn, D1n, D2n d VCC VIN = 0.4V, ION = 8mA VIN = 0.8V, ION = 8mA VIN = 0.8V, ION = 8mA VIN = 0.0V 1.0V, ION = 8mA VIN = 0.0V or VCC, IOUT = 0 VIN = 2.6V VCC = 3.6V Note 4: Measured by the voltage drop between Dn, D1n, D2n pins at the indicated current through the switch. On Resistance is determined by the lower of the voltage on the two ports. Note 5: Guaranteed by characterization. AC Electrical Characteristics (All typical values are for VCC = 3.3v @ 25qC unless otherwise specified.) Symbol Parameter VCC (V) TA = 40qC to +85qC Min Typ Max Figure Units Conditions Number tON Turn On Time S, OE to Output 3.0 to 3.6 10.0 13.0 ns VD1n, D2n = 0.8V, RL = 50:CL = 10: tOFF Turn OFF Time S, OE to Output 3.0 to 3.6 8.0 11.0 ns VD1n, D2n = 0.8V, RL = 50:CL = 10: tPD Propagation Delay (Note 6) 3.3 0.25 ns CL = 10 pF Figure 5 Figure 5 Figures 3, 4 OIRR OFF Isolation (Non-Adjacent) 3.0 to 3.6 f = 250MHz, RL = 50: Non-Adjacent Channel Crosstalk 3.0 to 3.6 30.0 43.0 dB Xtalk dB RL = 50:, f = 250MHz Figure 9 BW 3dB Bandwidth 3.0 to 3.6 720 MHz RL = 50: Figure 7 Figure 8 Note 6: Guaranteed by characterization 3 www.fairchildsemi.com FSUSB23 Absolute Maximum Ratings(Note 1) FSUSB23 USB Related AC Electrical Characteristics Symbol Parameter VCC (V) TA = 40qC to +85qC Min Typ Figure Units Conditions Max Number tSK(O) Channel-to-Channel Skew (Note 7) 3.0 to 3.6 40.0 ps CL = 10pF Figures 3, 6 tSK(P) Skew of Opposite Transitions of the Same Output (Note 7) 3.0 to 3.6 20.0 ps CL = 10pF Figures 3, 6 tJ Total Jitter (Note 7) 3.0 to 3.6 150 ps RL = 50:, CL = 10pF, tR = tF = 750ps at 480 Mbps (PRBS = 215 1) Note 7: Guaranteed by design. Capacitance Symbol TA = 40qC to +85qC Parameter Min Typ Figure Units Conditions Max Number CIN Control Pin Input Capacitance 2.0 pF VCC = 0V Figure 11 CON D1n, D2n, Dn ON Capacitance 9.0 pF VCC = 3.3, OE = 0V Figure 10 COFF D1n, D2n OFF Capacitance 4.0 pF VCC and OE = 3.3 Figure 11 www.fairchildsemi.com 4 FSUSB23 Test Diagrams Note: Each switch port is tested separately. FIGURE 1. On Resistance FIGURE 2. OFF Leakage Note: RL, RS, and CL are functions of application environment (See AC Electrical table for specific values). FIGURE 4. Switch Propagation Delay Waveforms Note: CL includes test fixture and stray capacitance. FIGURE 3. AC Test Circuit Load FIGURE 5. Turn ON/ Turn OFF Waveform 5 www.fairchildsemi.com FSUSB23 FIGURE 6. Switch Skew Tests Note: RS and RT are functions of application environment (See AC Electrical Tables for specific values). FIGURE 7. Bandwidth FIGURE 8. Channel OFF Isolation www.fairchildsemi.com 6 FSUSB23 FIGURE 9. Non-Adjacent Channel-to-Channel Crosstalk FIGURE 11. Channel OFF Capacitance FIGURE 10. Channel ON Capacitance 7 www.fairchildsemi.com FSUSB23 Tape and Reel Specification TAPE FORMAT for MircoPak Package Tape Number Cavity Cover Tape Designator Section Cavities Status Status Leader (Start End) 125 (typ) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed L10X TAPE DIMENSIONS inches (millimeters) REEL DIMENSIONS inches (millimeters) Tape Size 8 mm www.fairchildsemi.com A B C D N W1 W2 W3 7.0 0.059 0.512 0.795 2.165 0.331 + 0.059/0.000 0.567 W1 + 0.078/0.039 (177.8) (1.50) (13.00) (20.20) (55.00) (8.40 + 1.50/0.00) (14.40) (W1 + 2.00/1.00) 8 Package Tape Number Cavity Cover Tape Designator Section Cavities Status Status Leader (Start End) 125 (typ) Empty Sealed Carrier 2500/3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed BQX TAPE DIMENSIONS inches (millimeters) REEL DIMENSIONS inches (millimeters) Tape Size 12 mm A B C D N W1 W2 13.0 0.059 0.512 0.795 7.008 0.488 0.724 (330) (1.50) (13.00) (20.20) (178) (12.4) (18.4) 9 www.fairchildsemi.com FSUSB23 Tape Format for DQFN FSUSB23 Physical Dimensions inches (millimeters) unless otherwise noted Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm Package Number MAC010A www.fairchildsemi.com 10 FSUSB23 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Package Number MLP016E 11 www.fairchildsemi.com FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION As used herein: provided in the labeling, can be reasonably expected to result in significant injury to the user. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or 2. A critical component is any component of a life support (b) support or sustain life, or (c) whose failure to perform device or system whose failure to perform can be reasonwhen properly used in accordance with instructions for use ably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. www.fairchildsemi.com 12