MITSUBISHI FX20KMJ-06

MITSUBISHI Pch POWER MOSFET
RY
A
N
I
FX20KMJ-06
.
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tion
ifica t to cha
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t
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No e pa
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IM
REL
P
HIGH-SPEED SWITCHING USE
FX20KMJ-06
OUTLINE DRAWING
Dimensions in mm
3 ± 0.3
6.5 ± 0.3
2.8 ± 0.2
φ 3.2 ± 0.2
3.6 ± 0.3
14 ± 0.5
15 ± 0.3
10 ± 0.3
1.1 ± 0.2
1.1 ± 0.2
E
0.75 ± 0.15
3
2.6 ± 0.2
2 3
1
• 4V DRIVE
• VDSS ............................................................... –60V
• rDS (ON) (MAX) ................................................ 97mΩ
• ID .................................................................... –20A
• Integrated Fast Recovery Diode (TYP.) ...........50ns
• Viso ................................................................................ 2000V
0.75 ± 0.15
2.54 ± 0.25
4.5 ± 0.2
2.54 ± 0.25
1 GATE
2 DRAIN
3 SOURCE
1
2
TO-220FN
APPLICATION
Motor control, Lamp control, Solenoid control
DC-DC converter, etc.
MAXIMUM RATINGS
Symbol
VDSS
VGSS
ID
IDM
IDA
IS
ISM
PD
Tch
Tstg
Viso
—
(Tc = 25°C)
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Conditions
VGS = 0V
VDS = 0V
Drain current (Pulsed)
Avalanche drain current (Pulsed) L = 100µH
Source current
Source current (Pulsed)
Maximum power dissipation
Channel temperature
Storage temperature
Isolation voltage
AC for 1minute, Terminal to case
Weight
Typical value
Ratings
Unit
–60
±20
V
V
–20
–80
–20
–20
–80
25
A
A
A
A
A
W
–55 ~ +150
–55 ~ +150
2000
°C
°C
V
2.0
g
Jan.1999
MITSUBISHI Pch POWER MOSFET
RY
A
N
I
.
.
nge
tion
ifica t to cha
pec
al s subjec
in
f
are
ot a
is n limits
his
e: T ametric
ic
t
r
No e pa
Som
IM
REL
FX20KMJ-06
P
HIGH-SPEED SWITCHING USE
ELECTRICAL CHARACTERISTICS
(Tch = 25°C)
Symbol
Parameter
V (BR) DSS
Drain-source breakdown voltage
IGSS
IDSS
VGS (th)
rDS (ON)
rDS (ON)
Gate-source leakage current
Drain-source leakage current
Gate-source threshold voltage
Drain-source on-state resistance
Drain-source on-state resistance
VDS (ON)
yfs
Ciss
Drain-source on-state voltage
Forward transfer admittance
Input capacitance
Coss
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Crss
td (on)
tr
td (off)
tf
VSD
Rth (ch-c)
trr
Limits
Test conditions
Typ.
Max.
ID = –1mA, VGS = 0V
VGS = ±20V, VDS = 0V
VDS = –60V, VGS = 0V
–60
—
—
—
—
—
—
±0.1
–0.1
V
µA
mA
ID = –1mA, VDS = –10V
ID = –10A, VGS = –10V
ID = –10A, VGS = –4V
ID = –10A, VGS = –10V
ID = –10A, VDS = –10V
–1.3
—
—
—
–1.8
73
119
–0.73
–2.3
97
166
–0.97
V
mΩ
mΩ
V
—
—
—
—
10.9
2370
306
147
—
—
—
—
S
pF
pF
pF
—
—
—
—
15
37
131
72
—
—
—
—
ns
ns
ns
ns
—
–1.0
–1.5
V
—
—
—
50
5.00
—
°C/W
ns
VDS = –10V, VGS = 0V, f = 1MHz
VDD = –30V, ID = –10A, VGS = –10V, RGEN = RGS = 50Ω
Turn-off delay time
Fall time
Source-drain voltage
IS = –10A, VGS = 0V
Channel to case
Thermal resistance
Reverse recovery time
Unit
Min.
IS = –20A, dis/dt = 100A/µs
PERFORMANCE CURVES
DRAIN CURRENT ID (A)
–102
40
30
20
10
0
0
50
100
150
10µs
–101
100µs
–7
–5
1ms
–3
–2
10ms
TC = 25°C
Single Pulse
–100
–7
–5
DC
–3
–2
–2 –3 –5–7–100 –2 –3 –5–7–101 –2 –3 –5–7–102 –2
200
OUTPUT CHARACTERISTICS
(TYPICAL)
OUTPUT CHARACTERISTICS
(TYPICAL)
–20
VGS =
–10V
Tc = 25°C
Pulse Test
–30
–5V
–20
–4V
–10
–3V
–2
–4
–6
–8
–10
DRAIN-SOURCE VOLTAGE VDS (V)
Tc = 25°C
Pulse Test
VGS =
–6V
–8V
–40
0
tw =
–3
–2
DRAIN-SOURCE VOLTAGE VDS (V)
PD =
25W
0
–7
–5
CASE TEMPERATURE TC (°C)
–50
DRAIN CURRENT ID (A)
MAXIMUM SAFE OPERATING AREA
–2
–10V
DRAIN CURRENT ID (A)
POWER DISSIPATION PD (W)
POWER DISSIPATION DERATING CURVE
50
–16
–8V
–4V
–6V
–12
–5V
PD =25W
–8
–4
0
–3V
0
–1.0
–2.0
–3.0
–4.0
–5.0
DRAIN-SOURCE VOLTAGE VDS (V)
Jan.1999
MITSUBISHI Pch POWER MOSFET
RY
A
N
I
.
.
nge
tion
ifica t to cha
pec
al s subjec
in
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are
ot a
is n limits
his
e: T ametric
ic
t
r
No e pa
Som
IM
REL
FX20KMJ-06
P
HIGH-SPEED SWITCHING USE
ON-STATE VOLTAGE VS.
GATE-SOURCE VOLTAGE
(TYPICAL)
–8
–6
ID =
–4
–40A
–2
0
–10A
0
–2
–20A
–4
–6
–8
Tc = 25°C
Pulse Test
160
VGS = –4V
120
–10V
80
40
0
–10–1 –2 –3 –5–7–100 –2 –3 –5–7–101 –2 –3 –5–7–102
–10
GATE-SOURCE VOLTAGE VGS (V)
DRAIN CURRENT ID (A)
TRANSFER CHARACTERISTICS
(TYPICAL)
FORWARD TRANSFER ADMITTANCE
VS.DRAIN CURRENT
(TYPICAL)
–50
102
Tc = 25°C
VDS = –10V
Pulse Test
–40
FORWARD TRANSFER
ADMITTANCE yfs (S)
DRAIN CURRENT ID (A)
200
Tc = 25°C
Pulse Test
DRAIN-SOURCE ON-STATE
RESISTANCE rDS (ON) (mΩ)
DRAIN-SOURCE ON-STATE
VOLTAGE VDS (ON) (V)
–10
ON-STATE RESISTANCE VS.
DRAIN CURRENT
(TYPICAL)
–30
–20
–10
VDS = –10V
Pulse Test
7
5
4
3
2
TC =
75°C
125°C
25°C
101
7
5
4
3
2
0
0
–2
–4
–6
–8
100 0
–10
–10
DRAIN CURRENT ID (A)
CAPACITANCE VS.
DRAIN-SOURCE VOLTAGE
(TYPICAL)
SWITCHING CHARACTERISTICS
(TYPICAL)
7
5
4
3
3
2
Ciss
Tch = 25°C
f = 1MHZ
VGS = 0V
Coss
2
102
7
Crss
5
4
3
–3 –5–7–100 –2 –3 –5–7–101 –2 –3 –5–7–102 –2 –3
DRAIN-SOURCE VOLTAGE VDS (V)
SWITCHING TIME (ns)
CAPACITANCE
Ciss, Coss, Crss (pF)
103
–2 –3 –4–5 –7–102
GATE-SOURCE VOLTAGE VGS (V)
3
2
–2 –3 –4 –5 –7–101
td(off)
102
tf
7
5
4
3
tr
2
td(on)
101
7
5
4
3
–5 –7 –100
Tch = 25°C
VGS = –10V
VDD = –30V
RGEN = RGS = 50Ω
–2 –3 –4–5 –7 –101
–2 –3 –4–5
DRAIN CURRENT ID (A)
Jan.1999
MITSUBISHI Pch POWER MOSFET
RY
A
N
I
.
.
nge
tion
ifica t to cha
pec
al s subjec
in
f
are
ot a
is n limits
his
e: T ametric
ic
t
r
No e pa
Som
IM
REL
FX20KMJ-06
P
HIGH-SPEED SWITCHING USE
–10
SOURCE CURRENT IS (A)
VGS = 0V
Pulse Test
VDS =
–10V
–20V
–6
–40V
–4
–2
0
10
20
30
40
75°C
–20
25°C
–10
0
–0.4
–0.8
–1.2
–1.6
–2.0
SOURCE-DRAIN VOLTAGE VSD (V)
ON-STATE RESISTANCE VS.
CHANNEL TEMPERATURE
(TYPICAL)
THRESHOLD VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
–4.0
VGS = –10V
ID = 1/2ID
Pulse Test
100
7
5
4
3
2
–50
0
50
100
VDS = –10V
ID = –1mA
–3.2
–2.4
–1.6
–0.8
0
150
CHANNEL TEMPERATURE Tch (°C)
BREAKDOWN VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
1.4
VGS = 0V
ID = –1mA
1.2
1.0
0.8
0.6
0.4
125°C
GATE CHARGE Qg (nC)
2
10–1
TC =
–30
0
101
7
5
4
3
–40
50
GATE-SOURCE THRESHOLD
VOLTAGE VGS (th) (V)
DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (25°C)
DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (t°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V (BR) DSS (t°C)
–50
Tch = 25°C
ID = –20A
–8
0
DRAIN-SOURCE BREAKDOWN VOLTAGE V (BR) DSS (25°C)
SOURCE-DRAIN DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
–50
0
50
100
150
CHANNEL TEMPERATURE Tch (°C)
–50
0
50
100
150
CHANNEL TEMPERATURE Tch (°C)
TRANSIENT THERMAL IMPEDANCE Zth (ch–c) (°C/W)
GATE-SOURCE VOLTAGE VGS (V)
GATE-SOURCE VOLTAGE
VS.GATE CHARGE
(TYPICAL)
TRANSIENT THERMAL IMPEDANCE
CHARACTERISTICS
101
7 D = 1.0
5
0.5
3
2
0.2
100
7
5
3
2
10–1
7
5
0.1
0.05
PDM
0.02
0.01
Single Pulse
tw
T
D= tw
T
3
2
10–2 –4
10 2 3 5 710–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
PULSE WIDTH tw (s)
Jan.1999