Order this document by BF721T1/D SEMICONDUCTOR TECHNICAL DATA Motorola Preferred Device COLLECTOR 2,4 PNP SILICON TRANSISTOR SURFACE MOUNT BASE 1 EMITTER 3 MAXIMUM RATINGS 4 Symbol Value Unit Collector-Emitter Voltage Rating VCEO – 300 Vdc Collector-Base Voltage VCBO –300 Vdc Collector-Emitter Voltage VCER – 300 Vdc Emitter-Base Voltage VEBO – 5.0 Vdc Collector Current IC –100 mAdc Total Power Dissipation up to TA = 25°C(1) PD 1.5 Watts Storage Temperature Range Tstg – 65 to +150 °C TJ 150 °C Symbol Max Unit RθJA 83.3 °C/W Junction Temperature 1 2 3 CASE 318E-04, STYLE 1 SOT–223 (TO-261AA) DEVICE MARKING DF THERMAL CHARACTERISTICS Characteristic Thermal Resistance from Junction to Ambient(1) ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit Collector-Emitter Breakdown Voltage (IC = –1.0 mAdc, IB = 0) V(BR)CEO – 300 — Vdc Collector-Base Breakdown Voltage (IC = –100 µAdc, IE = 0) V(BR)CBO –300 — Vdc Collector-Emitter Breakdown Voltage (IC = –100 µAdc, RBE = 2.7 kΩ) V(BR)CER –300 — Vdc Emitter-Base Breakdown Voltage (IE = –10 µAdc, IC = 0) V(BR)EBO – 5.0 — Vdc Collector-Base Cutoff Current (VCB = – 200 Vdc, IE = 0) ICBO — –10 nAdc Collector–Emitter Cutoff Current (VCE = – 250 Vdc, RBE = 2.7 kΩ) (VCE = – 200 Vdc, RBE = 2.7 kΩ, TJ = 150°C) ICER — — –50 –10 nAdc µAdc OFF CHARACTERISTICS 1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. REV 3 Small–Signal Motorola Motorola, Inc. 1996 Transistors, FETs and Diodes Device Data 1 BF721T1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued) Characteristic Symbol Min Max Unit hFE 50 — — VCE(sat) — – 0.8 Vdc fT 60 — MHz Cre — 1.6 pF ON CHARACTERISTICS DC Current Gain (VCE = –25 mAdc, VCE = –20 Vdc) Collector-Emitter Saturation Voltage (IC = – 30 mAdc, IB = – 5.0 mAdc) DYNAMIC CHARACTERISTICS Current-Gain — Bandwidth Product (VCE = – 10 Vdc, IC = –10 mAdc, f = 35 MHz) Feedback Capacitance (VCE = – 30 Vdc, IC = 0, f = 1.0 MHz) 2 Motorola Small–Signal Transistors, FETs and Diodes Device Data BF721T1 INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE POWER DISSIPATION The power dissipation of the SOT-223 is a function of the pad size. These can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the SOT-223 package, PD can be calculated as follows. PD = TJ(max) – TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 1.5 watts. PD = 150°C – 25°C 83.3°C/W = 1.5 watts The 83.3°C/W for the SOT-223 package assumes the recommended collector pad area of 965 sq. mils on a glass epoxy printed circuit board to achieve a power dissipation of 1.5 watts. If space is at a premium, a more realistic approach is to use the device at a PD of 833 mW using the footprint shown. Using a board material such as Thermal Clad, a power dissipation of 1.6 watts can be achieved using the same footprint. MOUNTING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C. • The soldering temperature and time should not exceed 260°C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.15 3.8 0.079 2.0 0.248 6.3 0.091 2.3 0.091 2.3 0.079 2.0 0.059 1.5 0.059 1.5 0.059 1.5 inches mm SOT–223 Motorola Small–Signal Transistors, FETs and Diodes Device Data 3 BF721T1 PACKAGE DIMENSIONS A F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 S B 1 2 3 D L G J C 0.08 (0003) M H INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287 MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30 K STYLE 1: PIN 1. 2. 3. 4. BASE COLLECTOR EMITTER COLLECTOR CASE 318E–04 ISSUE H TO-261AA Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. 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