SEMICONDUCTOR TECHNICAL DATA The MC10H179 is a functional/pinout duplication of the standard MECL 10K part, with 100% improvement in propagation delay and no increase in power supply current. • Power Dissipation, 300 mW Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 MAXIMUM RATINGS Characteristic Symbol Rating Unit VEE VI –8.0 to 0 Vdc 0 to VEE Vdc 50 100 mA 0 to +75 °C –55 to +150 –55 to +165 °C °C Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current — Continuous — Surge Iout Operating Temperature Range TA Tstg Storage Temperature Range — Plastic — Ceramic FN SUFFIX PLCC CASE 775–02 DIP PIN ASSIGNMENT ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° 25° 75° VCC1 1 16 VCC2 GG 2 15 PG Characteristic Symbol Min Max Min Max Min Max Unit Power Supply Current IE — 79 — 72 — 79 mA CN+4 3 14 P0 µA G0 4 13 P3 — — — — — 465 545 705 790 870 — — — — — 275 320 415 465 510 — — — — — 275 320 415 465 510 G3 5 12 P2 CN+2 6 11 CN G1 7 10 P1 0.5 — 0.5 — 0.3 — µA Vdc VEE 8 9 G2 –0.735 Input Current High Pins 5 and 9 Pins 4, 7 and 11 Pin 14 Pin 12 Pins 10 and 13 IinH Input Current Low IinL VOH High Output Voltage Low Output Voltage –1.02 –0.84 –0.98 –0.81 –0.92 VOL VIH –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc High Input Voltage –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc AC PARAMETERS Propagation Delay P to PG G, P, Cn to Cn or GG Rise Time Fall Time tpd tr tf Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). ns 0.4 1.4 0.4 1.5 0.5 1.7 0.6 2.3 0.7 2.4 0.8 2.6 0.5 1.7 0.5 1.8 0.5 1.9 ns 0.5 1.7 0.5 1.8 0.5 1.9 ns NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. 3/93 Motorola, Inc. 1996 2–135 REV 5 MC10H179 LOGIC DIAGRAM G3 5 P3 13 3 CN+4 G2 9 P2 12 2 GG CN 11 15 PG G1 7 P1 10 6 CN+2 G0 4 VCC1 = VCC2 = VEE = P0 14 PG GG CN + 2 CN + 4 = = = = PIN 1 PIN 16 PIN 8 P0 + P1 + P2 + P3 (G0 + P1 + P2 + P3) (G1 + P2 + P3) (G2 + P3) G3 (CN + P0 + P1) (G0 + P1) G1 (CN + P0 + P1 + P2 + P3) (G0 + P1 + P2 + P3) (G1 + P2 + P3) (G2 + P3) G3 TYPICAL APPLICATIONS The MC10H179 is a high–speed, low–power, standard MECL complex function that is designed to perform the look–ahead carry function. This device can be used with the MC10H181 4–bit ALU directly, or with the MC10H180 dual arithmetic unit in any computer, instrumentation or digital communication application requiring high speed arithmetic operation on long words. When used with the MC10H181, the MC10H179 performs a second order or higher look–ahead. Figure 2 shows a 16–bit look–ahead carry arithmetic unit. Second order carry is valuable for longer binary words. As an example, addition of two 32–bit words is improved from 30 nanoseconds with ripple–carry techniques. A block diagram of a 32–bit ALU is shown in Figure 1. The MC10H179 may also be used in many other applications. It can, for example, reduce system package count when used to generate functions of several variables. FIGURE 1 — 32–BIT ALU WITH CARRY LOOK–AHEAD Cin ALU Cn+4 Cn P Cn MOTOROLA G ALU Cn Cn P G P Cn+2 MC10H179 ALU Cn+4 G ALU Cn P Cn G Cn+4 P Cn 2–136 ALU Cn+4 G ALU Cn P Cn G P Cn+2 MC10H179 ALU Cn+4 G Add Time = 18 ns typ ALU Cn P G Cn+4 Cout MECL Data DL122 — Rev 6 MC10H179 FIGURE 2 — 16–BIT FULL LOOK–AHEAD CARRY ARITHMETIC LOGIC UNIT B1 A1 B5 A2 A5 B2 B0 B3 Cin 0 A B A B A B A B 0 0 1 1 2 2 3 3 Cn Cn + 4 M MC10H181 S0 G S1 4-BIT ARITHMETIC LOGIC UNIT S2 P S3 F0 F1 F2 F3 A9 B6 B4 A3 A0 B9 A6 B8 A7 B7 A4 A11 B11 A8 A B A B A B A B 0 0 1 1 2 2 3 3 Cn Cn + 4 M MC10H181 S0 G S1 4-BIT ARITHMETIC LOGIC UNIT S2 P S3 F2 F3 F0 F1 A10 B10 A B A B A B A B 0 0 1 1 2 2 3 3 Cn Cn + 4 M MC10H181 S0 G S1 4-BIT ARITHMETIC LOGIC UNIT S2 P S3 F2 F3 F0 F1 B12 A12 B13 A14 A13 B14 A15 B15 A B A B A B A B 0 0 1 1 2 2 3 3 Cn Cn + 4 M MC10H181 S0 G S1 4-BIT ARITHMETIC LOGIC UNIT S2 P S3 F2 F3 F0 F1 M S0 S1 S2 S3 F0 F1 F2 F3 F4 F5 F6 F7 P0 G0 Cn F8 P1 G1 P2 G2 MC10H179 CARRY LOOK-AHEAD Cn + 2 Cn + 4 P3 F9 F10 F11 F12 F13 F14 F15 G3 G P C15 MECL Data DL122 — Rev 6 2–137 MOTOROLA MC10H179 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M N S S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–138 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MECL Data DL122 — Rev 6 MC10H179 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MECL Data DL122 — Rev 6 2–139 *MC10H179/D* MC10H179/D MOTOROLA