MOTOROLA MJD3055-1

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by MJD2955/D
SEMICONDUCTOR TECHNICAL DATA
DPAK For Surface Mount Applications
Designed for general purpose amplifier and low speed switching applications.
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Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix)
Straight Lead Version in Plastic Sleeves (“–1” Suffix)
Lead Formed Version Available in 16 mm Tape and Reel (“T4” Suffix)
Electrically Similar to MJE2955 and MJE3055
DC Current Gain Specified to 10 Amperes
High Current Gain–Bandwidth Product — fT = 2.0 MHz (Min) @ IC = 500 mAdc
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SILICON
POWER TRANSISTORS
10 AMPERES
60 VOLTS
20 WATTS
MAXIMUM RATINGS
Collector–Emitter Voltage
Symbol
Value
Unit
VCEO
60
Vdc
Collector–Base Voltage
VCB
70
Vdc
Emitter–Base Voltage
VEB
5
Vdc
Collector Current
IC
10
Adc
Base Current
IB
6
Adc
Total Power Dissipation @ TC = 25_C
Derate above 25_C
PD†
20
0.16
Watts
W/_C
Total Power Dissipation (1) @ TA = 25_C
Derate above 25_C
PD
1.75
0.014
Watts
W/_C
TJ, Tstg
– 55 to + 150
_C
Operating and Storage Junction
Temperature Range
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction to Case
RθJC
6.25
_C/W
Thermal Resistance, Junction to Ambient (1)
RθJA
71.4
_C/W
CASE 369A–13
CASE 369–07
MINIMUM PAD SIZES
RECOMMENDED FOR
SURFACE MOUNTED
APPLICATIONS
0.190
4.826
Rating
0.243
6.172
0.063
1.6
0.118
3.0
0.07
1.8
0.165
4.191
(1) These ratings are applicable when surface mounted on the minimum pad sizes recommended.
†Safe Area Curves are indicated by Figure 1. Both limits are applicable and must be observed.
inches
mm
REV 1
 Motorola, Inc. 1995
Motorola Bipolar Power Transistor Device Data
1
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v
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ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
VCEO(sus)
60
—
Vdc
Collector Cutoff Current (VCE = 30 Vdc, IB = 0)
ICEO
—
50
µAdc
Collector Cutoff Current
(VCE = 70 Vdc, VEB(off) = 1.5 Vdc)
(VCE = 70 Vdc, VEB(off) = 1.5 Vdc, TC = 150_C)
ICEX
—
—
0.02
2
Collector Cutoff Current
(VCB = 70 Vdc, IE = 0)
(VCB = 70 Vdc, IE = 0, TC = 150_C)
ICBO
—
—
0.02
2
Emitter Cutoff Current (VBE = 5 Vdc, IC = 0)
IEBO
—
0.5
20
5
100
—
—
—
1.1
8
OFF CHARACTERISTICS
Collector–Emitter Sustaining Voltage (1)
(IC = 30 mAdc, IB = 0)
mAdc
mAdc
mAdc
ON CHARACTERISTICS
DC Current Gain (1)
(IC = 4 Adc, VCE = 4 Vdc)
(IC = 10 Adc, VCE = 4 Vdc)
hFE
—
Collector–Emitter Saturation Voltage (1)
(IC = 4 Adc, IB = 0.4 Adc)
(IC = 10 Adc, IB = 3.3 Adc)
VCE(sat)
Vdc
Base–Emitter On Voltage (1)
(IC = 4 Adc, VCE = 4 Vdc)
VBE(on)
—
1.8
Vdc
fT
2
—
MHz
DYNAMIC CHARACTERISTICS
Current–Gain — Bandwidth Product
(IC = 500 mAdc, VCE = 10 Vdc, f = 500 kHz)
(1) Pulse Test: Pulse Width
2
300 µs, Duty Cycle
2%.
Motorola Bipolar Power Transistor Device Data
TYPICAL CHARACTERISTICS
PD, POWER DISSIPATION (WATTS)
TA TC
2.5 25
2 20
TC
1.5 15
TA
SURFACE
MOUNT
1 10
0.5
5
0
0
50
25
75
100
125
150
T, TEMPERATURE (°C)
Figure 1. Power Derating
500
100
2
VCE = 2 V
0.7
0.5
25°C
– 55°C
50
30
20
0.02
0.05
0.1
0.5
0.2
1
2
5
10
0
0.1
0.2
0.4
0.6
1
2
Figure 2. DC Current Gain
Figure 3. Turn–On Time
4
6
5
TJ = 25°C
VCC = 30 V
IC/IB = 10
IB1 = IB2
3
2
TJ = 25°C
1
VBE(sat) @ IC/IB = 10
VBE @ VCE = 2 V
0.4
0.2
0.06 0.1
IC, COLLECTOR CURRENT (AMP)
t, TIME ( µs)
V, VOLTAGE (VOLTS)
0.6
td @ VBE(off) ≈ 5 V
IC, COLLECTOR CURRENT (AMP)
1
0.8
0.1
0.03
0.02
1.4
1.2
tr
0.3
0.2
0.07
0.05
10
5
0.01
TJ = 25°C
VCC = 30 V
IC/IB = 10
1
TJ = 150°C
t, TIME ( µs)
hFE, DC CURRENT GAIN
300
200
ts
0.7
0.5
0.3
0.2
tf
0.1
VCE(sat) @ IC/IB = 10
0.2 0.3
0.5
1
2
3
5
10
0.07
0.05
0.06 0.1
0.2
0.4
0.6
1
IC, COLLECTOR CURRENT (AMP)
IC, COLLECTOR CURRENT (AMP)
Figure 4. “On” Voltages, MJD3055
Figure 5. Turn–Off Time
Motorola Bipolar Power Transistor Device Data
2
4
6
3
2
TJ = 25°C
1.6
V, VOLTAGE (VOLTS)
VCC
+ 30 V
25 µs
RC
+11 V
0
1.2
SCOPE
RB
–9 V
VBE(sat) @ IC/IB = 10
0.8
VBE @ VCE = 3 V
D1
51
tr, tf ≤ 10 ns
DUTY CYCLE = 1%
–4 V
0.4
RB and RC VARIED TO OBTAIN DESIRED CURRENT LEVELS
D1 MUST BE FAST RECOVERY TYPE, eg:
1N5825 USED ABOVE IB ≈ 100 mA
MSD6100 USED BELOW IB ≈ 100 mA
VCE(sat) @ IC/IB = 10
0
0.1
0.2 0.3
0.5
1
2 3
IC, COLLECTOR CURRENT (AMP)
5
10
Figure 6. “On” Voltages, MJD2955
r(t), EFFECTIVE TRANSIENT THERMAL
RESISTANCE (NORMALIZED)
1
0.7
0.5
Figure 7. Switching Time Test Ciruit
D = 0.5
0.3
0.2
0.2
0.1
0.07
0.05
0.05
0.02
0.01
0.03
0.02
P(pk)
RθJC(t) = r(t) RθJC
RθJC = 6.25°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) – TC = P(pk) θJC(t)
0.1
t1
t2
DUTY CYCLE, D = t1/t2
SINGLE PULSE
0.01
0.01
0.02 0.03 0.05
0.1
0.2 0.3
0.5
1
2 3
5
t, TIME (ms)
10
20
30
50
100
200 300
500
1k
Figure 8. Thermal Response
IC, COLLECTOR CURRENT (AMP)
10
5
3
2
TJ = 150°C
1
500 µs
100 µs
1 ms
0.5
0.3
5 ms
0.1
dc
WIRE BOND LIMIT
THERMAL LIMIT TC = 25°C (D = 0.1)
SECOND BREAKDOWN LIMIT
0.05
0.03
0.02
0.01
0.6
FORWARD BIAS SAFE OPERATING AREA
INFORMATION
1
4
6
10
2
20
40
VCE, COLLECTOR–EMITTER VOLTAGE (VOLTS)
There are two limitations on the power handling ability of a
transistor: average junction temperature and second breakdown. Safe operating area curves indicate IC – VCE limits of
the transistor that must be observed for reliable operation;
i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
The data of Figure 9 is based on T J(pk) = 150_C; TC is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T J(pk)
150_C. T J(pk) may be calculated from the data in Figure 8. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the
limitations imposed by second breakdown.
v
60
Figure 9. Maximum Forward Bias
Safe Operating Area
4
Motorola Bipolar Power Transistor Device Data
PACKAGE DIMENSIONS
C
B
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
–T–
E
R
4
Z
A
S
1
2
DIM
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
3
U
K
F
J
L
H
D
G
2 PL
0.13 (0.005)
M
T
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.180 BSC
0.034
0.040
0.018
0.023
0.102
0.114
0.090 BSC
0.175
0.215
0.020
0.050
0.020
–––
0.030
0.050
0.138
–––
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
4.58 BSC
0.87
1.01
0.46
0.58
2.60
2.89
2.29 BSC
4.45
5.46
0.51
1.27
0.51
–––
0.77
1.27
3.51
–––
BASE
COLLECTOR
EMITTER
COLLECTOR
CASE 369A–13
ISSUE W
C
B
V
E
R
4
A
1
2
3
S
–T–
K
SEATING
PLANE
J
F
H
D
G
3 PL
0.13 (0.005)
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
H
J
K
R
S
V
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.090 BSC
0.034
0.040
0.018
0.023
0.350
0.380
0.175
0.215
0.050
0.090
0.030
0.050
STYLE 1:
PIN 1.
2.
3.
4.
T
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
2.29 BSC
0.87
1.01
0.46
0.58
8.89
9.65
4.45
5.46
1.27
2.28
0.77
1.27
BASE
COLLECTOR
EMITTER
COLLECTOR
CASE 369–07
ISSUE K
Motorola Bipolar Power Transistor Device Data
5
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6
◊
Motorola Bipolar Power Transistor Device Data
*MJD2955/D*
MJD2955/D