MOTOROLA MPXH6115A

Freescale Semiconductor, Inc.
MOTOROLA
Order this document
by MPXA6115A
SEMICONDUCTOR TECHNICAL DATA
Freescale Semiconductor, Inc...
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On- Chip Signal Conditioned,
Temperature Compensated
and Calibrated
Motorola’s MPXA6115A/MPXH6115A series sensor integrates on--chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on--chip integration make the
Motorola pressure sensor a logical and economical
choice for the system designer.
SUPER SMALL OUTLINE
The MPXA6115A/MPXH6115A series piezoresistive
PACKAGE
transducer is a state--of--the--art, monolithic, signal
conditioned, silicon pressure sensor. This sensor
combines advanced micromachining techniques, thin
film metallization, and bipolar semiconductor processing
to provide an accurate, high level analog output signal
that is proportional to applied pressure.
MPXH6115A6U
Figure 1 shows a block diagram of the internal
CASE 1317
circuitry integrated on a pressure sensor chip.
Features
• Improved Accuracy at High Temperature
• Available in Small and Super Small Outline
Packages
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or
Microcontroller--Based Systems
• Temperature Compensated from --40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount
Package
MPXA6115A
MPXH6115A
SERIES
INTEGRATED
PRESSURE SENSOR
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 Volts Output
SMALL OUTLINE PACKAGE
MPXA6115A6U
CASE 482
MPXA6115AC6U
CASE 482A
MPXH6115AC6U
CASE 1317A
J
PIN NUMBER
Application Examples
• Aviation Altimeters
• Industrial Controls
• Engine Control/Manifold Absolute Pressure (MAP)
• Weather Station and Weather Reporting Device
Barometers
1
N/C
5
N/C
2
VS
6
N/C
3
Gnd
7
N/C
4
Vout
8
N/C
MPXV5004G7U
CASE 482B
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is denoted by the
chamfered corner of the package.
VS
MPXV5004GC7U
CASE 482C
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
SENSING
ELEMENT
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor
Schematic
PIN NUMBER
Vout
N/C
5
N/C
2
VS
6
N/C
3
Gnd
7
N/C
4
Vout
8
N/C
1
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is denoted by the notch
in the lead.
REV 2
Motorola Sensor Device Data
 Motorola, Inc. 2003
MPXA6115A MPXH6115A SERIES
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MAXIMUM RATINGS(1)
Symbol
Value
Units
Maximum Pressure (P1 > P2)
Parametrics
Pmax
400
kPa
Storage Temperature
Tstg
--40° to +125°
°C
TA
--40° to +125°
°C
Io+
0.5
mAdc
Io --
--0.5
mAdc
Operating Temperature
Output Source Current @ Full Scale
Output(2)
Output Sink Current @ Minimum Pressure
Offset(2)
NOTES:
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.)
Freescale Semiconductor, Inc...
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
15
—
115
kPa
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Io
—
6.0
10
mAdc
(0 to 85°C)
Voff
0.133
0.200
0.268
Vdc
Full Scale Output(3)
@ VS = 5.0 Volts
(0 to 85°C)
VFSO
4.633
4.700
4.768
Vdc
Full Scale Span(4)
@ VS = 5.0 Volts
(0 to 85°C)
VFSS
4.433
4.500
4.568
Vdc
Accuracy(5)
(0 to 85°C)
—
—
—
±1.5
%VFSS
Supply Current
Minimum Pressure
@ VS = 5.0 Volts
Sensitivity
Offset(2)
V/P
—
45
—
mV/kPa
Response
Time(6)
tR
—
1.0
—
ms
Warm--Up
Time(7)
—
—
20
—
ms
—
—
±0.25
—
%VFSS
Offset
Stability(8)
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm--up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
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DIE
FLUORO SILICONE
GEL DIE COAT
+5.0 V
STAINLESS
STEEL CAP
P1
WIRE BOND
THERMOPLASTIC
CASE
LEAD
FRAME
VS Pin 2
MPXA6115A
MPXH6115A
Vout Pin 4
100 nF
to ADC
47 pF
GND Pin 3
51 K
ABSOLUTE ELEMENT
DIE BOND
SEALED VACUUM REFERENCE
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 3 shows a typical application circuit (output source
current operation).
5.0
4.5
4.0
OUTPUT (Volts)
3.5
MAX
TRANSFER FUNCTION:
Vout = Vs* (.009*P--.095) ± Error
VS = 5.0 Vdc
TEMP = 0 to 85°C
TYP
3.0
2.5
2.0
1.5
MIN
1.0
0.5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
Freescale Semiconductor, Inc...
Figure 2. Cross Sectional Diagram SSOP
(not to scale)
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85°C temperature range.
The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure
signal to be transmitted to the silicon diaphragm. The
Motorola Sensor Device Data
MPXA6115A/MPXH6115A series pressure sensor operating
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance and long--term reliability. Contact the factory for
information regarding media compatibility in your application.
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Transfer Function (MPXA6115A/MPXH6115A)
Nominal Transfer Value: Vout = VS x (0.009 x P -- 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.0 ± 0.25 Vdc
Temperature Error Band
MPXA6115A/MPXH6115A Series
4.0
Break Points
Temp
3.0
Temperature
Error
Factor
Multiplier
-- 40
0 to 85
125
2.0
3
1
1.75
1.0
--40
--20
0
20
40
60
80
100
120
140
Temperature in C°
NOTE: The Temperature Multiplier is a linear response from 0°C to --40°C and from 85°C to 125°C
Pressure Error Band
Error Limits for Pressure
3.0
2.0
Pressure Error (kPa)
Freescale Semiconductor, Inc...
0.0
1.0
0.0
20
40
60
80
100
120
Pressure (in kPa)
--1.0
-- 2.0
-- 3.0
Pressure
Error (Max)
15 to 115 (kPa)
± 1.5 (kPa)
ORDERING INFORMATION — SMALL OUTLINE PACKAGE
Device Type
Options
Case No.
Basic Element
Absolute, Element Only
482
MPXA6115A6U
Rails
MPXA6115A
Absolute, Element Only
482
MPXA6115A6T1
Tape and Reel
MPXA6115A
Absolute, Axial Port
482A
MPXA6115AC6U
Rails
MPXA6115A
Absolute, Axial Port
482A
MPXA6115AC6T1
Tape and Reel
MPXA6115A
Ported Element
MPX Series Order No.
Packing Options
Marking
ORDERING INFORMATION — SUPER SMALL OUTLINE PACKAGE
Device Type
Options
Case No.
Basic Element
Absolute, Element Only
1317
MPXH6115A6U
Rails
MPXH6115A
Absolute, Element Only
1317
MPXH6115A6T1
Tape and Reel
MPXH6115A
Absolute, Axial Port
1317A
MPXH6115AC6U
Rails
MPXH6115A
Absolute, Axial Port
1317A
MPXH6115AC6T1
Tape and Reel
MPXH6115A
Ported Element
MPX Series Order No.
Packing Options
MPXA6115A MPXH6115A SERIES
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Marking
Motorola Sensor Device Data
Freescale Semiconductor, Inc.
SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must
be the correct size to ensure proper solder connection interface between the board and the package. With the correct
pad geometry, the packages will self--align when subjected to
0.100 TYP
2.54
Freescale Semiconductor, Inc...
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
mm
0.100 TYP 8X
2.54
Figure 5. SOP Footprint (Case 482)
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 6. SSOP Footprint (Case 1317 and 1317A)
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Freescale Semiconductor, Inc...
NOTES
MPXA6115A MPXH6115A SERIES
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Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
NOTES
Motorola Sensor Device Data
MPXA6115A MPXH6115A SERIES
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SMALL OUTLINE PACKAGE DIMENSIONS
--A--
D 8 PL
0.25 (0.010)
4
5
M
T B
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
S
--B-G
8
1
S
Freescale Semiconductor, Inc...
N
H
C
J
--T-PIN 1 IDENTIFIER
M
K
SEATING
PLANE
DIM
A
B
C
D
G
H
J
K
M
N
S
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.212
0.230
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0_
7_
0.405
0.415
0.709
0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0_
7_
10.29
10.54
18.01
18.41
CASE 482--01
ISSUE O
--A--
D 8 PL
0.25 (0.010)
4
5
M
T B
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
S
N --B-G
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0_
7_
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0_
7_
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
--T-K
M
PIN 1 IDENTIFIER
SEATING
PLANE
CASE 482A--01
ISSUE A
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SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
--A-NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4
5
--B-G
8
1
0.25 (0.010)
M
T B
D 8 PL
S A
DETAIL X
S
PIN 1 IDENTIFIER
N
Freescale Semiconductor, Inc...
S
C
--T-K
SEATING
PLANE
DIM
A
B
C
D
G
J
K
M
N
S
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.210
0.220
0.026
0.034
0.100 BSC
0.009
0.011
0.100
0.120
0_
15 _
0.405
0.415
0.540
0.560
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.33
5.59
0.66
0.864
2.54 BSC
0.23
0.28
2.54
3.05
0_
15 _
10.29
10.54
13.72
14.22
M
J
DETAIL X
CASE 482B--03
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
--A-4
5
N --B-G
8
0.25 (0.010)
1
M
T B
D 8 PL
S A
S
DIM
A
B
C
D
G
J
K
M
N
S
V
W
DETAIL X
S
W
V
PIN 1
IDENTIFIER
C
--T-K
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.026
0.034
0.100 BSC
0.009
0.011
0.100
0.120
0_
15 _
0.444
0.448
0.540
0.560
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.66
0.864
2.54 BSC
0.23
0.28
2.54
3.05
0_
15 _
11.28
11.38
13.72
14.22
6.22
6.48
2.92
3.17
SEATING
PLANE
M
J
DETAIL X
CASE 482C--03
ISSUE B
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SUPER SMALL OUTLINE PACKAGE DIMENSIONS
2X
0.006 C A B
0.420
0.400
0.050
0.025
0.300
0.280
3
NOTES:
1. ALL DIMENSIONS ARE IN INCHES.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M--1994.
3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS. MOLD FLASH OR PROTRUSIONS
SHALL NOT EXCEED .006 INCHES PER SIDE.
4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.
5. DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE .008 INCHES MAXIMUM.
0.019
5
0.014
0.004 M C A B
Freescale Semiconductor, Inc...
8X
A
B
3
0.300
0.280
0.298
0.278
0.165
0.145
0.010
0.002
0.004
DETAIL E
C
.010
GAGE
PLANE
0.023
0.013
10°
0°
DETAIL E
SEATING
PLANE
CASE 1317--03
ISSUE B
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SUPER SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
2X
0.006 C A B
0.420
0.400
NOTES:
1. ALL DIMENSIONS ARE IN INCHES.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M--1994.
3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS. MOLD FLASH OR PROTRUSIONS
SHALL NOT EXCEED .006 INCHES PER SIDE.
4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.
5. DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE .008 INCHES MAXIMUM.
0.050
0.025
0.345
0.325
Freescale Semiconductor, Inc...
8X
A
0.345
0.325
B
0.018
0.014
0.004
M
5
C A B
.014
GAGE
PLANE
0.010
0.002
0.048
0.038
10°
0°
DETAIL E
0.130
0.110
0.200
0.180
0.300
0.280
0.390
0.370
3
0.004
A
DETAIL E
C
B
3
SEATING
PLANE
0.300
0.280
BOTTOM VIEW
CASE 1317A--01
ISSUE A
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