FREESCALE MPX4250AP

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Freescale Semiconductor
Technical Data
MPX4250A
Rev 6, 12/2006
Integrated Silicon Pressure Sensor
Manifold Absolute Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPX4250A/MPXA4250A series Manifold Absolute Pressure (MAP)
sensor for engine control is designed to sense absolute air pressure within the
intake manifold. This measurement can be used to compute the amount of fuel
required for each cylinder.
The MPX4250A/MPXA4250A series piezoresistive transducer is a state-ofthe-art monolithic silicon pressure sensor designed for a wide range of
applications, particularly those employing a microcontroller or microprocessor
with A/D inputs. This transducer combines advanced micromachining
techniques, thin-film metallization and bipolar processing to provide an accurate,
high-level analog output signal that is proportional to the applied pressure. The
small form factor and high reliability of on-chip integration make the Freescale
sensor a logical and economical choice for the automotive system engineer.
Features
•
•
•
•
•
•
•
1.5% Maximum Error Over 0° to 85°C
Specifically Designed for Intake Manifold Absolute Pressure Sensing in
Engine Control Systems
Patented Silicon Shear Stress Strain Gauge
Temperature Compensated Over -40° to +125°C
Offers Reduction in Weight and Volume Compared to Existing Hybrid
Modules
Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface
Mount Package
Ideal for Non-Automotive Applications
MPX4250A
MPXA4250A
SERIES
INTEGRATED
PRESSURE SENSOR
20 TO 250 kPA (2.9 TO 36.3 psi)
0.2 TO 4.9 V OUTPUT
SMALL OUTLINE PACKAGES
MPXA4250A6U/6T1
CASE 482-01
SMALL OUTLINE PACKAGE
PIN NUMBERS
1
N/C(1), (2)
2
VS
3
GND
4
VOUT
5(2)
N/C
6
(2)
N/C
7
(2)
N/C
8
N/C
1. Pin 1 in noted by the notch in the lead.
2. Pins 1, 5, 6, and 7 are internal device
connections. Do not connect to external
circuitry or ground.
Typical Applications
•
•
MPXA4250AC6U/C6T1
CASE 482A-01
UNIBODY PACKAGES
Turbo Boost Engine Control
Ideally Suited for Microprocessor or Microcontroller-Based Systems
ORDERING INFORMATION
Device
Type
Options
Case No.
MPX Series
Order Number
Packing
Options
Device
Marking
SMALL OUTLINE PACKAGE(1) (MPXA4250A SERIES)
Basic
Absolute, Element Only
Elements
Ported
Absolute, Axial Port
Elements
UNIBODY PACKAGE
(2)
MPXA4250A6U
Rails
MPXA4250A
482
MPXA4250A6T1
Tape & Reel
MPXA4250A
482A
MPXA4250AC6U
Rails
MPXA4250A
482A
MPXA4250AC6T1
Tape & Reel
MPXA4250A
867
867B
MPX4250AP
CASE 867B-04
UNIBODY PACKAGE PIN NUMBERS
(MPX4250A SERIES)
Basic
Absolute, Element Only
Element
Ported
Absolute, Ported
Elements
482
MPX4250A
CASE 867-08
MPX4250A
—
MPX4250A
1
VOUT(1)
4
N/C(2)
MPX4250AP
—
MPX4250AP
2
GND
5
N/C(2)
3
VS
6
N/C(2)
1. The MPXA4250A series pressure sensors are available in the basic element package
or with pressure port fitting. Two packing options are offered for each type.
2. The MPX4250A series pressure sensors are available in the basic element package
or with pressure port fittings providing mounting ease and barbed hose connections.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
1. Pin 1 in noted by the notch in the lead.
2. Pins 4, 5, and 6 are internal device
connections. Do not connect to external
circuitry or ground.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
Pins 4, 5, and 6 are NO CONNECTS for unibody Device
Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure(2) (P1 > P2)
PMAX
1000
kPa
Storage Temperature
TSTG
-40 to +125
°C
TA
-40 to +125
°C
Operating Temperature
1. TC = 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX4250A
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 VDC, TA = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in
Figure 3 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Units
POP
20
—
250
kPa
Supply Voltage(2)
VS
4.85
5.1
5.35
VDC
Supply Current
IO
—
7.0
10
mAdc
Differential Pressure Range(1)
Minimum Pressure Offset(3)
@ VS = 5.1 Volts
(0 to 85°C)
VOFF
0.133
0.204
0.264
VDC
Full Scale Output(4)
@ VS = 5.1 Volts
(0 to 85°C)
VFSO
4.826
4.896
4.966
VDC
Full Scale Span(5)
@ VS = 5.1 Volts
(0 to 85°C)
VFSS
—
4.692
—
VDC
Accuracy(6)
(0 to 85°C)
—
—
—
±1.5
%VFSS
∆V/∆Ρ
—
20
—
mV/kPa
tR
—
1.0
—
msec
Output Source Current at Full Scale Output
IO +
—
0.1
—
mAdc
Warm-Up Time(8)
—
—
20
—
msec
Offset Stability(9)
—
—
±0.5
—
%VFSS
Sensitivity
Response Time(7)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
•
•
•
•
•
Output deviation at any temperature from a straight line relationship with pressure over the specified pressure
range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected
to a specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. Mechanical Characteristics
Characteristics
Typ
Unit
Weight, Basic Element (Case 867)
4.0
Grams
Weight, Small Outline Package (Case 482)
1.5
Grams
MPX4250A
Sensors
Freescale Semiconductor
3
+5 V
FloroSilicone
Die Coat
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Vout
Epoxy
Case
OUTPUT
Vs
IPS
Lead Frame
RTV Die
Bond
P2
1.0 µF
GND
0.01 µF
470 pF
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram (Not to Scale)
Figure 2 illustrates the absolute pressure sensing chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX4250A/MPXA4250A series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability.
Figure 3. Recommended Power Supply Decoupling and
Output Filtering
(For additional output filtering, please refer to Application
Note AN1646.
Contact the factory for information regarding media
compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over temperature range of 0°
to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
5.0
4.5
4.0
Output (Volts)
3.5
MAX
Transfer Function:
VOUT = Vs* (0.004 x P-0.04) ± Error
VS = 5.1 Vdc
TEMP = 0 to 85°C
TYP
3.0
2.5
2.0
1.5
1.0
MIN
0.5
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output vs. Absolute Pressure
MPX4250A
4
Sensors
Freescale Semiconductor
Transfer Function
Nominal Transfer Value:
VOUT = VS (P × 0.004 - 0.04)
± (Pressure Error × Temp. Factor × 0.004 × VS)
VS = 5.1 V ± 0.25 VDC
Temperature Error Band
4.0
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
- 40
0 to 85
+125
3
1
3
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in C°
NOTE: The Temperature Multiplier is a linear response from 0× to -40°C and from 85° to 125°C.
Pressure Error Band
5.0
4.0
Pressure
Error
(kPa)
3.0
2.0
1.0
0
-1.0
-2.0
-3.0
-4.0
-5.0
0
25
50
75 100 125 150 175 200 225 250
Pressure
(kPa)
Pressure
20 to 250 kPa
Error (Max)
±3.45 (kPa)
MPX4250A
Sensors
Freescale Semiconductor
5
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
solder reflow process. It is always recommended to design
design. The footprint for the surface mount packages must be
boards with a solder mask layer to avoid bridging and
the correct size to ensure proper solder connection interface
shorting between solder pads.
between the board and the package. With the correct
Footprint, the packages will self align when subjected to a
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
MPX4250A
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
M
T B
A
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
N
H
C
J
-TSEATING
PLANE
PIN 1 IDENTIFIER
K
M
DIM
A
B
C
D
G
H
J
K
M
N
S
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
10.29
10.54
18.01
18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX4250A
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
C
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
M
T A
M
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.027
0.033
0.68
0.84
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
UNIBODY PACKAGE
MPX4250A
8
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
MPX4250A
Sensors
Freescale Semiconductor
9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
MPX4250A
10
Sensors
Freescale Semiconductor
NOTES
MPX4250A
Sensors
Freescale Semiconductor
11
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MPX4250A
Rev. 6
12/2006
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