Pressure Freescale Semiconductor Document Number: MPXV6115V Rev 2, 10/2012 Data Sheet: Technical Information High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV6115V series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer. The MPXV6115V series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXV6115V Series -115 to 0 kPa (-16.7 to 2.2 psi) 0.2 to 4.6 V Output Application Examples • Vacuum Pump Monitoring • Brake Booster Monitoring Features • • • • • Improved Accuracy at High Temperature 1.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package ORDERING INFORMATION Package Case Device Name Options No. Small Outline Package (MPXV6115VC6U Series) None # of Ports Single MPXV6115V6U Rail 482 • MPXV6115V6T1 Tape and Reel 482 • MPXV6115VC6U Rail 482A • MPXV6115VC6T1 Tape and Reel 482A • Dual Gauge Pressure Type Differential Absolute Vacuum/ Gauge Vacuum/ Gauge Vacuum/ Gauge Vacuum/ Gauge SMALL OUTLINE PACKAGE MPXV6115V6U/T1 CASE 482 © 2009-2012 Freescale Semiconductor, Inc. All rights reserved. MPXV6115VC6U/T1 CASE 482A Device Marking MPXV6115V MPXV6115V MPXV6115V MPXV6115V Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range POP -115 — 0 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Full Scale Output(2) @ VS = 5.0 Volts (0 to 85°C) VFSO 4.534 4.6 4.665 Vdc Full Scale Span(3) @ VS = 5.0 Volts (0 to 85°C) VFSS — 4.4 — Vdc Accuracy(4) (0 to 85°C) — — — ±1.5 %VFSS Sensitivity V/P — 38.26 — mV/kPa (5) Response Time tR — 1.0 — ms Warm-Up Time(6) — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS 1. Device is ratiometric within this specified excitation range. 2. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MPXV6115V 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg -40 to +125 °C Operating Temperature Output Source Current @ Full Scale Output(2) Output Sink Current @ Minimum Pressure Offset(2) TA -40 to +125 °C I o+ 0.5 mAdc Io - -0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation And Gain Stage #1 Sensing Element GND 3 Gain Stage #2 And Ground Reference Shift Circuitry 4 Vout Pins 4, 5, and 6 are no connects Figure 1. Fully Integrated Pressure Sensor Schematic MPXV6115V Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 482A). Figure 3 shows a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0° to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV6115V series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluorosilicone Gel Die Coat Stainless Steel Cap Die P1 Wire Bond Thermoplastic Case Lead Frame P2 Die Bond Differential Sensing Element Figure 2. Cross Sectional Diagram SOP (not to scale) +5.0 V VS Pin 2 MPXV6115V 100 nF Vout Pin 4 to ADC 47 pF GND Pin 3 51 K Figure 3. Typical Application Circuit (Output Source Current Operation) Transfer Function MPXV6115VC6U 5 4.5 4 Output (Volts) 3.5 3 2.5 Transfer Function: Vout = VS*[(0.007652*P) + 0.92] ± (Pressure error) *Temp Factor*0.007652*VS) VS = 5.0 V ± 0.25 Vdc TEMP = 0-85° C Max 2 Min 1.5 1 0.5 0 -115 -95 -75 -55 Vout vs. Vacuum -35 -15 0 Figure 4. Output vs. Absolute Pressure MPXV6115V 4 Sensors Freescale Semiconductor Pressure Transfer Function (MPXV6115VC6U) Nominal Transfer Value: Vout = VS x (0.007652 x P + 0.92) ± (Pressure Error x Temp. Factor x 0.007652 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXV6115V 4.0 3.0 Temp. Multiplier - 40 0 to 85 125 3 1 2 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 130 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band Error Limits for Pressure 1.950 Pressure Error (kPa) 1.725 1.500 0 -1.500 -115 -100 -85 -45 -30 -15 0 Pressure in kPa (below atmospheric) -1.725 -1.950 Pressure -115 to 0 kPa Error (max) ± 1.725 kPa MPXV6115V Sensors Freescale Semiconductor 5 Pressure Surface Mounting Information MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.100 TYP 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 5. SOP Footprint MPXV6115V 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS –A– D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S –B– G 8 1 S N H C J –T– PIN 1 IDENTIFIER M K SEATING PLANE DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE A SMALL OUTLINE PACKAGE –A– D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 –T– K M PIN 1 IDENTIFIER SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV6115V Sensors Freescale Semiconductor 7 Pressure Table 3. Revision number Revision date 2 10/2012 Description of changes • Added devices MPXB611V6U and MPX6115V6T1 and corresponding package, 482. MPXV6115V 8 Sensors Freescale Semiconductor How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. 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