Revised May 2005 74LCX162374 Low Voltage 16-Bit D-Type Flip-Flop with 5V Tolerant Inputs and Outputs and 26: Series Resistors General Description Features The LCX162374 contains sixteen non-inverting D-type flip-flops with 3-STATE outputs and is intended for bus oriented applications. The device is byte controlled. A buffered clock (CP) and Output Enable (OE) are common to each byte and can be shorted together for full 16-bit operation. ■ 5V tolerant inputs and outputs The LCX162374 is designed for low voltage (2.5V or 3.3V) VCC applications with capability of interfacing to a 5V signal environment. The 26: series resistor in the output helps reduce output overshoot and undershoot. The LCX162374 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining CMOS low power dissipation. ■ Supports live insertion/withdrawal (Note 1) ■ 2.3V–3.6V VCC specifications provided ■ Equivalent 26: series resistor on outputs ■ 7.0 ns tPD max (VCC 3.3V), 20 PA ICC max ■ Power down high impedance inputs and outputs ■ r12 mA output drive (VCC 3.0V) ■ Implements patented noise/EMI reduction circuitry ■ Latch-up performance exceeds 500 mA ■ ESD performance: Human body model ! 2000V Machine model ! 200V ■ Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Note 1: To ensure the high-impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum value or the resistor is determined by the current-sourcing capability of the driver. Ordering Code: Order Number 74LCX162374GX (Note 2) Package Number BGA54A (Preliminary) Package Description 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide [TAPE and REEL] 74LCX162374MEA (Note 3) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LCX162374MTD (Note 3) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Note 2: BGA package available in Tape and Reel only. Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol © 2005 Fairchild Semiconductor Corporation DS500442 www.fairchildsemi.com 74LCX162374 Low Voltage 16-Bit D-Type Flip-Flop with 5V Tolerant Inputs and Outputs and 26: Series Resistors February 2001 74LCX162374 Connection Diagrams Pin Descriptions Pin Assignment for SSOP and TSSOP Pin Names Description OEn Output Enable Input (Active LOW) CPn Clock Pulse Input I0–I15 Inputs O0–O15 Outputs NC No Connect FBGA Pin Assignments 1 2 3 4 5 6 A O0 NC OE1 CP1 NC I0 B O2 O1 NC NC I1 I2 C O4 O3 VCC VCC I3 I4 D O6 O5 GND GND I5 I6 E O8 O7 GND GND I7 I8 F O10 O9 GND GND I9 I10 I12 G O12 O11 VCC VCC I11 H O14 O13 NC NC I13 I14 J O15 NC OE2 CP2 NC I15 Truth Tables Pin Assignment for FBGA Inputs Outputs OE1 I0–I7 O0–O7 L H H L L L L L X O0 X H X Z CP1 Inputs CP2 (Top Thru View) H L X Z O0 www.fairchildsemi.com 2 Outputs OE2 I8–I15 O8–O15 L H H L L L L L X O0 X H X Z HIGH Voltage Level LOW Voltage Level Immaterial High Impedance Previous O0 before HIGH-to-LOW of CP the state of their individual D inputs that meet the setup and hold time requirements on the LOW-to-HIGH Clock (CPn) transition. With the Output Enable (OEn) LOW, the contents of the flip-flops are available at the outputs. When OEn is HIGH, the outputs go to the high impedance state. Operation of the OEn input does not affect the state of the flip-flops. The LCX162374 consists of sixteen edge-triggered flip-flops with individual D-type inputs and 3-STATE true outputs. The device is byte controlled with each byte functioning identically, but independent of the other. The control pins can be shorted together to obtain full 16-bit operation. Each byte has a buffered clock and buffered Output Enable common to all flip-flops within that byte. The description which follows applies to each byte. Each flip-flop will store Logic Diagrams Byte 1 (0:7) Byte 2 (8:15) Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. 3 www.fairchildsemi.com 74LCX162374 Functional Description 74LCX162374 Absolute Maximum Ratings(Note 4) Symbol Parameter VCC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current Value IO DC Output Source/Sink Current ICC DC Supply Current per Supply Pin IGND DC Ground Current per Ground Pin TSTG Storage Temperature Conditions 0.5 to 7.0 0.5 to 7.0 0.5 to 7.0 0.5 to VCC 0.5 50 50 50 r50 r100 r100 65 to 150 Units V V 3-STATE Output in HIGH or LOW State (Note 5) VI GND V mA VO GND mA VO ! VCC mA mA mA qC Recommended Operating Conditions (Note 6) Symbol VCC Parameter VI Input Voltage VO Output Voltage IOH/IOL Min Max Operating 2.0 3.6 Data Retention 1.5 3.6 Supply Voltage Output Current TA Free-Air Operating Temperature 't/'V Input Edge Rate, VIN 0.8V–2.0V, VCC 0 5.5 HIGH or LOW State 0 VCC 3-STATE 0 5.5 VCC 3.0V 3.6V VCC 2.7V 3.0V VCC 2.3V 2.7V 3.0V r12 r8 r4 Units V V V mA 40 85 qC 0 10 ns/V Note 4: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 5: IO Absolute Maximum Rating must be observed. Note 6: Floating or unused control inputs must be HIGH or LOW. DC Electrical Characteristics Symbol VIH VIL VOH VOL Parameter Conditions HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage LOW Level Output Voltage TA 40qC to 85qC (V) Min 2.3 2.7 1.7 2.7 3.6 2.0 Max Units V 2.3 2.7 0.7 2.7 3.6 0.8 V IOH 100 PA 2.3 3.6 VCC 0.2 IOH 4 mA 2.3 1.8 IOH 4 mA 2.7 2.2 IOH 6 mA 3.0 2.4 IOH 8 mA 2.7 2.0 IOH 12 mA 3.0 2.0 IOL 100 PA 2.3 3.6 0.2 IOL 4 mA 2.3 0.6 IOL 4 mA 2.7 0.4 IOL 6 mA 3.0 0.55 IOL 8 mA 2.7 0.6 IOL 12 mA 3.0 0.8 2.3 3.6 r5.0 PA 2.3 3.6 r5.0 PA II Input Leakage Current 0 d VI d 5.5V IOZ 3-STATE Output Leakage 0 d VO d 5.5V VI www.fairchildsemi.com VCC VIH or VIL 4 V V Symbol (Continued) Parameter VCC Conditions (V) IOFF Power-Off Leakage Current VI or VO ICC Quiescent Supply Current VI 5.5V V CC or GND 3.6V d VI, VO d 5.5V (Note 7) 'ICC Increase in ICC per Input VIH VCC 0.6V 40qC to 85qC TA Min Units Max 0 10 2.3 3.6 20 2.3 3.6 r20 2.3 3.6 500 PA PA PA Note 7: Outputs disabled or 3-STATE only. AC Electrical Characteristics TA Symbol Parameter VCC 50 pF CL Min CL 2.7V 50 pF 500: VCC CL 2.5V r 0.2V Min Max Min Max 1.5 7.0 1.5 7.3 1.5 8.4 CP to On 1.5 7.0 1.5 7.3 1.5 8.4 Output Enable time 1.5 6.9 1.5 7.1 1.5 9.0 1.5 6.9 1.5 7.1 1.5 9.0 1.5 6.0 1.5 6.2 1.5 7.2 1.5 6.0 1.5 6.2 1.5 7.2 Maximum Clock Frequency 170 tPHL Propagation Delay tPLH tPZL tPZH Output Disable Time tPHZ Units 30 pF Max fMAX tPLZ 40q to 85qC, RL 3.3V r 0.3V VCC MHz ns ns ns tS Setup Time 2.5 2.5 3.0 ns tH Hold Time 1.5 1.5 2.0 ns tW Pulse Width 3.0 3.0 3.5 ns tOSHL Output to Output Skew (Note 8) 1.0 ns 1.0 tOSLH Note 8: Skew is defined as the absolute value of the differences between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Parameter guaranteed by design. Dynamic Switching Characteristics Symbol VOLP VOLV Parameter Quiet Output Dynamic Peak VOL Quiet Output Dynamic Valley VOL VCC Conditions TA 25qC (V) Typical CL 50 pF, VIH 3.3V, VIL 0V 3.3 0.35 CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.25 CL 50 pF, VIH 3.3V, VIL 0V 3.3 0.35 CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.25 Units V V Capacitance Symbol Parameter Conditions CIN Input Capacitance VCC Open, VI COUT Output Capacitance VCC 3.3V, VI 0V or VCC CPD Power Dissipation Capacitance VCC 3.3V, VI 0V or VCC, f 5 0V or VCC 10 MHz Typical Units 7 pF 8 pF 20 pF www.fairchildsemi.com 74LCX162374 DC Electrical Characteristics 74LCX162374 AC LOADING and WAVEFORMS Generic for LCX Family FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance) Test Switch tPLH, tPHL Open tPZL, tPLZ 6V at VCC 3.3 r 0.3V, and 2.7V VCC x 2 at VCC 2.5 r 0.2V tPZH, tPHZ GND Waveform for Inverting and Non-Inverting Functions 3-STATE Output High Enable and Disable Times for Logic Propagation Delay. Pulse Width and trec Waveforms Setup Time, Hold Time and Recovery Time for Logic trise and tfall 3-STATE Output Low Enable and Disable Times for Logic FIGURE 2. Waveforms (Input Characteristics; f =1MHz, tr = tf = 3ns) Symbol www.fairchildsemi.com VCC 3.3V r 0.3V 2.7V 2.5V r 0.2V Vmi 1.5V 1.5V VCC/2 Vmo 1.5V 1.5V VCC/2 Vx VOL 0.3V VOL 0.3V VOL 0.15V Vy VOH 0.3V VOH 0.3V VOH 0.15V 6 74LCX162374 Schematic Diagram Generic for LCX Family 7 www.fairchildsemi.com 74LCX162374 Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A Preliminary www.fairchildsemi.com 8 74LCX162374 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Package Number MS48A 9 www.fairchildsemi.com 74LCX162374 Low Voltage 16-Bit D-Type Flip-Flop with 5V Tolerant Inputs and Outputs and 26: Series Resistors Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD48 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 10