NL27WZ04 Dual Inverter The NL27WZ04 is a high performance dual inverter operating from a 1.65 V to 5.5 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. • • • • • • • • • Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible – Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7W04 Chip Complexity: FET = 72; Equivalent Gate = 18 http://onsemi.com MARKING DIAGRAMS SC70–6/SC–88/SOT–363 DF SUFFIX CASE 419B 6 1 Pin 1 SOT23–6/TSOP–6/SC59–6 DT SUFFIX CASE 318G 6 6 1 IN A1 OUT Y1 2 5 VCC IN A2 3 4 OUT Y2 M5d Pin 1 1 GND M5d d = Date Code ORDERING INFORMATION Figure 1. Pinout (Top View) See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. IN A1 1 OUT Y1 IN A2 1 OUT Y2 Figure 2. Logic Symbol PIN ASSIGNMENT 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 Semiconductor Components Industries, LLC, 2002 August, 2002 – Rev. 3 FUNCTION TABLE A Input L H Y Output H L 1 Publication Order Number: NL27WZ04/D NL27WZ04 MAXIMUM RATINGS Symbol Characteristics Value Unit –0.5 to +7.0 V –0.5 ≤ VI ≤ +7.0 V –0.5 ≤ VO ≤ 7.0 V VI < GND –50 mA VO < GND –50 mA DC Output Source/Sink Current ±50 mA DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range –65 to +150 °C PD Power Dissipation in Still Air SC–88, TSOP–6 (Note 2) 200 mW JA Thermal resistance SC–88, TSOP–6 (Note 2) 333 °C/W TL Lead temperature, 1 mm from case for 10 s 260 °C TJ Junction temperature under bias +150 °C VESD ESD Withstand Voltage > 2000 > 200 N/A V VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO ICC Output in HIGH or LOW State (Note 1) Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow. 3. Tested to EIA/JESD22–A114–A 4. Tested to EIA/JESD22–A115–A 5. Tested to JESD22–C101–A RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free–Air Temperature t/V Input Transition Rise or Fall Rate Operating Data Retention Only (HIGH or LOW State) VCC = 2.5 V ±0.2 V VCC =3.0 V ±0.3 V VCC =5.0 V ±0.5 V http://onsemi.com 2 Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V –40 +85 °C 0 0 0 20 10 5 ns/V NL27WZ04 DC ELECTRICAL CHARACTERISTICS VCC Symbol VIH VIL VOH Parameter High–Level g e e Input u Voltage o age Low–Level o e e Input u Voltage o age High–Level g Output Voltage g VIN = VIL VOL Condition Low–Level Output Voltage g VIN = VIH IIN Input Leakage Current IOFF Power Off–Output Leakage Current –40°C ≤ TA ≤ 85°C TA = 25°C (V) Min Typ Max Min 1.65 – 1.95 0.75 VCC 0.75 VCC 2.3 to 5.5 0.7 VCC 0.7 VCC Max Unit V 1.65 – 1.95 0.25 VCC 0.25 VCC 2.3 to 5.5 0.3 VCC 0.3 VCC V IOH = –100 A 1.65 to 5.5 VCC – 0.1 VCC VCC – 0.1 IOH = –3 mA 1.65 1.29 1.52 1.29 IOH = –8 mA 2.3 1.9 2.1 1.9 IOH = –12 mA 2.7 2.2 2.4 2.2 IOH = –16 mA 3.0 2.4 2.7 2.4 IOH = –24 mA 3.0 2.3 2.5 2.3 IOH = –32 mA 4.5 3.8 4.0 3.8 IOL = 100 A 1.65 to 5.5 0.1 0.1 IOL = 3 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 VIN = VCC or GND 0 to 5.5 ±0.1 ±1.0 A VOUT = 5.5 V 0 1 10 A V V ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ICC Quiescent Supply Current VIN = VCC or GND 1.65 to 5.5 1 10 A AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 –40°C ≤ TA ≤ 85°C TA = 25°C Symbol tPLH tPHL Parameter Propagation Delay (Fi (Figure 3 and d 4) Condition VCC (V) Min RL = 1 M CL = 15 pF 1.65 1.8 2.3 9.2 1.8 11.0 RL = 1 M CL = 15 pF 1.8 1.8 4.4 7.6 1.8 8.4 RL = 1 M CL = 15 pF 2.5 ± 0.2 1.2 3.0 5.1 1.2 5.6 RL = 1 M CL = 15 pF 3.3 ± 0.3 0.8 2.2 3.4 0.8 3.8 1.2 2.9 4.5 1.2 5.0 0.5 1..8 2.8 0.5 3.1 0.8 2.3 3.6 0.8 4.0 RL = 500 CL = 50 pF RL = 1 M CL = 15 pF 5.0 ± 0.5 RL = 500 CL = 50 pF Typ Max Min Max Unit ns CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Input Capacitance CPD Power Dissipation Capacitance (Note 6) Condition Typical Unit VCC = 5.5 V, VI = 0 V or VCC 2.5 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no–load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ04 VCC VCC A 50% GND tPLH Y PULSE GENERATOR tPHL DUT RT 50% VCC PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns CL RL RT = ZOUT of pulse generator (typically 50 ) Figure 4. Test Circuit Figure 3. Switching Waveforms DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator No. of Gates per Package Temp Range Identifier NL27WZ04DFT2 NL 2 NL27WZ04DTT1 NL 2 Device Order Number Technology Device Function Package Suffix Tape & Reel Suffix Package Type (Name/SOT#/ Common Name) Tape and Reel Size 7 WZ 04 DF T2 SC70–6/SC–88 /SOT–363 178 mm (7”) 3000 Unit 7 WZ 04 DT T1 SOT23–6/TSOP–6 /SC59–6 178 mm (7”) 3000 Unit http://onsemi.com 4 NL27WZ04 CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS TAPE LEADER NO COMPONENTS 400 mm MIN DIRECTION OF FEED Figure 5. Tape Ends for Finished Goods TAPE DIMENSIONS mm 4.00 1.50 TYP 4.00 2.00 1.75 3.50 0.50 8.00 0.30 1 1.00 MIN DIRECTION OF FEED Figure 6. SC70–6/SC–88/SOT–363 DFT2 and SOT23–6/TSOP–6/SC59–6 DTT1 Reel Configuration/Orientation http://onsemi.com 5 NL27WZ04 t MAX 1.5 mm MIN (0.06 in) A 13.0 mm 0.2 mm (0.512 in 0.008 in) 50 mm MIN (1.969 in) 20.2 mm MIN (0.795 in) FULL RADIUS G Figure 7. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix A Max G t Max 8 mm T1, T2 178 mm (7 in) 8.4 mm, + 1.5 mm, –0.0 (0.33 in + 0.059 in, –0.00) 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET Figure 8. Reel Winding Direction http://onsemi.com 6 HOLE NL27WZ04 PACKAGE DIMENSIONS SC70–6/SC–88/SOT–363 DF SUFFIX CASE 419B–02 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B-01 OBSOLETE, NEW STANDARD 419B-02. A G 6 5 4 1 2 3 DIM A B C D G H J K N S –B– S D 6 PL 0.2 (0.008) M B M N J C K H ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.9 mm http://onsemi.com 7 0.65 mm 0.65 mm 0.4 mm (min) 0.5 mm (min) INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL27WZ04 PACKAGE DIMENSIONS SOT23–6/TSOP–6/SC59–6 DT SUFFIX CASE 318G–02 ISSUE H A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L 6 S 1 5 4 2 3 B DIM A B C D G H J K L M S D G M J C 0.05 (0.002) K H ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 0.037 0.95 0.074 1.9 0.037 0.95 ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0 10 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0 10 0.0985 0.1181 0.094 2.4 0.039 1.0 0.028 0.7 inches mm ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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