NL17SZ04 Single Inverter The NL17SZ04 is an inverter in two tiny footprint packages. The device performs much as LCX multi−gate products in speed and drive. Features Tiny SOT−353 and SOT−553 Packages 24 mA Sink and Source Output Capability Over−Voltage Tolerant Inputs and Outputs Pin For Pin with NC7SZ04P5X, TC7SZ04FU and TC7SZ04AFE Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation Pb−Free Packages are Available http://onsemi.com MARKING DIAGRAMS 5 5 M • • • • • • • 1 SOT−353/SC70−5/SC−88A DF SUFFIX CASE 419A 1 5 5 L5 M G G 1 NC IN A GND 5 1 VCC L5 M G G SOT−553 XV5 SUFFIX CASE 463B 1 2 4 3 L5 = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. OUT Y Figure 1. Pinout (Top View) PIN ASSIGNMENT IN A 1 OUT Y Figure 2. Logic Symbol Pin Function 1 NC 2 IN A 3 GND 4 OUT Y 5 VCC FUNCTION TABLE A Input Y Output L H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2005 December, 2005 − Rev. 7 1 Publication Order Number: NL17SZ04/D NL17SZ04 MAXIMUM RATINGS Symbol VCC Parameter Value Unit *0.5 to )7.0 V *0.5 v VI v +7.0 V DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO *0.5 v VO v +7.0 V VI < GND *50 mA VO < GND *50 mA DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Supply Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C 260 °C )150 °C SOT−353 (Note 2) SOT−553 350 496 °C/W SOT−353 SOT−553 186 135 mW Output in Higher or Low State (Note 1) TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Class IC Class A N/A Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 3. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 4. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT Operating Data Retention DC Output Voltage TA Operating Temperature Range tr, tf Input Rise and Fall Time (High or Low State) VCC = 2.5 V $ 0.2 V VCC = 3.0 V $ 0.3 V VCC = 5.0 V $ 0.5 V http://onsemi.com 2 Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V −40 +85 °C 0 0 0 20 10 5 ns/V NL17SZ04 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Condition Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL VOL IIN Low−Level Output Voltage VIN = VIH IOH = −100 mA −405C ≤ TA ≤ 855C TA = 255C VCC (V) Typ Max Min Max 0.75 VCC 0.7 VCC V 0.25 VCC 0.3 VCC 0.25 VCC 0.3 VCC VCC − 0.1 VCC VCC − 0.1 1.65 1.29 1.52 1.29 IOH = −8 mA 2.3 1.9 2.1 1.9 IOH = −12 mA 2.7 2.2 2.4 2.2 IOH = −16 mA 3.0 2.4 2.7 2.4 IOH = −24 mA 3.0 2.3 2.5 2.3 IOH = −32 mA 4.5 3.8 4.0 IOL = 100 mA 1.65 to 5.5 0.0 0.1 0.1 IOH = 3 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 0 to 5.5 $1.0 VIN = VCC or GND IOFF Power Off Leakage Current VOUT = 5.5 V or VIN = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND V V 1.65 to 5.5 IOH = −3 mA Input Leakage Current Unit 3.8 V $10.0 mA 0 1 10 mA 1.65 to 5.5 1 10 mA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W −405C ≤ TA ≤ 855C TA = 255C Symbol tPLH tPHL7 Condition VCC (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.65 1.8 2.0 2.0 5.3 4.4 11.4 9.5 2.0 2.0 12.0 10.0 ns RL = 1 MW, CL = 15 pF 2.5 $ 0.2 0.2 3.5 6.5 0.8 7.0 RL = 1 MW, CL = 15 pF 3.3 $ 0.3 0.8 2.1 4.5 0.5 4.7 1.2 2.9 5.5 1.5 5.2 0.5 1.8 3.9 0.5 4.1 0.8 2.4 4.3 0.8 4.5 Parameter Propagation Delay (Figure 3 and 4) RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0 $ 0.5 RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC Typical Unit u2.5 pF 9 11 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL17SZ04 tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% 50% 10% 10% tPHL GND tPLH VOH OUTPUT Y 50% 50% VOL Figure 3. Switching Waveform OUTPUT RL INPUT CL A 1−MHz square input wave is recommended for propagation delay tests. Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† NL17SZ04DFT2 SC−88A/SOT−353/SC70−5 3000 Units / Tape & Reel, 178 mm NL17SZ04DFT2G SC−88A/SOT−353/SC70−5 (Pb−Free) 3000 Units / Tape & Reel, 178 mm NL17SZ04XV5T2 SOT−553* 4000 Units / Tape & Reel, 178 mm NL17SZ04XV5T2G SOT−553* 4000 Units / Tape & Reel, 178 mm Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *All Devices in Package SOT553 are Inherently Pb−Free. http://onsemi.com 4 NL17SZ04 PACKAGE DIMENSIONS SOT−353 DF SUFFIX 5−LEAD PACKAGE CASE 419A−02 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ04 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX 5−LEAD PACKAGE CASE 463B−01 ISSUE B D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 2 E −Y− 3 b e HE DIM A b c D E e L HE c 5 PL 0.08 (0.003) M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 MIN 0.50 0.17 0.08 1.50 1.10 STYLE 1: PIN 1. 2. 3. 4. 5. INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 BASE 1 EMITTER 1/2 BASE 2 COLLECTOR 2 COLLECTOR 1 STYLE 2: PIN 1. 2. 3. 4. 5. MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 CATHODE ANODE CATHODE CATHODE CATHODE SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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