NZF220DFT1 EMI Filter with ESD Protection Features • • • • • • • 2 EMI/RFI Bi−directional “Pi” Low−Pass Filters ESD Protection Meets IEC61000−4−2 Diode Capacitance: 7 − 10 pF Zener/Resistor Line Capacitance: 22 ±20% pF Low Zener Diode Leakage: 1 A Maximum Zener Breakdown Voltage; 6 − 8 V Pb−Free Package is Available http://onsemi.com CIRCUIT DESCRIPTION Pin 4 Pin 5 Benefits • Designed to suppress EMI/RFI Noise in Systems Subjected to • • Electromagnetic Interference Nominal Cutoff Frequency of 220 MHz (per Figure 2) Small Package Size Minimizes Parasitic Inductance, Thus a More “Ideal” Low Pass Filtering Response Pin 3 Pin 2 (GND) Pin 1 Typical Applications • • • • Cellular Phones Communication Systems Computers Portable Products with Input/Output Conductors SC−88A DF SUFFIX CASE 419A MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation (Note 1) 8 × 20 s Pulse PPK 14 W Maximum Junction Temperature TJ 150 °C MARKING DIAGRAM 5 4 NZF D Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Between I/O Pins 1 NZF D 2 3 = Specific Device Code = Date Code ORDERING INFORMATION Package Shipping† NZF220DFT1 SC−88A 3000/Tape & Reel NZF220DFT1G SC−88A (Pb−Free) 3000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2004 July, 2004 − Rev. 7 1 Publication Order Number: NZF220DFT1/D NZF220DFT1 ELECTRICAL CHARACTERISTICS Min Typ Max Unit VZ Symbol Zener Breakdown Voltage, @ IZT = 1 mA Characteristic 6.0 − 8.0 V Ir Zener Leakage Current, @ VR = 3 V N/A − 1.0 A VF Zener Forward Voltage, @ IF = 50 mA N/A − 1.5 V Capacitance Zener Internal Capacitance, @ 0 V Bias 7.0 − 10 pF Capacitance Zener/Resistor Array Line Capacitance 17.6 − 26.4 pF Resistor Resistance 90 − 110 FC (Note 2) Cutoff Frequency − 220 − MHz 2. 50 Source and 50 Lead Termination per Figure 2. Applications Information Suppressing Noise at the Source • Filter all I/O signals leaving the noisy environment • Locate I/O driver circuits close to the connector • Use the longest rise/fall times possible for all digital signals Reducing Noise at the Receiver • Filter all I/O signals entering the unit • Locate the I/O filters as close as possible to the connector Minimizing Noise Coupling • • • • • Use multilayer PCBs to minimize power and ground inductance Keep clock circuits away from the I/O connector Ground planes should be used whenever possible Minimize the loop area for all high speed signals Provide for adequate power decoupling ESD Protection • Locate the suppression devices as close to the I/O connector as possible • Minimize the PCB trace length to the suppression device • Minimize the PCB trace length for the ground return for the suppression device http://onsemi.com 2 NZF220DFT1 FREQUENCY RESPONSE SPECIFICATION TRACKING GENERATOR SPECTRUM ANALYZER 50 TG OUTPUT RF INPUT NZF220DF 50 VG Vin Vout TEST BOARD Test Conditions: Source Impedance = 50 Load Impedance = 50 Input Power = 0 dB NZF220DF Figure 1. Measurement Conditions 0 GAIN (dB) −6.3 −10 −20 OUTPUT 3 dB = 220 MHz −30 −40 −50 1.0 10 100 1000 f, FREQUENCY (MHz) Figure 2. Typical EMI Filter Response (50 Source and 50 Lead Termination) http://onsemi.com 3 3000 NZF220DFT1 OUTLINE DIMENSIONS SC−88A/SOT−323 CASE 419A−02 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 For additional information, please contact your local Sales Representative. NZF220DFT1/D