PHILIPS PH8230

PH8230
N-channel enhancement mode field-effect transistor
M3D748
Rev. 01 — 23 June 2003
Product data
1. Product profile
1.1 Description
N-channel enhancement mode field-effect power transistor in a SOT669 (LFPAK)
package.
Product availability:
PH8230 in SOT669 (LFPAK).
1.2 Features
■ Low thermal resistance
■ Low gate drive current
■ SO8 equivalent area footprint
■ Low on-state resistance.
1.3 Applications
■ DC-to-DC converters
■ Portable appliances
■ Switched mode power supplies
■ Notebook computers.
1.4 Quick reference data
■ VDS ≤ 30 V
■ Ptot ≤ 50 W
■ ID ≤ 30 A
■ RDSon ≤ 8.2 mΩ
2. Pinning information
Table 1:
Pinning - SOT669 (LFPAK), simplified outline and symbol
Pin
Description
1,2,3
source (s)
4
gate (g)
mb
drain (d)
Simplified outline
Symbol
mb
d
g
1
2
Top view
3
4
MBL286
SOT669 (LFPAK)
MBL288
s1 s2 s3
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
3. Limiting values
Table 2:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
Tj = 25 to 150 °C
-
30
V
-
±20
V
VDS
drain-source voltage (DC)
VGS
gate-source voltage (DC)
ID
drain current (DC)
Tmb = 25 °C; VGS = 10 V
-
30
A
IDM
peak drain current
Tmb = 25 °C; pulsed; tp ≤ 10 µs
-
120
A
Ptot
total power dissipation
Tmb = 25 °C
-
50
W
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−55
+150
°C
Source-drain diode
IS
source (diode forward) current (DC) Tmb = 25 °C
-
30
A
ISM
peak source (diode forward) current Tmb = 25 °C; pulsed; tp ≤ 10 µs
-
120
A
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Product data
Rev. 01 — 23 June 2003
2 of 12
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
03ah31
120
03am20
120
Ider
(%)
Pder
(%)
80
80
40
40
0
0
0
50
100
150
200
Tmb (°C)
P tot
P der = ----------------------- × 100%
P
°
0
60
120
Tmb (°C)
ID
I der = ------------------- × 100%
I
°
tot ( 25 C )
D ( 25 C )
Fig 1. Normalized total power dissipation as a
function of mounting base temperature.
Fig 2. Normalized continuous drain current as a
function of mounting base temperature.
03am21
103
ID
(A)
180
RDSon = VDS / ID
102
tp = 100 µ s
10
1 ms
DC
10 ms
100 ms
1
10-1
1
10
VDS (V)
102
Tmb = 25 °C; IDM is single pulse.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Product data
Rev. 01 — 23 June 2003
3 of 12
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
4. Thermal characteristics
Table 3:
Thermal characteristics
Symbol Parameter
Conditions
Min Typ Max Unit
thermal resistance from junction to mounting base
Rth(j-mb)
-
-
2.5
K/W
4.1 Transient thermal impedance
03am22
10
Zth(j-mb)
(K/W)
δ = 0.5
1
0.2
0.1
10-1
0.05
0.02
10-2
single pulse
10-3
10-5
10-4
10-3
10-2
10-1
1
tp (s)
10
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Product data
Rev. 01 — 23 June 2003
4 of 12
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
5. Characteristics
Table 4:
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
ID = 10 mA; VGS = 0 V
30
-
-
V
Static characteristics
V(BR)DSS drain-source breakdown voltage
VGS(th)
gate-source threshold voltage
ID = 1 mA; VDS = VGS
1
1.75
2.5
V
IDSS
drain-source leakage current
VDS = 30 V; VGS = 0 V; Tj = 25 °C
-
0.06
1
µA
IGSS
gate-source leakage current
VGS = ± 16 V; VDS = 0 V
-
0.9
10
µA
RDSon
drain-source on-state resistance
VGS = 10 V; ID = 15 A
-
6.3
8.2
mΩ
VGS = 4.5 V; ID = 15 A
-
10.5
15.3
µΩ
Dynamic characteristics
gfs
forward transconductance
VDS = 10 V; ID = 15 A
27
45
-
S
Qg(tot)
total gate charge
ID = 30 A; VDD = 10 V; VGS = 10 V
-
22
-
nC
Qgs
gate-source charge
-
5
-
nC
Qgd
gate-drain (Miller) charge
-
5
-
nC
Ciss
input capacitance
-
1500 -
pF
Coss
output capacitance
-
400
pF
Crss
reverse transfer capacitance
td(on)
turn-on delay time
tr
VGS = 0 V; VDS = 10 V; f = 1 MHz
-
-
220
-
pF
-
15
-
ns
rise time
-
55
-
ns
td(off)
turn-off delay time
-
48
-
ns
tf
fall time
-
11
-
ns
-
0.85
1.11
V
-
60
-
ns
VDD = 10 V; ID = 15 A; VGS = 10 V; RG = 4.7 Ω
Source-drain (reverse) diode
VSD
source-drain (diode forward) voltage IS = 30 A; VGS = 0 V
trr
reverse recovery time
IS = 30 A; dIS/dt = −50 A/µs; VGS = 0 V
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Product data
Rev. 01 — 23 June 2003
5 of 12
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
03am23
100
ID
(A)
03am24
80
ID
(A)
VGS = 10 V
4.5 V
75
60
4V
50
40
3.5 V
25
20
3V
150 °C
25 °C
0
0
0
2
4
6
VDS (V)
Tj = 25 °C
1.5
3
VGS (V)
4.5
Tj = 25 °C and 150 °C; VDS > ID x RDSon
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values.
03am25
50
RDSon
(mΩ)
0
3V
03am26
1.8
3.5 V
40
Fig 6. Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
a
1.2
30
4V
20
0.6
10
4.5 V
10 V
0
0
20
40
ID (A)
60
Tj = 25 °C
0
-100
100
Tj (°C)
200
R DSon
a = ---------------------------R DSon ( 25 °C )
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values.
Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Product data
0
Rev. 01 — 23 June 2003
6 of 12
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
03am27
2.5
03am28
10-1
VGS(th)
(V)
2
ID
(A)
10-2
1.5
10-3
min
typ
max
1
10-4
0.5
0
-100
10-5
0
100
Tj (°C)
200
0
1
2
3
VGS (V)
Tj = 25 °C
ID = 1 mA; VDS = VGS
Fig 9. Gate-source threshold voltage as a function of
junction temperature.
03am29
104
Fig 10. Sub-threshold drain current as a function of
gate-source voltage.
03am30
80
IS
(A)
C
(pF)
60
Ciss
103
40
150 °C
Tj = 25 °C
20
Coss
Crss
102
10-1
0
1
10
VDS (V)
102
0
1
VSD (V)
1.5
Tj = 25 °C and 150 °C; VGS = 0 V
VGS = 0 V; f = 1 MHz
Fig 11. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values.
Fig 12. Source (diode forward) current as a function of
source-drain (diode forward) voltage; typical
values.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Product data
0.5
Rev. 01 — 23 June 2003
7 of 12
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
03am31
10
VGS
(V)
8
6
4
2
0
0
10
20
QG (nC)
30
Tj = 25 °C; ID = 30 A; VDD = 10 V
Fig 13. Gate-source voltage as a function of gate charge; typical values.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Product data
Rev. 01 — 23 June 2003
8 of 12
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
6. Package outline
Plastic single-ended surface mounted package (Philips version LFPAK); 4 leads
A2
A
E
SOT669
C
c2
b2
L1
E1
mounting
base
D1
D
H
L2
1
2
3
4
X
e
w M A
b
c
1/2 e
A
(A 3)
A1
C
θ
L
detail X
0
2.5
y C
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
A2
A3
b
b2
c
c2
D(1)
D1(1)
max
E(1)
E1(1)
e
H
L
L1
L2
w
y
θ
mm
1.20
1.01
0.15
0.00
1.10
0.95
0.25
0.50
0.35
4.41
3.62
0.25
0.19
0.30
0.24
4.10
3.80
4.20
5.0
4.8
3.3
3.1
1.27
6.2
5.8
0.85
0.40
1.3
0.8
1.3
0.8
0.25
0.1
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT669
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-07-10
03-02-05
MO-235
Fig 14. SOT669 (LFPAK).
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Product data
Rev. 01 — 23 June 2003
9 of 12
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
7. Revision history
Table 5:
Revision history
Rev Date
01
20030623
CPCN
Description
-
Product data (9397 750 11118)
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Product data
Rev. 01 — 23 June 2003
10 of 12
PH8230
Philips Semiconductors
N-channel enhancement mode field-effect transistor
8. Data sheet status
Level
Data sheet status[1]
Product status[2][3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
9. Definitions
10. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: [email protected].
Product data
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11118
Rev. 01 — 23 June 2003
11 of 12
Philips Semiconductors
PH8230
N-channel enhancement mode field-effect transistor
Contents
1
1.1
1.2
1.3
1.4
2
3
4
4.1
5
6
7
8
9
10
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Transient thermal impedance . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
© Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 23 June 2003
Document order number: 9397 750 11118