E2801/E2801LF GR-253-Core SMC (SONET minimum clock) and ITU G.813 Option 2 Minature Surface Mount TCXO Nominal Frequency, Fo ■ 20.0MHz Supply Voltage ■ 3.3V ±5% Marking (laser) ■ Manufacturers ID (CMAC) ■ Manufacturers identifier (xx) ■ Pad 1 / Static Sensitivity Identifier (∆) ■ Abbreviated Part Number (2801) ■ Oscillator’s Date of Manufacture (YW) CMAC xx ∆2801 YW Input Current ■ < 6mA Output ■ Type : HCMOS ■ Load : 15pF max ■ Vol : < 0.1 Vs ■ Voh : > 0.9 Vs ■ Duty Cycle @ 50%: 45% to 55% ■ Rise Time, 10% to 90%: <8ns ■ Fall Time, 90% to 10%:<8ns SEMTECH APPROVED PRODUCTS Holdover Stability < ±4.6ppm Incl. ■ Temperature, -40 to 85°C: ■ Supply Voltage, 3.3V ± 5% ■ Ageing 24 hours: < ±0.5ppm, equivalent to <±5.8x10-12/sec Free-Run Accuracy < ±20.0ppm ref.Fo Incl. ■ Calibration @ 25°C, ■ Temperature -40 to 85°C ■ Supply Voltage 3.3V ±5%, ■ Load 15pF ±10% ■ Reflow Soldering and Ageing 20 years Phase Noise ■ 10Hz < -85dBc/Hz ■ 100Hz <-110dBc/Hz ■ 1kHz <-125dBc/Hz ■ >10kHz <-135dBc/Hz Tri-state Pad 8 open circuit or >0.6Vs : Output Enabled ■ Pad 8 < 0.2Vs : Output in tri-state mode ■ When in tri-state, the output stage is disabled but the oscillator and compensation circuit are still active, (Current consumption < 1mA) ■ Note: Production parts will be marked in this format. Sample marking may vary. Environmental Specification Storage Temperature Range: -55 to 125°C ■ ■ ■ Vibration: IEC 60068-2-6 Test Fc Procedure B4, 10-60Hz 1.5mm displacement, at 98.1 m/s2, 30 minutes in each of three mutually perpendicular axes at 1 octave per minute. Shock: IEC 60068-2-27 Test Ea, 980m/s2 acceleration for 6ms duration, 3 shocks in each direction along three mutually perpendicular axes. ■ Solderability: MIL-STD-202, Method 208, Catergory 3. Resistance to Soldering heat: 260°C / 10 seconds exposure ■ RoHS/Soldering: Parts with the suffix ‘LF’ on the part number are fully compliant with the European Union directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Note: The RoHS compiant parts are suitable for assembly using both Lead-free solders (see Lead-free Reflow soldering profile) and Tin/Lead solders (see Tin/Lead Reflow soldering profile). ZALINK APPROVED PRODUCTS ISSUE 2 ; 13 JUNE 2005 Outline in mm 10 4 1 2 3 2.0 max 1.0±0.20 5.0±0.15 0.8 2.54 2.54 0.6 7.0±0.15 Pad Connections 1.Do not connect 2.N/C 3.Do not connect 4.GND 5.Output 6.N/C 7.N/C 8.Tri-state Control* 9.Supply, +Vs 10.Do not connect, or connect to GND *Leave unconnected if not required 1.50±0.20 9 8 7 6 5 0.6 2.0 Lead Free Reflow Soldering Profile * 300 Time above 217°C: 60 to 150 secs Time 25°C to Peak Temp: 480 sec max Peak Temp +0 260°C -5 °C 20 to 40 sec o ld n, w 60 to 180 seconds ax 3° C/ se c cm se C/ 6° m ax 150°C to 200°C 100 SEMTECH APPROVED PRODUCTS o Co 200 50 Tin / Lead Reflow Soldering Profile * 300 Time above 183°C: 60 to 150 secs Time 25°C to Peak Temp: 360 sec max Peak Temp +0 240°C -5 °C 10 to 30 sec *Note: o Co 200 ax m ax 3° C/ se c cm se C/ 6° 50 n, w 100 60 to 120 seconds o ld 100°C to 150°C These profiles were used during the qualification testing of the product and therefore represent worst case conditions. They are not recommended for use by the customer in the actual assembly of these parts