FPF1039 Low On-Resistance, Slew-Rate-Controlled Load Switch Features Description The FPF1039 advanced load-management switch target applications requiring a highly integrated solution for disconnecting loads powered from DC power rail (<6 V) with stringent shutdown current targets and high load capacitances (up to 200 µF). The FPF1039 consists of slew-rate controlled low-impedance MOSFET switch (21 mΩ typical) and other integrated analog features. The slew-rate controlled turn-on characteristic prevents inrush current and the resulting excessive voltage droop on power rails. 1.2 V to 5.5 V Input Voltage Operating Range Typical RON: 20 mΩ at VIN=5.5 V 21 mΩ at VIN=4.5 V 37 mΩ at VIN=1.8 V 75 mΩ at VIN=1.2 V Slew Rate / Inrush Control with tR: 2.7 ms (Typical) This device has exceptionally low shutdown current drain (<1 µA maximum) that facilitates compliance in low standby power applications. The input voltage range operates from 1.2 V to 5.5 V DC to support a wide range of applications in consumer, optical, medical, storage, portable, and industrial device power management. 3 A Maximum Continuous Current Capability Output Capacitor Discharge Function Low <1 µA Shutdown Current ESD Protected: Above 8 kV HBM, 1.5 kV CDM GPIO / CMOS-Compatible Enable Circuitry Switch control is managed by a logic input (active HIGH) capable of interfacing directly with low-voltage control signal / GPIO with no external pull-up required. The device is packaged in advanced fully “green” 1mm x1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP); providing excellent thermal conductivity, small footprint, and low electrical resistance for wider application usage. Applications HDD, Storage, and Solid-State Memory Devices Portable Media Devices, UMPC, Tablets, MIDs Wireless LAN Cards and Modules SLR Digital Cameras Portable Medical Devices GPS and Navigation Equipment Industrial Handheld and Enterprise Equipment Ordering Information Part Number Top Mark Switch RON (Typical) at 4.5 VIN Input Buffer Output Discharge FPF1039UCX QF 21mΩ CMOS 65Ω Active HIGH 2.7 ms 65Ω 6-Bump, WLCSP with Backside Laminate, Active HIGH 2.7 ms 1.0 mm x 1.5 mm, 0.5 mm Pitch FPF1039BUCX QF 21mΩ © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.0.6 CMOS ON Pin Activity tR Package 6-Bump, WLCSP, 1.0 mm x 1.5 mm, 0.5 mm Pitch www.fairchildsemi.com FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch February 2013 0.03 C E 2X F A (Ø0.350) SOLDER MASK OPENING B (Ø0.250) Cu Pad A1 (1.00) BALL A1 INDEX AREA D (0.50) 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.625 0.539 0.05 C C 0.332±0.018 0.250±0.025 E SEATING PLANE D SIDE VIEWS NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 Ø0.315 +/- .025 6X 0.50 C 1.00 B A 0.50 (Y) ±0.018 1 2 F (X) ±0.018 BOTTOM VIEW Figure 35. C A B B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS ±43 MICRONS (539-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILNAME: MKT-UC006AFrev2. 6 Ball, 1.0 x 1.5mm Wafer-Level Chip-Scale Packaging (WLCSP) Nominal Values Bump Pitch Overall Package Height Silicon Thickness Solder Bump Height Solder Bump Diameter 0.5 mm 0.582 mm 0.332 mm 0.250 mm 0.315 mm Product-Specific Dimensions Product D E X Y FPF1039UCX 1. 5mm ±0.03 1.0mm ±0.03 0.240 mm 0.240 mm FPF1039BUCX 1. 5mm ±0.03 1.0mm ±0.03 0.240 mm 0.240 mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.0.6 www.fairchildsemi.com 12 FPF1039 — Advance Load Management Switch Management Switch Advance Load Management Switch Physical Dimensions FPF1039 — Advance Load Management Switch Management Switch Advance Load Management Switch 13 www.fairchildsemi.com © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.0.6