STMICROELECTRONICS 7003

STB7003
TRI-BAND GSM/DCS/PCS LNA
• SUPPLY VOLTAGE 2.8V
• LOW CURRENT CONSUMPTION
• VERY LOW NOISE FIGURE:
NF=1.5dB @ 950MHz
NF=1.9dB @ 1850MHz
NF=2dB @ 1950MHz
• DIGITAL GAIN CONTROL
MSOP10-EP
(exposed pad)
ORDER CODE
STB7003
BRANDING
7003
APPLICATIONS
TRI-BAND GSM/DCS/PCS FRONT-ENDS
FUNCTIONAL BLOCK DIAGRAM
PD
GC
LNA1
AI1
AO1
BIAS
DESCRIPTION
The STB7003 is a tri-band LNA designed for GSM/DCS/
PCS applications. The GC pin sets the LNA gain levels.
The innovative architecture implemented allows to
reach very low current consumption. LNA1 works at
0.9-1.0 GHz and LNA2 over the 1.8-2GHz frequency
range.
GND
VccGSM
LNA2
AI2
AO2
VccDCS
BSW
ABSOLUTE MAXIMUM RATING
Symbol
Vcc
Parameter
Supply voltage
Value
Unit
4.5
Tj
Junction temperature
150
Tstg
Storage temperature
-40 to +85
V
o
C
°C
THERMAL DATA
Symbol
Rth(j-a)
Parameter
Thermal resistance junction-ambient
January, 22 2002
Value
TBD
Unit
o
C/W
1/9
STB7003
ELECTRICAL CHARACTERISTICS (Vcc = 2.8V, Tamb= 25 oC)
Symbol
Parameter
Vcc
Supply voltage
IPD
Sleep supply current
Test conditions
Min.
Typ.
2.7
Max.
Unit
3.3
V
5
uA
LNA1 @ 950MHz
Icc
Supply current
4.5
mA
-1
16
dB
G
Power gain
Gp1(1)
Gp2(1)
NF
Noise figure
Gp1
Gp2
5.5
1.5
dB
P1dB
Input 1 dB compr.
power
Gp1
Gp2
-19
-21
dBm
IIP3
Input third order
intercept
-10.8
-12.6
dBm
Gp1(2)
Gp2(2)
VSWRi
Input VSWR
2:1
VSWRo
Output VSWR
2:1
LNA2 @ 1850MHz
Icc
Supply current
7.3
mA
-4
14.7
dB
G
Power gain
Gp1(1)
Gp2(1)
NF
Noise figure
Gp1
Gp2
9.6
1.9
dB
P1dB
Input 1 dB compr.
power
Gp1
Gp2
-11.5
-13.1
dBm
IIP3
Input third order
intercept
-1.4
-3.5
dBm
VSWRi
Input VSWR
2:1
VSWRo
Output VSWR
2:1
Gp1(3)
Gp2(3)
LNA2 @ 1950MHz
Icc
Supply current
7.3
mA
-4.5
14.7
dB
G
Power gain
Gp1(1)
Gp2(1)
NF
Noise figure
Gp1
Gp2
9.8
2
dB
P1dB
Input 1 dB compr.
power
Gp1
Gp2
-10.8
-12.6
dBm
IIP3
Input third order
intercept
-1.5
-3.7
dBm
Gp1(4)
Gp2(4)
VSWRi
Input VSWR
2:1
VSWRo
Output VSWR
2:1
Note(1) :
Note(2) :
Note(3) :
Note(4) :
2/9
Gp1 min gain, Gp2 max gain.
Measured data with two tones f IN1 = 945 MHz, fIN2 = 945.8 MHz, PIN = - 33 dBm for each tone
Measured data with two tones f IN1 = 1850 MHz, fIN2 = 1850.8 MHz, P IN = - 33 dBm for each tone
Measured data with two tones f IN1 = 1960 MHz, fIN2 = 1960.8 MHz, P IN = - 33 dBm for each tone
STB7003
GAIN SELECTION
BSW
GC
GSM
LNA1
DCS/PCS
LNA2
0
0
High gain
Off
0
1
Low gain
Off
1
0
Off
High gain
1
1
Off
Low gain
PINOUT
Pin Number
Symbol
Description
1
PD
Power down
2
AI1
GSM LNA1 input
3
GND
Ground
4
AI2
DCS/PCSl LNA2 input
5
BSW
Band switch between GSM and DCS/PCS RF output
6
VccDCS
DCS Supply voltage
7
AO2
DCS/PCS LNA2 output
8
VccGSM
GSM/BiAS Supply voltage
9
AO1
GSM LNA1 output
10
GC
LNA1/2 gain control
3/9
STB7003
TYPICAL PERFORMANCE (GSM BAND)
Power Gain vs. Frequency
7
High Gain
Low Gain
6
15
5
10
NF (dB)
S21(Log Mag) (dB)
20
Noise Figure vs. Frequency
5
4
3
Low Gain
0
2
-5
800
820
840
860
880
900
920
940
960
High Gain
1
920
980 1000
930
940
950
960
970
Frequency (MHz)
FREQUENCY (MHz)
Output Return Loss vs. Frequency
Input Return Loss vs. Frequency
0
0
-4
RETURN LOSS
RETURN LOSS (dB)
-2
HIgh Gain
-6
-8
-10
Low Gain
-14
820
840
860 880 900 920
FREQUENCY (MHz)
940
960
980 1000
0
-40
S21(Log Mag) (dB)
-41
HIgh Gain
-43
-44
Low Gain
-45
-46
-47
-48
800
4/9
820
840
High Gain
-15
860 880 900 920 940
FREQUENCY (MHz)
-25
800
Low Gain
820
840
860
880
900
920
FREQUENCY (MHz)
Reverse Isolation vs. Frequency
-42
-10
-20
-12
800
-5
960
980 1000
940
960
980 1000
STB7003
TYPICAL PERFORMANCE (DCS / PCS BAND)
Power Gain vs. Frequency
Noise Figure vs. Frequency
20
High Gain
10
NF (dB)
S21(Log Mag) (dB)
15
5
0
Low Gain
-5
-10
1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000
FREQUENCY (MHz)
High Gain
1850
1900
1950
2000
FREQUENCY (MHz)
0
0
-4
-6
High Gain
-10
-12
-14
Low Gain
-16
RETURN LOSS (dB)
-2
RETURN LOSS
Low Gain
Output Return Loss vs. Frequency
Input Return Loss vs. Frequency
-8
11
10
9
8
7
6
5
4
3
2
1
1800
-2
-4
-6
-8
-10
-18
-20
1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000
FREQUENCY (MHz)
High Gain
Low Gain
-12
1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000
FREQUENCY (MHz)
Reverse Isolation vs. Frequency
-35
S12 (Log Mag) (dB)
-36
-37
-38
-39
High Gain
-40
-41
-42
Low Gain
-43
-44
1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000
FREQUENCY (MHz)
5/9
STB7003
TEST CIRCUIT SCHEMATIC
JP1
VCC
S3
VCC
C14
10n
1
2
C1
4u7
2 HEADER
SW SPDT
C6
10n
S1
VCC
SW SPDT
R1
C2
10n
510
L3
U1
J1
SMA_in900
PD
GC
L1
C3 12n
2p2
J2
L2
AI1
AO1
GND
VCC
AI2
AO2
10n
L4
VCC
110n
C7
C17
STB7003
n/c
C12
n/c
J3
2p
4p
C11
BSW VCClna
2n7
C9
100p
5n1
R2
C4
0.5p
C8
SMA
L6
VCC
0
1n
J4
SMA in1800
VCC
S2
SW SPDT
C10 470p
C5
10n
R3
L5 130
4n3
L7
VCC
C13
33p
1
110n
2
L8
VCC
C15
12p
68n
BILL OF MATERIAL
Used
Part Type
Designator
Footprint
Description
1
12n
L1
0603
COILCRAFT KIT C124-2
1
2n7
L2
0603
COILCRAFT KIT C124-2
1
5n1
L3
0603
COILCRAFT KIT C124-2
2
110n
L4, L7
0603
COILCRAFT KIT C124-2
1
4n3
L5
0603
COILCRAFT KIT C124-2
1
1n
L6
0402
COILCRAFT KIT C128
1
68n
L8
0603
COILCRAFT KIT C124-2
1
1u
C1
TAG A
6
10n
C2, C5, C6
0603
MURATA 0603 KIT
C9, C14
6/9
1
2p2
C3
0603
MURATA 0603 KIT
1
0.5p
C4
0603
MURATA 0603 KIT
1
4p
C7
0603
MURATA 0603 KIT
1
100p
C8
0603
MURATA 0603 KIT
1
470p
C10
0603
MURATA 0603 KIT
2
n/c
C11, C12
0603
1
33p
C13
0603
MURATA 0603 KIT
1
12p
C15
0603
MURATA 0603 KIT
1
2p
C17
0603
MURATA 0603 KIT
1
510
R1
0603
1
0
R2
0603
1
130
R3
0603
SMA
STB7003
EVALUATION BOARD
COMPONENTS PLACEMENT
TOP LAYER
37mm
27mm
PCB CROSS SECTION
Top Layer
0.01 inch/0.25mm
Internal Layer (Ground Layer)
0.02 inch/0.5mm
Layer for mechanical rigidity of PCB
Bottom Layer
7/9
STB7003
MECHNANICAL DATA
8/9
STB7003
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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