STMICROELECTRONICS EMIF01

EMIF01-10018W5
®
Application Specific Discretes
A.S.D.TM
EMI FILTER
INCLUDING ESD PROTECTION
MAIN APPLICATIONS
Where EMI filtering in ESD sensitive equipment is required :
Computers and printers
Communication systems
Mobile phones
MCU Boards
DESCRIPTION
The EMIF01-10018W5 is a highly integrated array
designed to suppress EMI / RFI noise in all systems
subjected to electromagnetic interferences.
Additionally, this filter includes an ESD protection circuitry
which prevents the protected device from destruction when
subjected to ESD surges up to 15 kV.
SOT323-5L
FUNCTIONAL DIAGRAM
BENEFITS
Cost-effectiveness compared to discrete solution
EMI bi-directional low-pass filter
High efficiency in ESD suppression.
High flexibility in the design of high density boards
Very low PCB space consuming : 4.2 mm2 typically
High reliability offered by monolithic integration
I1
O1
GND
I2
O2
COMPLIES WITH THE FOLLOWING STANDARD:
IEC 1000-4-2
15kV
(air discharge)
level 4 8 kV
(contact discharge)
MIL STD 883C - Methode 3015-6 Class 3
Filtering behavior
RI/O = 100Ω
CIN = 180pF
ESD response to IEC1000-4-2 (16 kV air discharge)
dB
0
-10
Vin
-20
-30
Vout
-40
1
10
100
1,000 2,000
f(MHz)
TM : ASD is trademark of STMicroelectronics.
September 1999 - Ed: 1
1/10
EMIF01-10018W5
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C)
Symbol
VPP
Tj
Parameter and test conditions
Value
Unit
ESD discharge IEC1000-4-2, air discharge
ESD discharge IEC1000-4-2, contact discharge
ESD discharge MIL STD 883 Method 3015-6
16
9
25
kV
Junction temperature
150
°C
Top
Operating temperature range
-40 to + 85
°C
Tstg
Storage temperature range
-55 to +150
°C
TL
Lead solder temperature (10 seconds duration)
260
°C
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C)
Symbol
Parameter
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
VCL
Clamping voltage
Rd
Dynamic resistance
IPP
Peak pulse current
RI/O
Series resistance between Input
and Output
CIN
Input capacitance per line
Symbol
Test conditions
VBR
IR = 1 mA
IRM
VRM = 3V
I
VCL VBR
VRM
slope : 1 / R d
Rd
Ipp = 10 A, tp = 2.5 µs (see note 1)
CIN
at 0V bias
IPP
Min.
Typ.
Max.
Unit
6
7
8
V
100
nA
120
Ω
80
RI/O
100
1
Ω
180
pF
Note 1 : to calculate the ESD residual voltage, please refer to the paragraph "ESD PROTECTION" on pages 4 & 5
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V
IRM
IR
EMIF01-10018W5
TECHNICAL INFORMATION
FREQUENCY BEHAVIOR
The EMIF01-10018W5 is firstly designed as an EMI/RFI filter. This low-pass filter is characterized by the following
parameters:
- Cut-off frequency
- Insertion loss
- High frequency rejection
Fig A1: EMIF01-10018W5 frequency response curve.
dB
0
-10
-20
-30
-40
1
10
100
1,000 2,000
f(MHz)
Figure A1 gives these parameters, in particular the signal rejection at the GSM frequency is about
-24dB @ 900MHz
-20dB @ 1800MHz
Fig. A2: Measurement conditions
TRACKING GENERATOR
Vg
SMA
EMIF01
50Ω TG OUT
SPECTRUM ANALYSER
TEST BOARD
SMA
RF IN
50Ω
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EMIF01-10018W5
ESD PROTECTION
In addition to its filtering function, the EMIF01-10018W5 is particularly optimized to perform ESD protection.
ESD protection is based on the use of device which clamps at :
VCL = VBR + Rd.IPP
This protection function is splitted in 2 stages. As shown in figure A3, the ESD strikes are clamped by the first stage S1 and
then its remaining overvoltage is applied to the second stage through the resistor R. Such a configuration makes the output
voltage very low at the Vout level.
Fig. A3: ESD clamping behavior.
Rg
R
Rd
Rd
ESD
Surge Vg
Vin
Rload
Vout
Vbr
Vbr
S2
S1
EMIF01-10018W5
Device to be protected
To have a good approximation of the remaining voltages at both Vin and Vout stages, we provide the typical dynamical
resistance value Rd. By taking into account these following hypothesis : R>>Rd, RG>>Rd and Rload>>Rd, it gives these
formulas:
Vin =
Rg.Vbr+Rd.Vg
Rg
Vout =
R.Vbr+Rd.Vin
R
The results of the calculation done for an IEC 1000-4-2 Level 4 Contact Discharge surge (Vg=8kV, Rg=330Ω) and VBR=7V
(typ.) give:
Vin = 31.2 V
Vout = 7.3 V
This confirms the very low remaining voltage across the device to be protected. It is also important to note that in this
approximation the parasitic inductance effect was not taken into account. This could be few tenths of volts during few ns at
the Vin side. This parasitic effect is not present at the Vout side due the low current involved after the resistance R.
LATCH-UP PHENOMENA
The early ageing and destruction of IC’s is often due to latch-up phenomena which mainly induced by dV/dt. Thanks to
its RC structure, the EMIF01-10018W5 provides a high immunity to latch-up by integration of fast edges. (Please see the
response of EMIF01-10018W5 to a 3 ns edge on Fig. A9)
The measurements done here after show very clearly (Fig. A5a & A5b) the high efficiency of the ESD protection :
- almost no influence of the parasitic inductances on Vout stage
- Vout clamping voltage very close to Vbr
Fig. A4: Measurement conditions
16kV
Air
Discharge
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TEST BOARD
Vin
EMIF01
ESD
SURGE
Vout
EMIF01-10018W5
Fig. A5: Remaining voltage at both stages S1 (Vin) and S2 (Vout) during ESD surge
Vin
Vin
Vout
Vout
a) Positive surge
b) Negative surge
Please note that the EMIF01-10018W5 is not only acting for positive ESD surges but also for negative ones. For negatives
surges, it clamps close to ground voltage as shown in Fig. A5b.
NOTE: DYNAMIC RESISTANCE MEASUREMENT
Fig. A6: Rd measurement current wave
I
IPP
t
2 µs
2.5 µs
2.5 µs duration measurement wave
As the value of the dynamic resistance remains stable for
a surge duration lower than 20µs, the 2.5µs rectangular
surge is well adapted. In addition both rise and fall times
are optimized to avoid any parasitic phenomenon during
the measurement of Rd.
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EMIF01-10018W5
CROSSTALK BEHAVIOR
1- Crosstalk phenomena
Fig. A7: Crosstalk phenomena
RG1
line 1
VG1
α 1VG1 + β12VG2
RL1
RG2
line 2
VG2
α 2VG2 + β21VG1
RL2
DRIVERS
RECEIVERS
The crosstalk phenomena are due to the coupling between 2 lines. The coupling factor ( β12 or β21 ) increases when the
gap across lines decreases, particularly in silicon dice. In the example above the expected signal on load R L2 is α2VG2, in
fact the real voltage at this point has got an extra value β21VG1. This part of the VG1 signal represents the effect of the
crosstalk phenomenon of the line 1 on the line 2. This phenomenon has to be taken into account when the drivers impose
fast digital data or high frequency analog signals in the disturbing line. The perturbed line will be more affected if it works
with low voltage signal or high load impedance (few kΩ). The following chapters give the value of both digital and analog
crosstalk.
2- Digital Crosstalk
Fig. A8: Digital crosstalk measurement
+5V
+5V
74HC04
74HC04
Line 1
Square
Pulse
Generator
5KHz
VG1
+5V
EMIF01
10018W5
Line 2
β21 VG1
Figure A8 shows the measurement circuit used to quantify the crosstalk effect in a classical digital application.
Figure A9 shows that in such a condition signal from 0 to 5V and rise time of few ns, the impact on the disturbed line is less
than 50mV peak to peak. No data disturbance was noted on the concerned line.The measurements performed with falling
edges gives an impact within the same range.
Fig. A9: Digital crosstalk results
VG1
β21VG1
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EMIF01-10018W5
3- Analog Crosstalk
Fig. A10: Analog crosstalk measurement
TRACKING GENERATOR
50Ω TG OUT
SPECTRUM ANALYSER
SMA
TEST BOARD
SMA
RF IN
EMIF01
50Ω
Vg
Fig. A11: Typical analog crosstalk result
dB
0
-20
-40
-60
-80
-100
1
10
100
1,000 2,000
f(MHz)
Figure A10 gives the measurement circuit for the analog application. In figure A11, the curve shows the effect of cell I/O1
on cell I/O2. In usual frequency range of analog signals (up to 100MHz) the effect on disturbed line is less than -42 dB.
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EMIF01-10018W5
4 - PSpice model
Fig. A13: PSpice parameters
Fig. A12: PSpice model of one EMIF01 cell
100Ω
1.2nH
1.2nH
IN
Dz
7
85p
1u
1000
10E-15
100p
1
0.3333
1
0.6
50n
OUT
Dz
Df
Dz
Dr
BV
Cjo
IBV
IKF
IS
ISR
N
M
RS
VJ
TT
Df
Dr
0.38nH
Df
1000
85p
1u
1000
1.016E-15
100p
1.0755
0.3333
1
0.6
50n
Dr
1000
1p
1u
1000
10E-15
100p
0.6
0.3333
1m
0.6
1n
GND
Note: This model is available for an ambient temperature of 27°C
Fig. A14: PSpice simulation : IEC 1000-4-2 Contact Discharge response
a) Positive surge
b) Negative surge
(V)
(V)
60
Vin
50
Vout
40
0
Vin
-10
Vout
-20
30
-30
20
-40
10
-50
0
-60
0
20
40
60
80
100
t(ns)
dB
0
Measure
PSpice
-10
-20
-30
-40
10
100
f(MHz)
8/10
20
40
60
t(ns)
Fig. A15: Comparison between PSpice
simulation and measured frequency response
1
0
1,000 2,000
80
100
EMIF01-10018W5
ORDER CODE
EMIF
01
-
100
18
W5
SOT323-5L package
EMI FILTER
Input capacitance value /10
TYPE
Series resistance value
Order code
Marking
Package
Weight
Base qty
Delivery
mode
EMIF01-10018W5
N12
SOT323-5L
5.4 mg
3000
Tape & reel
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EMIF01-10018W5
PACKAGE MECHANICAL DATA
SOT323-5L
DIMENSIONS
REF.
A
Millimeters
Inches
A2
A1
D
e
e
H
E
Q1
c
Min.
Max.
Min.
Max.
A
0.8
1.1
0.031
0.043
A1
0
0.1
0
0.004
A2
0.8
1
0.031
0.039
b
0.15
0.3
0.006
0.012
c
0.1
0.18
0.004
0.007
D
1.8
2.2
0.071
0.086
E
1.15
1.35
0.045
0.053
e
0.65 Typ.
H
1.8
2.4
0.071
0.094
Q1
0.1
0.4
0.004
0.016
b
RECOMMENDED FOOTPRINT
0.3mm
Mechanical specifications
Lead plating
Tin-lead
1mm
29mm
1mm
Lead plating thickness
5µm min.
25 µm max.
Lead material
Sn / Pb
(70% to 90% Sn)
Lead coplanarity
100µm max.
Body material
Molded epoxy
Flammability
UL94V-0
0.35mm
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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