STMICROELECTRONICS ESDA6V14BC6

ESDA6V1-4BC6
®
Application Specific Discretes
A.S.D.™
QUAD BIDIRECTIONAL TRANSIL
SUPPRESSOR FOR ESD PROTECTION
APPLICATIONS
Where transient overvoltage protection in ESD
sensitive equipment is required, such as :
COMPUTERS
PRINTERS
COMMUNICATION SYSTEMS
VIDEO EQUIPMENT
This device is particularly adapted to the protection
of symmetrical signals.
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SOT23-6L (SC-74)
DESCRIPTION
The ESDA6V1-4BC6 is a monolithic array
designed to protect up to 4 lines in a bidirectional
way against ESD transients.
The device is ideal for situations where board
space is at a premium.
FEATURES
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4 BIDIRECTIONAL TRANSIL FUNCTIONS
ESD PROTECTION FOR DATA, SIGNAL AND
VCC BUS
STAND OFF VOLTAGE RANGE: 5 V
LOW LEAKAGE CURRENT
PEAK PULSE POWER (8/20µs); 80W
CHANNEL SEPARATION: 80dB typ.@20KHz
FUNCTIONAL DIAGRAM
SOT23-6L
1
6
2
5
3
4
BENEFITS
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High ESD protection level
High integration
Suitable for high density boards
COMPLIES WITH THE FOLLOWING STANDARDS:
- IEC61000-4-2: 15 kV (air discharge)
8 kV
(contact discharge)
- MIL STD 883E-Method 3015-7: class3
(human body model)
November 2002 - Ed: 1A
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ESDA6V1-4BC6
1. ESD protection by ESDA6V1-4BC6
With the focus of lowering the operation levels, the problem of malfunction caused by the environment is
critical. Electrostatic discharge (ESD) is a major cause of failure in electronic system.
Transient Voltage Suppressors are an ideal choice for ESD protection and have proven capable in
suppressing ESD events. They are capable of clamping the incoming transient to a low enough level such
that damage to the protected semiconductor is prevented.
Surface mount TVS arrays offer the best choice for minimal lead inductance.
They serve as parallel protection elements, connected between the signal line to ground. As the transient
rises above the operating voltage of the device, the TVS array becomes a low impedance path diverting the
transient current to ground.
Bidirectional protection for 0V biased signals.
CONNECTOR
DRIVER
1
6
2
5
3
4
The ESDA6V1-4BC6 array is the ideal product for use as board level protection of ESD sensitive
semiconductor components.
The tiny SOT23-6L package allows design flexibility in the design of “crowded” boards where the space
saving is at a premium. This enables to shorten the routing and can contribute to improve ESD
performance.
2. Circuit Board Layout
Circuit board layout is a critical design step in the suppression of ESD induced transients. The following
guidelines are recommended :
The ESDA6V1-4BC6 should be placed as near as possible to the input terminals or connectors.
Minimise the path length between the ESD suppressor and the protected device
Minimise all conductive loops, including power and ground loops
The ESD transient return path to ground should be kept as short as possible.
Use ground planes whenever possible.
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ESDA6V1-4BC6
ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)
Symbol
Test conditions
Value
Unit
VPP
ESD discharge - MIL STD 883C - Method 3015-6
IEC61000-4-2 air discharge
IEC61000-4-2 contact discharge
25
15
8
kV
PPP
Peak pulse power (8/20µs)
80
W
Junction temperature
150
°C
-55 to +150
°C
260
°C
-40 to +125
°C
Tj
Tstg
Storage temperature range
TL
Lead solder temperature (10 second duration)
Top
Operating temperature range (note 1)
Note 1: Variation of parameters is given by curves.
ELECTRICAL CHARACTERISTICS (Tamb = 25°C)
Symbol
I
Parameter
VRM
Stand-off voltage
VBR
Breakdown voltage
VCL
Clamping voltage
IRM
Leakage current
IPP
Peak pulse current
C
Capacitance
Rd
Dynamic resistance
VBR
V
I RM
Rd
VBR
min.
Type
V RM
VCL
@
IR
max.
I PP
IRM @ VRM
Rd
αT
C
max.
typ.
max.
typ.
note 1
ESDA6V1-4BC6
0V bias
-4
V
V
mA
µA
V
Ω
10 /°C
pF
6.1
8
1
1
3
0.45
3
45
Note 1 : Square pulse, Ipp = 3A, tp=2.5µs.
Fig. 1: Relative variation of peak pulse power
versus initial junction temperature.
Fig. 2: Peak pulse power versus exponential pulse
duration.
PPP[Tj initial] / PPP[Tj initial=25°C]
PPP(W)
1.1
1000
Tj initial = 25°C
1.0
0.9
0.8
0.7
0.6
100
0.5
0.4
0.3
0.2
0.1
Tj(°C)
tp(µs)
0.0
10
0
25
50
75
100
125
150
1
10
100
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ESDA6V1-4BC6
Fig. 3: Clamping voltage versus peak pulse
current (typical values, rectangular waveform).
Fig. 4: Junction capacitance versus line voltage
applied (typical values).
IPP(A)
C(pF)
100.0
50
F = 1MHz
VOSC = 30mV
Tj = 25°C
45
40
35
10.0
30
25
20
1.0
15
10
tp = 2.5µs
Tj initial = 25°C
VCL(V)
5
0.1
VR(V)
0
0
5
10
15
20
25
30
35
40
45
50
Fig. 5: Relative variation of leakage current versus
junction temperature (typical values).
0
1
2
3
4
5
6
Fig. 6: Analog crosstalk test configuration.
IR[Tj] / IR[Tj=25°C]
100
50Ω
I/O1
unloaded
VG
Port 1
GND
10
50Ω
I/O6
Tj(°C)
1
25
50
75
Symbol
Parameter
αch
Pin topic channel
separation
Port 2
100
125
Conditions
(see note 2)
Values
Min.
Typ.
F = 20 KHz
80
F = 10 MHz
34
Max.
Unit
dB
Note 2 : According to figure 6 schematic.
ORDER CODE
ESDA
6V1
4B
C6
PACKAGE:
C6: SOT23-6L (SC-74)
ESD ARRAY
VBR min.
Bidirectional
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ESDA6V1-4BC6
PACKAGE MECHANICAL DATA
SOT23-6L
A
E
REF.
DIMENSIONS
Millimeters
A2
e
D
b
e
Min.
Typ. Max. Min.
Typ. Max.
A
0.90
1.45 0.035
0.057
A1
0
0.10
0.004
A2
0.90
1.30 0.035
0.0512
b
0.35
0.50 0.0137
0.02
c
0.09
0.20 0.004
0.008
D
2.80
3.00
0.11
0.118
E
1.50
1.75 0.059
0.0689
e
A1
C
θ
FOOTPRINT
0
0.95
0.0374
H
2.60
3.00 0.102
0.118
L
0.10
0.60 0.004
0.024
θ
L
H
Inches
10°
10°
MARKING
1.20
0.047
0.60
0.024
Type
Marking
ESDA6V1-4BC6
BS77
1.10
0.043
2.30
0.090
3.50
0.138
Packaging: Standard packaging is tape and reel.
mm
inch
0.95
0.037
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
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