FAIRCHILD AN-9072

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AN-9072
Smart Power Module Motion-SPM™ in µMini-DIP SPM
Mounting Guidance
Mounting Guidance
This application note shows the electric spacing and
mounting guidance of µMini-DIP SPM.
Electric Spacing
The electric spacing specification of µMini-DIP SPM is
shown in Table 1.
Table 1. Typical Electric Spacing of µMini-DIP SPM
Creepage
Clearance
Distance
[mm]
[mm]
Between Power Terminals
3.08
3.28
Between Control Terminals
2.35
4.95
Between Terminals & Heat Sink
2.05
2.05
Mounting Method and Precautions
When installing a module to a heat sink, excessive uneven
fastening force might apply stress to inside chips, which can
lead to damage or degradation of the device. An example of
recommended fastening order is shown in Figure 1.
Table 2.
Figure 1. Mounting Screws Fastening Order:
Pre-Screwing: 1 → 2; Final Screwing: 2 → 1
Notes:
1. Do not over torque when mounting screws. Excess
mounting torque may cause ceramic cracks, as well as
screw and heat-sink damage.
2. Avoid one-side tightening stress, Figure 1 shows the
recommended torque order for mounting screws.
Uneven mounting can cause the SPM ceramic
substrate to be damaged. The pre-screwing torque is
set to 20~30% of maximum torque rating.
Mounting Torque and Heat Sink Flatness Specifications
Parameter
Conditions
Device Flatness
Heat Sink Flatness
Mounting Torque
Screw: M3
See Figure 2
See Figure 3
Recommended 0.7N·m
Recommended 7.1kg·m
Limits
Min.
0
-50
0.6
6.2
Weight
Typ.
0.7
7.1
11
Max.
+120
+100
0.8
8.1
Units
µm
µm
N·m
kg·cm
g
Note:
3. Recommend using SEMS screw (include spring/plain washer, M3) in fastening screws.
© 2009 Fairchild Semiconductor Corporation
Rev. 1.0.2 • 4/7/11
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AN-9072
APPLICATION NOTE
To get the most effective heat dissipation, it is necessary to
enlarge the contact area as much as possible, which
minimizes the contact thermal resistance.
Properly apply thermal-conductive grease over the contact
surface between a module and heat sink, which is also useful
for preventing the contact surface from corrosion. Ensure
the grease has stable quality and long-term endurance within
a wide operating temperature range. Use a torque wrench to
fasten up to the specified to torque rating. Exceeding the
maximum torque limitation might cause a module to be
damaged or degraded. Pay careful attention not to have any
dirt remaining on the contact surface.
Thermal Compound
Figure 2. Measurement Point of Package
Surface Flatness
Note:
4. The measurement point of flatness of the package
surface is package center point compared with outside
four points.
Use a minimum 150µm layer of thermal grease to the
module base plate or to the heat sink.
While fastening the module, a rim of thermal compound
must be observed around the mounted module.
Fixing Sequence
Fix all screws 0.5N·m under (by hand or driver).
Apply impact torque maximum 0.8N m crosswise.
Use recommended SEMS screw (included spring/plain
washer M3).
Figure 4. SEMS Screw (Size M3, Spring Washer 5.0Φ,
Plain Washer 7.5Φ)
Figure 3. Measurement Point of Heat Sink Flatness
© 2009 Fairchild Semiconductor Corporation
Rev. 1.0.2 • 4/7/11
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AN-9072
APPLICATION NOTE
Related Datasheets
FNX4XX60X — Smart Power Module Motion-SPM™
AN-9070 — Smart Power Module Motion-SPM™ in µMini-DIP SPM User Guide
AN-9071 — Smart Power Module Motion-SPM™ in µMini-DIP SPM Thermal Performance Information
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1.
Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
© 2009 Fairchild Semiconductor Corporation
Rev. 1.0.2 • 4/7/11
2.
A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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