FAIRCHILD FODM453

FODM452, FODM453
5-Pin Mini Flat Package High Speed Transistor
Optocoupler
Features
Description
■ Compact 5-pin mini flat package
■ VDE0884 recognized (File # 136480)
The FODM452 and FODM453 optocouplers consist of
an AlGaAs LED optically coupled to a high speed photodetector transistor. The devices are housed in a compact
5-pin mini flat package for optimum mounting density.
The FODM453 features a high CMR rating for optimum
common mode transient immunity.
– Ordering option V, e.g., FODM452V
■ 260°C reflow capability for Pb-free assembly
Related Resources
■ High speed-1 MBit/s
■ Superior CMR-15kV/µs at VCM = 1500V (FODM453)
■ Performance guaranteed over temperature (0–70°C)
■ U.L. recognized (File # E90700)
■ www.fairchildsemi.com/products/opto/
Applications
■ www.fairchildsemi.com/pf/FO/FODM611.html
■ Line receivers
■ www.fairchildsemi.com/pf/FO/FODM8061.html
■ Pulse transformer replacement
■ www.fairchildsemi.com/pf/FO/FODM8071.html
■ Output interface to CMOS-LSTTL-TTL
■ Wide bandwidth analog coupling
Functional Schematic
Truth Table
ANODE 1
6 VCC
5 VO
CATHODE 3
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
LED
Output
Off
High
On
Low
4 GND
www.fairchildsemi.com
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
July 2010
Number
Name
Function Description
1
ANODE
3
CATHODE
Anode
4
GND
Output Ground
5
VO
Output Voltage
6
VCC
Output Supply Voltage
Cathode
Safety and Insulation Ratings for Mini-Flat Package (SO5 Pin)
As per IEC60747-5-2 (Pending Certification). This optocoupler is suitable for “safe electrical insulation” only within the
safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Installation Classifications per DIN VDE 0110/1.89 Table 1
For rated main voltage < 150Vrms
I-IV
For rated main voltage < 300Vrms
I-III
Climatic Classification
40/85/21
Pollution Degree (DIN VDE 0110/1.89)
2
CTI
Comparative Tracking Index
175
VPR
Input to Output Test Voltage, Method b,
VIORM x 1.875 = VPR, 100% Production Test with
tm = 1 sec, Partial Discharge < 5 pC
1060
VPR
Input to Output Test Voltage, Method a,
VIORM x 1.5 = VPR, Type and Sample Test with
tm = 60 sec, Partial Discharge < 5 pC
848
Max Working Insulation Voltage
565
Vpeak
Highest Allowable Over Voltage
4000
Vpeak
5.0
mm
VIORM
VIOTM
External Creepage
TCase
RIO
External Clearance
5.0
mm
Insulation thickness
0.5
mm
Safety Limit Values, Maximum Values allowed in the event
of a failure, Case Temperature
150
°C
Insulation Resistance at TS, VIO = 500V
109
Ω
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
2
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Pin Definitions
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Value
Units
TSTG
Storage Temperature
Parameter
-40 to +125
°C
TOPR
Operating Temperature
-40 to +85
°C
EMITTER
IF (avg)
DC/Average Forward Input Current
25
mA
IF (pk)
Peak Forward Input Current (50% duty cycle, 1ms P.W.)
50
mA
Peak Transient Input Current (≤1µs P.W., 300pps)
1.0
A
IF (trans)
VR
Reverse Input Voltage
5
V
PD
Input Power Dissipation
(No derating required over specified operating temp range)
45
mW
Average Output Current
8
mA
DETECTOR
IO (avg)
IO (pk)
16
mA
VCC
Supply Voltage
Peak Output Current
-0.5 to 30
V
VO
Output Voltage
-0.5 to 20
V
PD
Output Power Dissipation
(No derating required over specified operating temp range)
100
mW
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
3
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Individual Component Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.*
Max.
Unit
1.60
1.7
V
EMITTER
VF
Input Forward Voltage
IF = 16mA, TA = 25°C
IF = 16mA
BVR
∆VF /∆TA
1.8
Input Reverse Breakdown Voltage
IR = 10µA
Temperature Coefficient of
Forward Voltage
IF = 16mA
5.0
-1.8
V
Logic High Output Current
IF = 0mA, VO = VCC = 5.5V, TA =25°C
.001
IF = 0 mA, VO = VCC = 15V, TA =25°C
.001
mV/°C
DETECTOR
IOH
IF = 0mA, VO = VCC = 15V
0.5
µA
1
50
ICCL
Logic Low Supply Current
IF = 16mA, VO = Open, VCC = 15V
100
200
µA
ICCH
Logic high supply current
IF = 0 mA, VO = Open, VCC = 15V,
TA = 25°C
0.05
1
µA
IF = 0mA, VO = Open, VCC = 15V
2
Transfer Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.*
Max
Unit
50
%
IF = 16mA, IO = 3mA, VCC = 4.5V, TA =2 5°C
0.4
V
IF = 16mA, IO = 2.4mA, VCC = 4.5 V
0.5
COUPLED
CTR
VOL
Current Transfer Ratio(1)
Logic LOW Output
Voltage
IF = 16mA, VCC = 4.5V
TA = 25°C VOL=0.4V
20
VOL=0.5V
15
Switching Characteristics (VCC = 5V)
Symbol
TPHL
TPLH
|CMH|
|CML|
BW
Parameter
Test Conditions
Device
Min. Typ.* Max.
Unit
0.8
µs
1.0
µs
0.8
µs
1.0
µs
Propagation Delay
Time to Logic LOW
RL = 1.9kΩ, IF = 16mA, TA = 25°C
(Fig. 9)
0.40
Propagation Delay
Time to Logic HIGH
RL = 1.9kΩ, IF = 16mA, TA = 25°C(2) (Fig. 9)
0.35
Common Mode
Transient Immunity
at Logic HIGH
IF = 0mA, VCM = 10VP-P, RL = 1.9kΩ,
TA = 25°C(3) (Fig. 10)
FODM452
5
15
KV/µs
IF = 0mA, VCM = 1500VP-P, RL = 1.9kΩ
TA = 25°C(3) (Fig. 10)
FODM453
15
40
KV/µs
Common Mode
Transient Immunity
at Logic LOW
IF = 16mA, VCM = 10VP-P, RL = 1.9kΩ,
TA = 25°C(3) (Fig. 10)
FODM452
5
15
KV/µs
IF = 16mA, VCM = 1500VP-P, RL = 1.9kΩ,
TA = 25°C(3) (Fig. 10)
FODM453
15
40
KV/µs
Bandwidth
RL = 100Ω
3
MHz
RL = 1.9kΩ, IF = 16mA
RL = 1.9kΩ, IF = 16mA
(2)
(2)
(2)
(Fig. 9)
(Fig. 9)
Isolation Characteristics
Symbol
VISO
CI-O
Characteristics
Withstand Insulation Test Voltage
Capacitance (Input to Output)
Test Conditions
RH ≤ 50%, TA = 25°C, t = 1 min.
f = 1MHz
(4)
Min.
(4)
Typ.*
3750
Max.
Unit
VRMS
0.2
pF
*All Typicals at TA = 25°C
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
4
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Electrical Characteristics (TA = 0 to 70°C unless otherwise specified)
2. The 1.9kΩ load represents 1 TTL unit load of 1.6mA and 5.6kΩ pull-up resistor.
3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dVcm /dt on the
leading edge of the common mode pulse signal VCM, to assure that the output will remain in a logic high state
(i.e., VO > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dVcm /dt
on the trailing edge of the common mode pulse signal, VCM, to assure that the output will remain in a logic low
state (i.e., VO < 0.8V).
4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted
together.
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
5
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Notes:
1. Current Transfer Ratio is defined as a ratio of output collector current, IO, to the forward LED input current, IF,
times 100%.
Fig. 1 Input Forward Current vs Forward Voltage
Fig. 2 Normalized Current Transfer Ratio vs. Input Current
NORMALIZED CURRENT TRANSFER RATIO
100
IF – FORWARD CURRENT (mA)
TA = 25°C
10
1
0.1
0.01
0.001
1.20
VO = 0.4V
VCC = 5V
TA = 25°C
Normalized to IF = 16mA
1.15
1.10
1.05
1.00
0.95
0.90
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1
10
VF – FORWARD CURRENT (mA)
I F – INPUT CURRENT (mA)
Fig. 4 Logic High Output Current
vs. Ambient Temperature
1.6
IOH – LOGIC HIGH OUTPUT CURRENT (nA)
NORMALIZED CURRENT TRANSFER RATIO
Fig. 3 Normalized Current Transfer Ratio
vs. Ambient Temperature
IF = 16mA
VO = 0.4V
VCC = 5V
Normalized to TA = 25°C
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
-20
0
20
40
60
80
VO = VCC = 5V
IF = 0V
10
1
0.1
-40
100
-20
0
40
60
80
100
Fig. 6 Propagation Delay vs. Load Resistance
Fig. 5 DC and Pulsed Transfer Characteristics
10
14
TA = 25°C
VCC = 5V
tP – PROPAGATION DELAY (µs)
TA = 25°C
VCC = 5V
12
IO - OUTPUT CURRENT (mA)
20
TA – TEMPERATURE (°C)
TA – AMBIENT TEMPERATURE
IF = 40mA
35mA
10
30mA
8
25mA
20mA
6
15mA
4
10mA
IF = 16mA
IF = 10mA
tPLH
1
tPHL
5mA
2
0
0
2
4
6
8
10
12
14
0.1
16
1
VO – OUTPUT VOLTAGE (V)
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
2
3
4
5
6
7
8
9 10
RL – LOAD RESISTANCE (kΩ)
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6
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Typical Performance Curves
Fig. 8 Frequency Response
Fig. 7 Propagation Delay vs. Ambient Temperature
1400
5
NORMALIZED RESPONSE (dB)
tP – PROPAGATION DELAY (ns)
IF = 16mA
VCC = 5V
TA = 25°C
IF = 16mA
VCC = 5V
RL = 1.9kΩ
1200
1000
800
600
tPHL
400
tPLH
RL = 220Ω
0
RL = 100Ω
-5
RL = 470Ω
-10
RL = 1kΩ
200
-15
0.01
0
-40
-20
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE (°C)
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
0.1
1
10
f – FREQUENCY (MHz)
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7
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Typical Performance Curves (Continued)
Noise
Shield
+
1
6
5
VCC
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Pulse
Generator I
F
tr = 5ns
Z O = 50 Ω
10% D.C.
I/f < 100µs
+5 V
RL
VO
VO
0.1 µF
3
I F Monitor
4
C L = 1.5 µF
GND
Rm
IF
0
5V
VO
1.5 V
1.5 V
VOL
TPHL
TPLH
Fig. 9 Switching Time Test Circuit
IF
Noise
Shield
+
1
6
A
5
B
VCC
+5 V
RL
VO
VO
0.1 µF
VFF
3
4
+
GND
-
VCM
-
Pulse Gen
VCM 10 V
0V
90%
90%
10%
10%
tr
tf
VO
5V
Switch at A : IF = 0 mA
VO
VOL
Switch at A : IF = 16 mA
Fig. 10 Common Mode Immunity Test Circuit
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
8
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Package Dimensions
Notes:
1. No standard applies to this package.
2. All dimensions are in millimeters.
3. Dimensions are exclusive of burrs, mold flash, and tie bar extrusion.
4. Drawings filesname and revision: MKT-MFP05A.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
9
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Footprint Drawing for PCB Layout
0.61
1.27
1.27
1.27
Device
‘A’
Device
‘B’
5.05
7.95
Pin 1
Pin 1
1.45
2.54
End Stacking Configuration
Dimensions in millimeters
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
Unutilized Solder Pad
www.fairchildsemi.com
10
K0
P2
P0
t
D0
E
A0
W1
W
B0
d
F
D1
P
2.54 Pitch
Symbol
Dimensions (mm)
Tape Width
W
12.00 +0.30 / -0.10
Tape Thickness
t
0.30 ±0.05
Sprocket Hole Pitch
P0
4.00 ±0.10
Sprocket Hole Diameter
Description
D0
1.50 +0.10 / -0.0
Sprocket Hole Location
E
1.75 ±0.10
Pocket Location
F
5.50 ±0.10
P2
2.00 ±0.10
Pocket Pitch
P
8.00 ±0.10
Pocket Dimension
A0
4.40 ±0.10
Pocket Hole Diameter
B0
7.30 ±0.10
K0
2.30 ±0.10
D1
1.50 Min.
Cover Tape Width
W1
Cover Tape Thickness
d
Max. Component Rotation or Tilt
10° Max.
Devices Per Reel
2500
Reel Diameter
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
9.20
0.065 ±0.010
330mm (13")
www.fairchildsemi.com
11
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Tape and Reel Dimensions
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Ordering Information
Option
Order Entry Identifier
(example)
R2
FODM452R2
V
FODM452V
R2V
FODM452R2V
Description
Tape and Reel (2500 per reel)
IEC60747-5-2
IEC60747-5-2, Tape and Reel (2500 per reel)
Marking Information
1
V
3
M452
2
X YY M
6
4
5
Definitions
1
Fairchild logo
2
Device number
3
IEC60747-5-2 mark (Note: Only appears on parts ordered
with VDE option – See order entry table)
4
One digit year code, e.g., ‘7’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
12
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Reflow Profile
Temperature (°C)
TP
260
240
TL
220
200
180
160
140
120
100
80
60
40
20
0
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
tP
Tsmax
tL
Preheat Area
Tsmin
ts
120
240
360
Time 25°C to Peak
Time (seconds)
Profile Freature
Pb-Free Assembly Profile
Temperature Min. (Tsmin)
150°C
Temperature Max. (Tsmax)
200°C
Time (tS) from (Tsmin to Tsmax)
60–120 seconds
Ramp-up Rate (tL to tP)
3°C/second max.
Liquidous Temperature (TL)
217°C
Time (tL) Maintained Above (TL)
60–150 seconds
Peak Body Package Temperature
260°C +0°C / –5°C
Time (tP) within 5°C of 260°C
30 seconds
Ramp-down Rate (TP to TL)
6°C/second max.
Time 25°C to Peak Temperature
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
8 minutes max.
www.fairchildsemi.com
13
AccuPower™
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
DEUXPEED®
Dual Cool™
EcoSPARK®
n
EfficientMax™
ESBC™
®
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FETBench™
FlashWriter®*
FPS™
F-PFS™
FRFET®
SM
Global Power Resource
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MicroPak2™
MillerDrive™
MotionMax™
Motion-SPM™
OptoHiT™
OPTOLOGIC®
OPTOPLANAR®
®
PDP SPM™
Power-SPM™
PowerTrench®
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
™
Saving our world, 1mW/W/kW at a time™
SignalWise™
SmartMax™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS®
SyncFET™
Sync-Lock™
®
*
The Power Franchise®
TinyBoost™
TinyBuck™
TinyCalc™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
" SerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a)
are intended for surgical implant into the body or (b) support or
sustain life, and (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet
Identification
Product Status
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Definition
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I49
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
14
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.