FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler tm Features Description ■ Compact 5-pin mini flat package The FODM452 and FODM453 optocouplers consist of an AlGaAs LED optically coupled to a high speed photodetector transistor. The devices are housed in a compact 5-pin mini flat package for optimum mounting density. The FODM453 features a high CMR rating for optimum common mode transient immunity. ■ High speed-1 MBit/s ■ Superior CMR-15kV/µs at VCM = 1500V (FODM453) ■ Performance guaranteed over temperature (0–70°C) ■ U.L. recognized (File # E90700) ■ VDE0884 recognized (File # 136480) – Ordering option V, e.g., FODM452V Applications ■ Line receivers ■ Pulse transformer replacement ■ Output interface to CMOS-LSTTL-TTL ■ Wide bandwidth analog coupling Package Schematic 0.050 (1.27) TYP ANODE 1 SEATING PLANE 0.181 (4.60) 0.165 (4.20) 6 VCC 5 VO Pin 1 CATHODE 3 4 GND 0.169 (4.30) 0.153 (3.90) 0.008 (0.2) TYP 0.094 (2.40) 0.079 (2.00) 0.020 (0.50) 0.011 (0.30) 0.008 (0.20) 0 (0.00) 0.287 (7.30) 0.248 (6.30) Lead Coplanarity : 0.004 (0.10) MAX Note: All dimensions are in inches (millimeters). ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 www.fairchildsemi.com FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler June 2007 Symbol Value Units TSTG Storage Temperature Parameter -40 to +125 °C TOPR Operating Temperature -40 to +85 °C EMITTER IF (avg) DC/Average Forward Input Current 25 mA IF (pk) Peak Forward Input Current (50% duty cycle, 1ms P.W.) 50 mA Peak Transient Input Current (≤1µs P.W., 300pps) 1.0 A IF (trans) VR Reverse Input Voltage 5 V PD Input Power Dissipation (No derating required over specified operating temp range) 45 mW Average Output Current 8 mA DETECTOR IO (avg) IO (pk) 16 mA VCC Supply Voltage Peak Output Current -0.5 to 30 V VO Output Voltage -0.5 to 20 V PD Output Power Dissipation (No derating required over specified operating temp range) 100 mW ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 www.fairchildsemi.com 2 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Absolute Maximum Ratings (TA = 25°C unless otherwise noted) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ.* Max. Unit 1.60 1.7 V EMITTER VF Input Forward Voltage IF = 16mA, TA = 25°C IF = 16mA BVR ∆VF /∆TA 1.8 Input Reverse Breakdown Voltage IR = 10µA Temperature Coefficient of Forward Voltage IF = 16mA 5.0 -1.8 V Logic High Output Current IF = 0mA, VO = VCC = 5.5V, TA =25°C .001 IF = 0 mA, VO = VCC = 15V, TA =25°C .001 mV/°C DETECTOR IOH IF = 0mA, VO = VCC = 15V 0.5 µA 1 50 ICCL Logic Low Supply Current IF = 16mA, VO = Open, VCC = 15V 100 200 µA ICCH Logic high supply current IF = 0 mA, VO = Open, VCC = 15V, TA = 25°C 0.05 1 µA IF = 0mA, VO = Open, VCC = 15V 2 Transfer Characteristics Symbol Parameter Test Conditions Min. Typ.* Max Unit 50 % IF = 16mA, IO = 3mA, VCC = 4.5V, TA =2 5°C 0.4 V IF = 16mA, IO = 2.4mA, VCC = 4.5 V 0.5 COUPLED CTR VOL Current Transfer Ratio(1) Logic LOW Output Voltage IF = 16mA, VCC = 4.5V TA = 25°C VOL=0.4V 20 VOL=0.5V 15 Switching Characteristics (VCC = 5V) Symbol TPHL TPLH |CMH| |CML| BW Parameter Test Conditions Device Min. Typ.* Max. Unit 0.8 µs 1.0 µs 0.8 µs 1.0 µs Propagation Delay Time to Logic LOW RL = 1.9kΩ, IF = 16mA, TA = 25°C (Fig. 9) 0.40 Propagation Delay Time to Logic HIGH RL = 1.9kΩ, IF = 16mA, TA = 25°C(2) (Fig. 9) 0.35 Common Mode Transient Immunity at Logic HIGH IF = 0mA, VCM = 10VP-P, RL = 1.9kΩ, TA = 25°C(3) (Fig. 10) FODM452 5 15 KV/µs IF = 0mA, VCM = 1500VP-P, RL = 1.9kΩ TA = 25°C(3) (Fig. 10) FODM453 15 40 KV/µs Common Mode Transient Immunity at Logic LOW IF = 16mA, VCM = 10VP-P, RL = 1.9kΩ, TA = 25°C(3) (Fig. 10) FODM452 5 15 KV/µs IF = 16mA, VCM = 1500VP-P, RL = 1.9kΩ, TA = 25°C(3) (Fig. 10) FODM453 15 40 KV/µs Bandwidth RL = 100Ω 3 MHz RL = 1.9kΩ, IF = 16mA RL = 1.9kΩ, IF = 16mA (2) (2) (2) (Fig. 9) (Fig. 9) Isolation Characteristics Symbol VISO CI-O Characteristics Withstand Insulation Test Voltage Capacitance (Input to Output) Test Conditions RH ≤ 50%, TA = 25°C, t = 1 min. f = 1MHz (4) Min. (4) Typ.* 3750 Max. Unit VRMS 0.2 pF *All Typicals at TA = 25°C ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 www.fairchildsemi.com 3 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Electrical Characteristics (TA = 0 to 70°C unless otherwise specified) 2. The 1.9kΩ load represents 1 TTL unit load of 1.6mA and 5.6kΩ pull-up resistor. 3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dVcm /dt on the leading edge of the common mode pulse signal VCM, to assure that the output will remain in a logic high state (i.e., VO > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dVcm /dt on the trailing edge of the common mode pulse signal, VCM, to assure that the output will remain in a logic low state (i.e., VO < 0.8V). 4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted together. ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 www.fairchildsemi.com 4 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Notes: 1. Current Transfer Ratio is defined as a ratio of output collector current, IO, to the forward LED input current, IF, times 100%. Fig. 1 Input Forward Current vs Forward Voltage Fig. 2 Normalized Current Transfer Ratio vs. Input Current NORMALIZED CURRENT TRANSFER RATIO 100 IF – FORWARD CURRENT (mA) TA = 25°C 10 1 0.1 0.01 0.001 1.20 VO = 0.4V VCC = 5V TA = 25°C Normalized to IF = 16mA 1.15 1.10 1.05 1.00 0.95 0.90 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1 10 VF – FORWARD CURRENT (mA) I F – INPUT CURRENT (mA) Fig. 4 Logic High Output Current vs. Ambient Temperature 1.6 IOH – LOGIC HIGH OUTPUT CURRENT (nA) NORMALIZED CURRENT TRANSFER RATIO Fig. 3 Normalized Current Transfer Ratio vs. Ambient Temperature IF = 16mA VO = 0.4V VCC = 5V Normalized to TA = 25°C 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 VO = VCC = 5V IF = 0V 10 1 0.1 -40 100 -20 0 40 60 80 100 Fig. 6 Propagation Delay vs. Load Resistance Fig. 5 DC and Pulsed Transfer Characteristics 10 14 TA = 25°C VCC = 5V tP – PROPAGATION DELAY (µs) TA = 25°C VCC = 5V 12 IO - OUTPUT CURRENT (mA) 20 TA – TEMPERATURE (°C) TA – AMBIENT TEMPERATURE IF = 40mA 35mA 10 30mA 8 25mA 20mA 6 15mA 4 10mA IF = 16mA IF = 10mA tPLH 1 tPHL 5mA 2 0 0 2 4 6 8 10 12 14 0.1 16 1 VO – OUTPUT VOLTAGE (V) ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 2 3 4 5 6 7 8 9 10 RL – LOAD RESISTANCE (kΩ) www.fairchildsemi.com 5 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Typical Performance Curves Fig. 8 Frequency Response Fig. 7 Propagation Delay vs. Ambient Temperature 1400 5 tP – PROPAGATION DELAY (ns) NORMALIZED RESPONSE (dB) IF = 16mA VCC = 5V RL = 1.9kΩ 1200 1000 800 600 tPHL 400 tPLH IF = 16mA VCC = 5V TA = 25°C RL = 220Ω 0 RL = 100Ω -5 RL = 470Ω -10 RL = 1kΩ 200 -15 0.01 0 -40 -20 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE (°C) ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 0.1 1 10 f – FREQUENCY (MHz) www.fairchildsemi.com 6 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Typical Performance Curves (Continued) Noise Shield + 1 6 5 VCC FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Pulse Generator I F tr = 5ns Z O = 50 Ω 10% D.C. I/f < 100µs +5 V RL VO VO 0.1 µF 3 I F Monitor 4 C L = 1.5 µF GND Rm IF 0 5V VO 1.5 V 1.5 V VOL TPHL TPLH Fig. 9 Switching Time Test Circuit IF Noise Shield + 1 6 A 5 B VCC +5 V RL VO VO 0.1 µF VFF 3 4 GND - VCM + - Pulse Gen VCM 10 V 0V 90% 90% 10% 10% tr tf VO 5V Switch at A : IF = 0 mA VO VOL Switch at A : IF = 16 mA Fig. 10 Common Mode Immunity Test Circuit ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 www.fairchildsemi.com 7 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Footprint Drawing for PCB Layout 0.050 0.050 0.050 (1.27) (1.27) (1.27) 0.024 (0.61) Device ‘A’ Device ‘B’ 0.190 (4.83) 0.310 (7.87) Pin 1 Pin 1 0.060 (1.52) 0.100 (2.54) End Stacking Configuration Dimensions in inches (mm) ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 Unutilized Solder Pad www.fairchildsemi.com 8 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Ordering Information Option Order Entry Identifier (example) R1 FODM452R1 Tape and Reel (500 per reel) R2 FODM452R2 Tape and Reel (2500 per reel) Description V FODM452V R1V FODM452R1V VDE0884 VDE0884, Tape and Reel (500 per reel) R2V FODM452R2V VDE0884, Tape and Reel (2500 per reel) Marking Information 1 V 3 M453 2 X YY M 6 4 5 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code, e.g., ‘7’ 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 www.fairchildsemi.com 9 8.0 ± 0.1 3.5 ± 0.2 2 ± 0.05 Ø1.5 MIN 4.0 ± 0.1 0.3 MAX 1.75 ± 0.10 5.5 ± 0.05 12.0 ± 0.3 8.3 ± 0.1 5.2 ± 0.2 6.4 ± 0.2 0.1 MAX Ø1.5 + 0.1/-0 User Direction of Feed Note: All dimensions are in millimeters. Reflow Profile Package Surface Temperature T (°C) (Heating) to 30 s 230°C (peak temperature) 210°C 180°C to 60 s 150 s 90 s 80 s Time (s) • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 www.fairchildsemi.com 10 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Carrier Tape Specifications ® ACEx Build it Now™ CorePLUS™ CROSSVOLT ™ CTL™ Current Transfer Logic™ ® EcoSPARK FACT Quiet Series™ ® FACT ® FAST FastvCore™ FPS™ ® FRFET SM Global Power Resource Green FPS™ ® POWEREDGE Power-SPM™ ® PowerTrench Programmable Active Droop™ ® QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ ® SPM STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 Green FPS™ e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ Motion-SPM™ ® OPTOLOGIC ® OPTOPLANAR PDP-SPM™ ® Power220 ® Power247 SuperSOT™-8 SyncFET™ ® The Power Franchise ™ TinyBoost™ TinyBuck™ ® TinyLogic TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ ® UHC UniFET™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Definition Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I29 ©2003 Fairchild Semiconductor Corporation FODM452, FODM453 Rev. 1.0.0 www.fairchildsemi.com 11 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler TRADEMARKS The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.