STMICROELECTRONICS M34F04

M34F04
4Kbit Serial I²C Bus EEPROM
With Hardware Write Control on Top Half of Memory
PRELIMINARY DATA
FEATURES SUMMARY
2
■ Two Wire I C Serial Interface
Supports 400 kHz Protocol
■
2.5 to 5.5V Single Supply Voltage:
■
Hardware Write Control of the top half of
memory (addresses 100h to 1FFh)
■
BYTE and PAGE WRITE (up to 16 Bytes)
■
RANDOM and SEQUENTIAL READ Modes
■
Self-Timed Programming Cycle
■
Automatic Address Incrementing
■
Enhanced ESD/Latch-Up Behavior
■
More than 1 Million Erase/Write Cycles
■
More than 40 Year Data Retention
Figure 1. Packages
8
1
SO8 (MN)
150 mil width
January 2004
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/20
M34F04
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power On Reset: VCC Lock-Out Write Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. SO Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Chip Enable (E1, E2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 4. Maximum RL Value versus Bus Capacitance (CBUS) for an I2C Bus . . . . . . . . . . . . . . . . 5
Figure 5. I2C Bus Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Device Select Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
DEVICE OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Start Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Acknowledge Bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Memory Addressing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 6. Write Mode Sequences, to Addresses in the Top Half, with WC=1 (data write inhibited) . 8
Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 7. Write Mode Sequences with WC=0 (data write enabled). . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 8. Write Cycle Polling Flowchart using ACK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Minimizing System Delays by Polling On ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 9. Read Mode Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Acknowledge in Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/20
M34F04
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 5. Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 6. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 7. Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 8. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 9. AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline. . . . 17
Table 10. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
17
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 11. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3/20
M34F04
SUMMARY DESCRIPTION
The M34F04 is an electrically erasable
programmable memory (EEPROM), organized as
512 x 8.
Table 1. Signal Names
E1, E2
Chip Enable
SDA
Serial Data
SCL
Serial Clock
WC
Write Control
VCC
Supply Voltage
VSS
Ground
Figure 2. Logic Diagram
VCC
2
E1-E2
SCL
SDA
M34F04
WC
VSS
AI09072
These devices are compatible with the I2C memory protocol. This is a two wire serial interface that
uses a bi-directional data bus and serial clock. The
devices carry a built-in 4-bit Device Type Identifier
code (1010) in accordance with the I2C bus definition.
The device behaves as a slave in the I2C protocol,
with all memory operations synchronized by the
serial clock. Read and Write operations are initiated by a Start condition, generated by the bus master. The Start condition is followed by a Device
Select Code and RW bit (as described in Table 2),
terminated by an acknowledge bit.
When writing data to the memory, the device inserts an acknowledge bit during the 9th bit time,
following the bus master’s 8-bit transmission.
When data is read by the bus master, the bus
master acknowledges the receipt of the data byte
in the same way. Data transfers are terminated by
a Stop condition after an Ack for Write, and after a
NoAck for Read.
4/20
Power On Reset: VCC Lock-Out Write Protect
In order to prevent data corruption and inadvertent
Write operations during Power-up, a Power On
Reset (POR) circuit is included. The internal reset
is held active until VCC has reached the POR
threshold value, and all operations are disabled –
the device will not respond to any command. In the
same way, when VCC drops from the operating
voltage, below the POR threshold value, all operations are disabled and the device will not respond
to any command. A stable and valid VCC must be
applied before applying any logic signal.
Figure 3. SO Connections
M34F04
NC
E1
E2
VSS
1
2
3
4
8
7
6
5
VCC
WC
SCL
SDA
AI09073
Note: 1. NC = Not Connected
2. See page 17 (onwards) for package dimensions, and how
to identify pin-1.
M34F04
SIGNAL DESCRIPTION
Serial Clock (SCL). This input signal is used to
strobe all data in and out of the device. In applications where this signal is used by slave devices to
synchronize the bus to a slower clock, the bus
master must have an open drain output, and a
pull-up resistor can be connected from Serial
Clock (SCL) to VCC. (Figure 4 indicates how the
value of the pull-up resistor can be calculated). In
most applications, though, this method of synchronization is not employed, and so the pull-up resistor is not necessary, provided that the bus master
has a push-pull (rather than open drain) output.
Serial Data (SDA). This bi-directional signal is
used to transfer data in or out of the device. It is an
open drain output that may be wire-OR’ed with
other open drain or open collector signals on the
bus. A pull up resistor must be connected from Serial Data (SDA) to VCC. (Figure 4 indicates how the
value of the pull-up resistor can be calculated).
Chip Enable (E1, E2). These input signals are
used to set the value that is to be looked for on the
three least significant bits (b3, b2) of the 7-bit Device Select Code. These inputs must be tied to
VCC or VSS, to establish the Device Select Code.
Write Control (WC). This input signal is useful
for protecting half of the memory from inadvertent
write operations. Write operations are disabled to
the upper half (1FFh to 100h) of the memory array
when Write Control (WC) is driven High. When unconnected, the signal is internally read as VIL, and
Write operations are allowed.
When attempting to write in the upper half of the
memory, while Write Control (WC) is being driven
High, Device Select and Address bytes are acknowledged, Data bytes are not acknowledged.
Figure 4. Maximum R L Value versus Bus Capacitance (CBUS) for an I2C Bus
VCC
Maximum RP value (kΩ)
20
16
RL
12
RL
SDA
MASTER
8
fc = 100kHz
4
fc = 400kHz
CBUS
SCL
CBUS
0
10
100
1000
CBUS (pF)
AI01665
5/20
M34F04
Figure 5. I2C Bus Protocol
SCL
SDA
SDA
Input
START
Condition
SCL
1
SDA
MSB
2
SDA
Change
STOP
Condition
3
7
8
9
ACK
START
Condition
SCL
1
SDA
MSB
2
3
7
8
9
ACK
STOP
Condition
AI00792B
Table 2. Device Select Code
Device Type Identifier1
Device Select Code
Chip Enable2,3
b7
b6
b5
b4
b3
b2
b1
b0
1
0
1
0
E2
E1
A8
RW
Note: 1. The most significant bit, b7, is sent first.
2. E1 and E2 are compared against the respective external pins on the memory device.
3. A8 represents most significant bits of the address.
6/20
RW
M34F04
DEVICE OPERATION
The device supports the I2C protocol. This is summarized in Figure 5. Any device that sends data on
to the bus is defined to be a transmitter, and any
device that reads the data to be a receiver. The
device that controls the data transfer is known as
the bus master, and the other as the slave device.
A data transfer can only be initiated by the bus
master, which will also provide the serial clock for
synchronization. The M24Cxx device is always a
slave in all communication.
Start Condition
Start is identified by a falling edge of Serial Data
(SDA) while Serial Clock (SCL) is stable in the
High state. A Start condition must precede any
data transfer command. The device continuously
monitors (except during a Write cycle) Serial Data
(SDA) and Serial Clock (SCL) for a Start condition,
and will not respond unless one is given.
Stop Condition
Stop is identified by a rising edge of Serial Data
(SDA) while Serial Clock (SCL) is stable and driven High. A Stop condition terminates communication between the device and the bus master. A
Read command that is followed by NoAck can be
followed by a Stop condition to force the device
into the Stand-by mode. A Stop condition at the
end of a Write command triggers the internal EEPROM Write cycle.
Acknowledge Bit (ACK)
The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter, whether it be
bus master or slave device, releases Serial Data
(SDA) after sending eight bits of data. During the
9th clock pulse period, the receiver pulls Serial
Data (SDA) Low to acknowledge the receipt of the
eight data bits.
Data Input
During data input, the device samples Serial Data
(SDA) on the rising edge of Serial Clock (SCL).
For correct device operation, Serial Data (SDA)
must be stable during the rising edge of Serial
Clock (SCL), and the Serial Data (SDA) signal
must change only when Serial Clock (SCL) is driven Low.
Memory Addressing
To start communication between the bus master
and the slave device, the bus master must initiate
a Start condition. Following this, the bus master
sends the Device Select Code, shown in Table 2
(on Serial Data (SDA), most significant bit first).
The Device Select Code consists of a 4-bit Device
Type Identifier, and a 2-bit Chip Enable “Address”
(E2, E1). To address the memory array, the 4-bit
Device Type Identifier is 1010b.
When the Device Select Code is received on Serial Data (SDA), the device only responds if the Chip
Enable Address is the same as the value on the
Chip Enable (E1, E2) inputs.
The 8th bit is the Read/Write bit (RW). This bit is
set to 1 for Read and 0 for Write operations.
If a match occurs on the Device Select code, the
corresponding device gives an acknowledgment
on Serial Data (SDA) during the 9th bit time. If the
device does not match the Device Select code, it
deselects itself from the bus, and goes into Standby mode.
Using the E1 and E2 inputs pins, up to four
M34F04 devices can be connected to one I2C bus.
Table 3. Operating Modes
Mode
Current Address Read
RW bit
WC 1
Bytes
1
X
1
0
X
Random Address Read
Initial Sequence
START, Device Select, RW = 1
START, Device Select, RW = 0, Address
1
1
X
reSTART, Device Select, RW = 1
Sequential Read
1
X
≥1
Byte Write (upper addresses)
0
VIL or Z
1
START, Device Select, RW = 0
Byte Write (lower addresses)
0
X
1
START, Device Select, RW = 0
Page Write (upper addresses)
0
VIL or Z
≤ 16
START, Device Select, RW = 0
Page Write (lower addresses)
0
X
≤ 16
START, Device Select, RW = 0
Similar to Current or Random Address Read
Note: 1. Z = unconnected and floating
X = VIH or VIL or unconnected and floating.
7/20
M34F04
Figure 6. Write Mode Sequences, to Addresses in the Top Half, with WC=1 (data write inhibited)
WC
ACK
BYTE ADDR
NO ACK
DATA IN
STOP
DEV SEL
START
Byte Write
ACK
R/W
WC
ACK
DEV SEL
START
Page Write
ACK
BYTE ADDR
NO ACK
DATA IN 1
NO ACK
DATA IN 2
DATA IN 3
R/W
WC (cont'd)
NO ACK
DATA IN N
STOP
Page Write
(cont'd)
NO ACK
AI02803C
Write Operations
Following a Start condition the bus master sends
a Device Select Code with the RW bit reset to 0.
The device acknowledges this, as shown in Figure
7, and waits for an address byte. The device responds to the address byte with an acknowledge
bit, and then waits for the data byte.
When the bus master generates a Stop condition
immediately after the Ack bit (in the “10 th bit” time
slot), either at the end of a Byte Write or a Page
Write, the internal memory Write cycle is triggered.
A Stop condition at any other time slot does not
trigger the internal Write cycle.
During the internal Write cycle, Serial Data (SDA)
and Serial Clock (SCL) are ignored, and the device does not respond to any requests.
Byte Write
After the Device Select code and the address byte,
the bus master sends one data byte. If the addressed location is Write-protected, by Write Control (WC) being driven High (during the period from
8/20
the Start condition until the end of the address
byte), the device replies to the data byte with
NoAck, as shown in Figure 6, and the location is
not modified. If, instead, the addressed location is
not Write-protected, the device replies with Ack.
The bus master terminates the transfer by generating a Stop condition, as shown in Figure 7.
Page Write
The Page Write mode allows up to 16 bytes to be
written in a single Write cycle, provided that they
are all located in the same page in the memory:
that is, the most significant memory address bits
are the same. If more bytes are sent than will fit up
to the end of the page, a condition known as ‘rollover’ occurs. This should be avoided, as data
starts to become overwritten in an implementation
dependent way.
The bus master sends from 1 to 16 bytes of data,
each of which is acknowledged by the device if
Write Control (WC) is Low. If the addressed location is Write-protected, by Write Control (WC) being driven High (during the period from the Start
M34F04
condition until the end of the address byte), the device replies to the data bytes with NoAck, as
shown in Figure 6, and the locations are not modified. After each byte is transferred, the internal
byte address counter (the 4 least significant address bits only) is incremented. The transfer is terminated by the bus master generating a Stop
condition.
Figure 7. Write Mode Sequences with WC=0 (data write enabled)
WC
ACK
BYTE ADDR
ACK
DATA IN
STOP
DEV SEL
START
BYTE WRITE
ACK
R/W
WC
ACK
DEV SEL
START
PAGE WRITE
ACK
BYTE ADDR
ACK
DATA IN 1
ACK
DATA IN 2
DATA IN 3
R/W
WC (cont'd)
ACK
DATA IN N
STOP
PAGE WRITE
(cont'd)
ACK
AI02804B
9/20
M34F04
Figure 8. Write Cycle Polling Flowchart using ACK
WRITE Cycle
in Progress
START Condition
DEVICE SELECT
with RW = 0
NO
ACK
Returned
YES
First byte of instruction
with RW = 0 already
decoded by the device
NO
Next
Operation is
Addressing the
Memory
YES
Send Address
and Receive ACK
ReSTART
NO
STOP
YES
DATA for the
WRITE Operation
DEVICE SELECT
with RW = 1
Continue the
WRITE Operation
Continue the
Random READ Operation
Minimizing System Delays by Polling On ACK
During the internal Write cycle, the device disconnects itself from the bus, and writes a copy of the
data from its internal latches to the memory cells.
The maximum Write time (tw) is shown in Table 9,
but the typical time is shorter. To make use of this,
a polling sequence can be used by the bus master.
The sequence, as shown in Figure 8, is:
– Initial condition: a Write cycle is in progress.
– Step 1: the bus master issues a Start condition
followed by a Device Select Code (the first byte
of the new instruction).
10/20
START
Condition
AI01847C
– Step 2: if the device is busy with the internal
Write cycle, no Ack will be returned and the bus
master goes back to Step 1. If the device has
terminated the internal Write cycle, it responds
with an Ack, indicating that the device is ready
to receive the second part of the instruction (the
first byte of this instruction having been sent
during Step 1).
M34F04
Figure 9. Read Mode Sequences
ACK
DATA OUT
STOP
START
DEV SEL
NO ACK
R/W
ACK
START
DEV SEL *
ACK
BYTE ADDR
R/W
ACK
START
DEV SEL
DATA OUT
R/W
ACK
ACK
NO ACK
DATA OUT N
DATA OUT 1
R/W
ACK
START
DEV SEL *
ACK
BYTE ADDR
R/W
ACK
ACK
DEV SEL *
START
SEQUENTIAL
RANDOM
READ
DEV SEL *
NO ACK
STOP
SEQUENTIAL
CURRENT
READ
ACK
START
RANDOM
ADDRESS
READ
STOP
CURRENT
ADDRESS
READ
ACK
DATA OUT 1
R/W
NO ACK
STOP
DATA OUT N
AI01942
Note: 1. The seven most significant bits of the Device Select Code of a Random Read (in the 1st and 3rd bytes) must be identical.
Read Operations
Read operations are performed independently of
the state of the Write Control (WC) signal.
Random Address Read
A dummy Write is performed to load the address
into the address counter (as shown in Figure 9) but
without sending a Stop condition. Then, the bus
master sends another Start condition, and repeats
the Device Select Code, with the RW bit set to 1.
The device acknowledges this, and outputs the
contents of the addressed byte. The bus master
must not acknowledge the byte, and terminates
the transfer with a Stop condition.
Current Address Read
The device has an internal address counter which
is incremented each time a byte is read. For the
Current Address Read operation, following a Start
condition, the bus master only sends a Device Select Code with the RW bit set to 1. The device acknowledges this, and outputs the byte addressed
by the internal address counter. The counter is
then incremented. The bus master terminates the
transfer with a Stop condition, as shown in Figure
9, without acknowledging the byte.
Sequential Read
This operation can be used after a Current Address Read or a Random Address Read. The bus
11/20
M34F04
master does acknowledge the data byte output,
and sends additional clock pulses so that the device continues to output the next byte in sequence.
To terminate the stream of bytes, the bus master
must not acknowledge the last byte, and must
generate a Stop condition, as shown in Figure 9.
The output data comes from consecutive addresses, with the internal address counter automatically
incremented after each byte output. After the last
memory address, the address counter ‘rolls-over’,
and the device continues to output data from
memory address 00h.
Acknowledge in Read Mode
For all Read commands, the device waits, after
each byte read, for an acknowledgment during the
12/20
9th bit time. If the bus master does not drive Serial
Data (SDA) Low during this time, the device terminates the data transfer and switches to its Standby mode.
INITIAL DELIVERY STATE
The device is delivered with the memory array
erased: all bits are set to 1 (each byte contains
FFh).
M34F04
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality documents.
Table 4. Absolute Maximum Ratings
Symbol
Parameter
TSTG
Storage Temperature
TLEAD
Lead Temperature during Soldering 1
Min.
Max.
Unit
–65
150
°C
260 2
°C
VIO
Input or Output range
–0.6
6.5
V
VCC
Supply Voltage
–0.3
6.5
V
VESD
Electrostatic Discharge Voltage (Human Body model) 3
–4000
4000
V
ECOPACK ®
Note: 1. Compliant with the
7191395 specifiication for lead-free soldering processes
2. Not exceeding 250°C for more than 30 seconds, and peaking at 260°C
3. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)
13/20
M34F04
DC AND AC PARAMETERS
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC
and AC Characteristic tables that follow are derived from tests performed under the Measure-
ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parameters.
Table 5. Operating Conditions
Symbol
VCC
TA
Parameter
Min.
Max.
Unit
Supply Voltage
2.5
5.5
V
Ambient Operating Temperature
–40
85
°C
Min.
Max.
Unit
Table 6. AC Measurement Conditions
Symbol
CL
Parameter
Load Capacitance
100
Input Rise and Fall Times
pF
50
ns
Input Levels
0.2VCC to 0.8VCC
V
Input and Output Timing Reference Levels
0.3VCC to 0.7VCC
V
Figure 10. AC Measurement I/O Waveform
Input Levels
Input and Output
Timing Reference Levels
0.8VCC
0.7VCC
0.3VCC
0.2VCC
AI00825B
Table 7. Input Parameters
Symbol
Parameter1,2
Test Condition
Min.
Unit
CIN
Input Capacitance (SDA)
8
pF
CIN
Input Capacitance (other pins)
6
pF
70
kΩ
ZWCL
WC Input Impedance
VIN < 0.3VCC
5
ZWCH
WC Input Impedance
VIN > 0.7VCC
500
Pulse width ignored
(Input Filter on SCL and SDA)
Single glitch
tNS
Note: 1. TA = 25 °C, f = 400 kHz
2. Sampled only, not 100% tested.
14/20
Max.
kΩ
100
ns
M34F04
Table 8. DC Characteristics
Symbol
Test Condition
(in addition to those in Table 5)
Parameter
ILI
Input Leakage Current
(SCL, SDA)
ILO
Output Leakage Current
ICC
Supply Current
ICC1
Stand-by Supply Current
VIL
Input Low Voltage
(E2, E1, SCL, SDA)
VIH
Input High Voltage
(E2, E1, SCL, SDA, WC)
VOL
Output Low Voltage
Max.
Unit
VIN = VSS or VCC
±2
µA
VOUT = VSS or VCC, SDA in Hi-Z
±2
µA
VCC =2.5V, fc=400kHz (rise/fall time < 30ns)
1
mA
VIN = VSS or VCC , VCC = 2.5 V
0.5
µA
–0.3
0.3VCC
V
0.7VCC
VCC+1
V
0.4
V
Min.
IOL = 2.1 mA, VCC = 2.5 V
Table 9. AC Characteristics
Test conditions specified in Table 6 and Table 5
Symbol
Alt.
Parameter
fC
fSCL
Clock Frequency
tCHCL
tHIGH
Clock Pulse Width High
600
ns
tCLCH
tLOW
Clock Pulse Width Low
1300
ns
tDL1DL2 2
tF
tDXCX
tSU:DAT
Data In Set Up Time
tCLDX
tHD:DAT
Data In Hold Time
tCLQX
tDH
tCLQV 3
tAA
tCHDX 1
SDA Fall Time
Min.
20
Max.
Unit
400
kHz
300
ns
100
ns
0
ns
Data Out Hold Time
200
ns
Clock Low to Next Data Valid (Access Time)
200
tSU:STA
Start Condition Set Up Time
600
ns
tDLCL
tHD:STA
Start Condition Hold Time
600
ns
tCHDH
tSU:STO
Stop Condition Set Up Time
600
ns
tDHDL
tBUF
Time between Stop Condition and Next Start Condition
1300
ns
tW
tWR
Write Time
900
5
ns
ms
Note: 1. For a reSTART condition, or following a Write cycle.
2. Sampled only, not 100% tested.
3. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.
15/20
M34F04
Figure 11. AC Waveforms
tCHCL
tCLCH
SCL
tDLCL
SDA In
tCHDX
tCLDX
START
Condition
SDA
Input
SDA tDXCX
Change
tCHDH tDHDL
START
STOP
Condition Condition
SCL
SDA In
tCHDH
tW
STOP
Condition
Write Cycle
tCHDX
START
Condition
SCL
tCLQV
SDA Out
tCLQX
Data Valid
AI00795C
16/20
M34F04
PACKAGE MECHANICAL
Figure 12. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline
h x 45˚
A
C
B
CP
e
D
N
E
H
1
A1
α
L
SO-a
Note: Drawing is not to scale.
Table 10. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
mm
inches
Symb.
Typ.
Min.
Max.
A
1.35
A1
Min.
Max.
1.75
0.053
0.069
0.10
0.25
0.004
0.010
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.00
0.150
0.157
–
–
–
–
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.40
0.90
0.016
0.035
α
0°
8°
0°
8°
N
8
e
CP
1.27
Typ.
0.050
8
0.10
0.004
17/20
M34F04
PART NUMBERING
Table 11. Ordering Information Scheme
Example:
M34F04
–
W MN
6
T
P
Device Type
M34 = I2C serial access EEPROM (ASSP)
Device Function
04 = 4 Kbit (512 x 8)
Operating Voltage
W = VCC = 2.5 to 5.5V (400kHz)
Package
MN = SO8 (150 mil width)
Temperature Range
6 = –40 to 85 °C
Option
T = Tape & Reel Packing
Plating Technology2
blank = Standard SnPb plating
P = Pb-free plating
G = Green pack
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
18/20
device, please contact your nearest ST Sales Office.
M34F04
REVISION HISTORY
Table 12. Document Revision History
Date
Version
23-Jan-2004
1.0
Description of Revision
Document written
19/20
M34F04
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
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20/20