STMICROELECTRONICS STPS30L30CR

STPS30L30CT/CG/CR
®
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
A1
IF(AV)
2 x 15 A
VRRM
30 V
Tj (max)
150 °C
VF (max)
0.37 V
K
A2
K
FEATURES AND BENEFITS
n
n
n
n
n
n
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREMELY FAST SWITCHING
LOW FORWARD VOLTAGE DROP
LOW THERMAL RESISTANCE
AVALANCHE CAPABILITY SPECIFIED
A2
A2
A1
K
TO-220AB
STPS30L30CT
A1
D2PAK
STPS30L30CG
DESCRIPTION
Dual center tap Schottky rectifiers suited for
Switch Mode Power Supply and high frequency
DC to DC converters.
Packaged in TO-220AB, D2PAK and I²PAK, these
devices are intended for use in low voltage, high
frequency inverters, free-wheeling and polarity
protection applications.
K
A2
A1
I2PAK
STPS30L30CR
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
VRRM
IF(RMS)
Parameter
Repetitive peak reverse voltage
RMS forward current
Value
30
Unit
V
30
A
15
30
A
220
A
IF(AV)
Average forward current
Tc = 140°C
δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
IRRM
Peak repetitive reverse current
tp = 2 µs F = 1kHz square
1
A
IRSM
Non repetitive peak reverse current
tp = 100µs square
3
A
PARM
Repetitive peak avalanche power
tp = 1µs
5300
W
- 65 to + 150
°C
150
°C
10000
V/µs
Tstg
Tj
dV/dt
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise reverse voltage
July 2003 - Ed: 5C
Per diode
Per device
Tj = 25°C
1/5
STPS30L30CT/CG/CR
THERMAL RESISTANCE
Symbol
Rth (j-c)
Parameter
Value
1.5
0.8
0.1
Per diode
Total
Coupling
Junction to case
Rth (c)
Unit
°C/W
°C/W
When the diodes 1 and 2 are used simultaneously :
∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
IR *
Parameter
VF *
Tests Conditions
Min.
Typ.
Max.
1.5
Unit
mA
170
350
mA
0.46
V
VR = VRRM
Reverse leakage current
Tj = 25°C
Forward voltage drop
Tj = 25°C
IF = 15 A
Tj = 125°C
IF = 15 A
Tj = 25°C
IF = 30 A
Tj = 125°C
IF = 30 A
Tj = 125°C
0.33
0.37
0.57
0.43
0.5
Pulse test : * tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation :
P = 0.24x IF(AV) + 0.009 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
10
9
8
7
6
5
4
3
2
1
0
Fig. 2: Average current versus
temperature (δ=0.5) (per diode).
ambient
IF(av)(A)
PF(av)(W)
16
δ = 0.1
δ = 0.2
14
δ = 0.5
δ = 0.05
Rth(j-a)=Rth(j-c)
12
Rth(j-a)=15°C/W
10
δ=1
8
Rth(j-a)=50°C/W
6
T
IF(av) (A)
0
2
4
6
8
10
12
δ=tp/T
14
16
2
tp
18
T
4
20
Fig. 3: Normalized avalanche power derating
versus pulse duration.
0
δ=tp/T
0
25
50
75
100
125
150
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
Tamb(°C)
tp
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
2/5
Tj(°C)
tp(µs)
0.1
1
0
10
100
1000
0
25
50
75
100
125
150
STPS30L30CT/CG/CR
Fig. 4: Non repetitive surge peak forward current
versus overload duration (maximum values) (per
diode).
IM(A)
250
225
200
175
150
125
100
75
50 IM
25
0
1E-3
Fig. 5: Relative variation of thermal transient
impedance junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
1.0
0.8
0.6
Tc=25°C
Tc=75°C
δ = 0.5
0.4
δ = 0.2
Tc=110°C
t
t(s)
δ=0.5
1E-2
1E-1
1E+0
Fig. 6: Reverse leakage current versus reverse
voltage applied (typical values) (per diode).
T
δ = 0.1
0.2
0.0
1E-4
δ=tp/T
tp(s)
Single pulse
1E-3
1E-2
tp
1E-1
1E+0
Fig. 7: Junction capacitance versus reverse
voltage applied (typical values) (per diode).
IR(mA)
C(nF)
1E+3
5.0
Tj=150°C
F=1MHz
Tj=25°C
1E+2
Tj=125°C
1E+1
1.0
1E+0
Tj=25°C
1E-1
1E-2
VR(V)
0
5
10
15
0.1
20
25
VR(V)
1
2
5
10
20
50
30
Fig. 8: Forward voltage drop versus forward
current (maximum values - per diode).
Fig. 9: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed
circuit board FR4, e(Cu) = 35 µm)
(STPS30L30CG).
IFM(A)
Rth(j-a) (°C/W)
200
80
100
70
Tj=150°C
(typical values)
60
50
40
Tj=125°C
10
30
Tj=25°C
20
10
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
0
1.0
1.2
1.4
S(Cu) (cm²)
0
4
8
12
16
20
24
28
32
36
40
1.6
3/5
STPS30L30CT/CG/CR
PACKAGE MECHANICAL DATA
TO-220AB
DIMENSIONS
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
n
n
n
REF.
Millimeters
Inches
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
Min.
Max.
4.40
4.60
1.23
1.32
2.40
2.72
0.49
0.70
0.61
0.88
1.14
1.70
1.14
1.70
4.95
5.15
2.40
2.70
10
10.40
16.4 typ.
13
14
2.65
2.95
15.25
15.75
6.20
6.60
3.50
3.93
2.6 typ.
3.75
3.85
Min.
Max.
0.173
0.181
0.048
0.051
0.094
0.107
0.019
0.027
0.024
0.034
0.044
0.066
0.044
0.066
0.194
0.202
0.094
0.106
0.393
0.409
0.645 typ.
0.511
0.551
0.104
0.116
0.600
0.620
0.244
0.259
0.137
0.154
0.102 typ.
0.147
0.151
A
H2
Cooling method: C
Recommended torque value: 0.55 m.N
Maximum torque value: 0.70 m.N
PACKAGE MECHANICAL DATA
I2PAK
DIMENSIONS
REF.
A
E
c2
L2
D
L1
A1
b2
L
b1
b
e
4/5
c
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
b
0.70
0.93
0.028
0.037
b1
1.14
1.17
0.044
0.046
b2
1.14
1.17
0.044
0.046
c
0.45
0.60
0.018
0.024
c2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
E
10.0
10.4
0.394
0.409
L
13.1
13.6
0.516
0.535
L1
3.48
3.78
0.137
0.149
L2
1.27
1.40
0.050
0.055
STPS30L30CT/CG/CR
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
A
E
REF.
Millimeters
Inches
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
Min.
Max.
4.40
4.60
2.49
2.69
0.03
0.23
0.70
0.93
1.14
1.70
0.45
0.60
1.23
1.36
8.95
9.35
10.00
10.40
4.88
5.28
15.00
15.85
1.27
1.40
1.40
1.75
2.40
3.20
0.40 typ.
0°
8°
Min.
Max.
0.173
0.181
0.098
0.106
0.001
0.009
0.027
0.037
0.045
0.067
0.017
0.024
0.048
0.054
0.352
0.368
0.393
0.409
0.192
0.208
0.590
0.624
0.050
0.055
0.055
0.069
0.094
0.126
0.016 typ.
0°
8°
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
FOOT PRINT (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
Ordering type
STPS30L30CT
STPS30L30CG
STPS30L30CG-TR
STPS30L30CR
n
Marking
STPS30L30CT
STPS30L30CG
STPS30L30CG
STPS30L30CR
Package
TO-220AB
D2PAK
D2PAK
I2PAK
Weight
2g
1.8g
1.8g
1.49g
Base qty
50
50
1000
50
Delivery mode
Tube
Tube
Tape & reel
Tube
Epoxy meets UL94,V0
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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