STMICROELECTRONICS STPS30H100

STPS30H100CW/CT
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
A1
IF(AV)
K
2 x 15 A
VRRM
100 V
Tj (max)
175 °C
VF (max)
0.67 V
A2
FEATURES AND BENEFITS
■
■
■
■
■
A2
NEGLIGIBLE SWITCHING LOSSES
LOW LEAKAGE CURRENT
GOOD TRADE OFF BETWEEN LEAKAGE
CURRENT AND FORWARD VOLTAGE DROP
LOW THERMAL RESISTANCE
AVALANCHE CAPABILITY SPECIFIED
K
A1
A1
K
A2
TO-220AB
STPS30H100CT
TO-247
STPS30H100CW
DESCRIPTION
Dual center tap Schottky rectifier suited for
Switch Mode Power Supplies and high frequency DC to DC converters.
Packaged in TO-247, this device is intended
for use in high frequency inverters.
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
100
V
IF(RMS)
RMS forward current
30
A
15
30
A
250
A
IF(AV)
Average forward current
Tc = 155°C
δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
IRRM
Repetitive peak reverse current
tp = 2 µs square F = 1kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
3
A
PARM
Repetitive peak avalanche power
tp = 1µs
10800
W
- 65 to + 175
°C
175
°C
10000
V/µs
Tstg
Tj
dV/dt
* :
Storage temperature range
Per diode
Per device
Tj = 25°C
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
July 2003 - Ed: 5E
1/5
STPS30H100CW/CT
THERMAL RESISTANCES
Symbol
Rth (j-c)
Parameter
Junction to case
Rth (c)
Value
Unit
Per diode
Total
1.6
0.9
°C/W
Coupling
0.1
When the diodes 1 and 2 are used simultaneously :
∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests Conditions
IR *
Reverse leakage current
Tj = 25°C
Min.
VR = VRRM
Tj = 125°C
VF **
Pulse test :
Forward voltage drop
Typ.
2
Tj = 25°C
IF = 15 A
Tj = 125°C
IF = 15 A
Tj = 25°C
IF = 30 A
Tj = 125°C
IF = 30 A
0.64
Max.
Unit
5
µA
6
mA
0.80
V
0.67
0.93
0.74
0.80
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.54 x IF(AV) + 0.0086 x IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
Fig. 2: Average forward current versus ambient
temperature (δ=0.5, per diode).
PF(av)(W)
IF(av)(A)
14
δ = 0.1
12
δ = 0.2
δ = 0.5
δ = 0.05
10
δ=1
8
6
T
4
2
0
δ=tp/T
IF(av) (A)
0
2/5
2
4
6
8
10
12
14
16
tp
18
20
18
16
14
12
10
8
6
4
2
0
Rth(j-a)=Rth(j-c)
Rth(j-a)=15°C/W
T
δ=tp/T
0
25
tp
Tamb(°C)
50
75
100
125
150
175
STPS30H100CW/CT
Fig. 3: Normalized avalanche power derating
versus pulse duration.
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
1
0
10
100
Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values, per diode).
IM(A)
240
220
200
180
160
140
120
100
80
60 IM
40
20
0
1E-3
0
1000
25
50
75
100
125
150
Fig. 6: Relative variation of thermal impedance
junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
1.0
0.8
0.6
Tc=25°C
Tc=75°C
0.4
δ = 0.5
δ = 0.2
T
δ = 0.1
Tc=150°C
t
0.2
Single pulse
t(s)
δ=0.5
1E-2
1E-1
1E+0
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).
0.0
1E-4
δ=tp/T
tp(s)
1E-3
1E-2
tp
1E-1
1E+0
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values, per diode).
C(pF)
IR(mA)
1000
2E+0
1E+0
Tj=125°C
F=1MHz
Tj=25°C
1E-1
500
1E-2
1E-3
200
Tj=25°C
1E-4
VR(V)
VR(V)
1E-5
0
10
20
30
40
50
60
70
80
90 100
100
1
2
5
10
20
50
100
3/5
STPS30H100CW/CT
Fig. 9: Forward voltage drop versus forward current (maximum values, per diode).
IFM(A)
200
100
Tj=125°C
Tj=25°C
10
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
PACKAGE MECHANICAL DATA
TO-247
DIMENSIONS
REF.
V
Min.
Dia.
V
A
H
L5
L
L2 L4
F2
F1
L1
F3
V2
F4
D
L3
F(x3)
M
G
=
■
■
■
=
COOLING METHOD: C
RECOMMENDED TORQUE VALUE: 0.8 N.M.
MAXIMUM TORQUE VALUE: 1 N.M.
4/5
Millimeters
E
Typ. Max.
Inches
Min.
Typ. Max.
A
4.85
5.15 0.191
D
2.20
2.60 0.086
E
0.40
0.80 0.015
F
1.00
1.40 0.039
F1
3.00
F2
2.00
F3
2.00
2.40 0.078
F4
3.00
3.40 0.118
G
10.90
H
15.45
15.75 0.608
L
19.85
20.15 0.781
L1
3.70
4.30 0.145
L2
18.50
L3 14.20
14.80 0.559
L4
34.60
L5
5.50
M
2.00
3.00 0.078
V
5°
V2
60°
Dia. 3.55
3.65 0.139
0.203
0.102
0.031
0.055
0.118
0.078
0.094
0.133
0.429
0.620
0.793
0.169
0.728
0.582
1.362
0.216
0.118
5°
60°
0.143
STPS30H100CW/CT
PACKAGE MECHANICAL DATA
TO-220AB
DIMENSIONS
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
Millimeters
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
L2
F
M
G1
E
G
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
2.6 typ.
Diam.
■
Inches
3.75
0.102 typ.
3.85
0.147
0.151
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS30H100CW
STPS30H100CW
TO-247
4.36g
30
Tube
STPS30H100CT
STPS30H100CT
TO-220AB
2.20 g
50
Tube
EPOXY MEETS UL94,V0
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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