STPS41L30CG/CT/CR ® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCTS CHARACTERISTICS IF(AV) 2 x 20 A VRRM 30 V Tj (max) 150 °C VF (max) 0.38 V A1 K A2 FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING LOW FORWARD VOLTAGE DROP HIGH AVALANCHE CAPABILITY LOW THERMAL RESISTANCE AVALANCHE CAPABILITY SPECIFIED ■ A2 ■ A1 K A1 A2 K ■ I2PAK STPS41L30CR ■ ■ TO-220AB STPS41L30CT ■ K ■ DESCRIPTION Dual center tab Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in D2PAK, I2PAK and TO-220ABthis device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. A2 A1 D2PAK STPS41L30CG ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) Parameter Repetitive peak reverse voltage RMS forward current Average forward current Tc = 135°C δ = 0.5 Per device IRRM Peak repetitive reverse current tp=2 µs square F=1kHz PARM Repetitive peak avalanche power tp = 1µs dV/dt * : A 20 tp = 10 ms sinusoidal Tj 30 40 Surge non repetitive forward current Storage temperature range Unit V Per diode IFSM Tstg Value 30 A 220 A 1 A 6500 W - 65 to + 175 °C 150 °C 10000 V/µs Tj = 25°C Maximum operating junction temperature * Critical rate of rise reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) July 2003 - Ed : 3A 1/6 STPS41L30CG / STPS41L30CT / STPS41L30CR THERMAL RESISTANCES Symbol Rth(j-c) Junction to case Rth(c) Parameter Value 1.5 0.8 0.1 Per diode Total Coupling Unit °C/W When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol IR * Parameter Tests Conditions Reverse leakage current Min. Forward voltage drop Max. 1.5 Unit mA 170 350 mA 0.48 V VR = VRRM Tj = 25°C Tj = 125°C VF * Typ. Tj = 25°C IF = 20 A Tj = 125°C IF = 20 A Tj = 25°C IF = 40 A Tj = 125°C IF = 40 A 0.35 0.38 0.57 0.47 0.49 Pulse test : * tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.27 x IF(AV) + 0.0055 IF2(RMS) Fig. 1: Conduction losses versus average current. Fig. 2: Average forward current versus ambient temperature (δ = 0.5). PF(av)(W) IF(av)(A) 11 25 δ = 0.5 10 δ = 0.2 9 Rth(j-a)=Rth(j-c) 20 δ = 0.1 8 δ=1 δ = 0.05 7 15 6 5 10 4 Rth(j-a)=50°C/W 3 T 2 1 IF(av)(A) δ=tp/T 0 0 5 10 15 20 T 5 δ=tp/T tp 0 25 Fig. 3: Normalized avalanche power derating versus pulse duration. 0 25 50 75 100 125 150 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 Tamb(°C) tp 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 2/6 Tj(°C) tp(µs) 0.1 1 0 10 100 1000 0 25 50 75 100 125 150 STPS41L30CG / STPS41L30CT / STPS41L30CR Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) IM(A) 1.0 300 0.9 250 0.8 0.7 200 δ = 0.5 0.6 Tc=25°C 150 0.5 Tc=75°C 100 0.4 δ = 0.2 0.3 δ = 0.1 Tc=125°C T 0.2 IM 50 Single pulse t 0.1 t(s) δ=0.5 0 tp(s) δ=tp/T 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). 1.E-03 1.E-02 tp 1.E-01 1.E+00 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). IR(mA) C(nF) 1.E+03 10.0 Tj=150°C F=1MHz Vosc=30mV Tj=25°C Tj=125°C 1.E+02 Tj=100°C 1.E+01 Tj=75°C 1.0 1.E+00 Tj=50°C 1.E-01 Tj=25°C VR(V) VR(V) 1.E-02 0.1 0 5 10 15 20 25 30 Fig. 9: Forward voltage drop versus forward current. 1 10 100 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35µm) (STPS41L30CG only). IFM(A) Rth(j-a)(°C/W) 100 80 70 Tj=125°C (Maximum values) 60 50 Tj=125°C (Typical values) 10 40 Tj=25°C (Maximum values) 30 20 10 VFM(V) 1 S(cm²) 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 5 10 15 20 25 30 35 40 3/6 STPS41L30CG / STPS41L30CT / STPS41L30CR PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. E C2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm Min. Max. Min. Max. 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R V2 FOOTPRINT (dimensions in mm) 16.90 10.30 5.08 1.30 3.70 8.90 4/6 Inches A A L2 Millimeters 0.40 typ. 0° 8° 0.016 typ. 0° 8° STPS41L30CG / STPS41L30CT / STPS41L30CR PACKAGE MECHANICAL DATA I2PAK DIMENSIONS REF. Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 b2 e 2.40 2.70 0.094 0.106 b1 E 10.0 10.4 0.394 0.409 L 13.1 13.6 0.516 0.535 L1 3.48 3.78 0.137 0.149 L2 1.27 1.40 0.050 0.055 A E c2 L2 D L1 A1 L b e Millimeters c 5/6 STPS41L30CG / STPS41L30CT / STPS41L30CR PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 F M G1 E G Ordering type STPS41L30CG STPS41L30CG Package Millimeters Inches A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. Min. Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 1.14 1.70 4.95 5.15 2.40 2.70 10 10.40 16.4 typ. 13 14 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.044 0.066 0.194 0.202 0.094 0.106 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 Weight Base qty Delivery mode 2 1.48 g 50 Tube 2 D PAK STPS41L30CG-TR STPS41L30CG D PAK 1.48 g 1000 Tape & reel STPS41L30CT STPS41L30CT TO-220AB 2.20 g 50 Tube 1.49 g 50 Tube STPS41L30CR ■ Marking REF. STPS41L30CR 2 I PAK EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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