STMICROELECTRONICS STTH30L06C

STTH30L06C
®
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Table 1: Main Product Characteristics
IF(AV)
Up to 2 x 20 A
A1
VRRM
600 V
A2
Tj
175°C
VF (typ)
0.95 V
trr (max)
55 ns
K
FEATURES AND BENEFITS
■
■
■
■
A1
Ultrafast switching
Low reverse current
Low thermal resistance
Reduces switching & conduction losses
K
A2
A1
TO-220AB
STTH30L06CT
K
A2
TO-247
STTH30L06CW
K
DESCRIPTION
The STTH30L06, which is using ST Turbo 2 600V
technology, is specially suited for use in switching
power supplies, and industrial applications, as
rectification and discontinuous mode PFC boost
diode.
Table 2: Order Codes
Part Number
STTH30L06CT
STTH30L06CW
Marking
STTH30L06CT
STTH30L06CW
A2
A1
D2PAK
STTH30L06CG
Part Number
STTH30L06CG
STTH30L06GG-TR
Marking
STTH30L06CG
STTH30L06CG
Table 3: Absolute Ratings (limiting values, per diode)
Symbol
Parameter
VRRM Repetitive peak reverse voltage
IF(RMS)
RMS forward voltage
IF(AV)
Average forward current
δ = 0.5
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
Tj
Tc = 140°C Per diode
Tc = 125°C Per device
Tc = 120°C Per diode
Tc = 110°C Per device
tp = 10ms sinusoidal
Maximum operating junction temperature
September 2004
REV. 1
Value
600
Unit
V
30
A
15
30
20
40
130
A
A
-65 to + 175
°C
175
°C
1/8
STTH30L06C
Table 4: Thermal Resistance
Symbol
Rth(j-c)
Rth(c)
Parameter
Junction to case
Value (max).
Unit
Per diode
1.7
°C/W
Total
1.15
Coupling
0.6
°C/W
When the diodes 1 and 2 are used simultaneously:
∆ Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
Table 5: Static Electrical Characteristics (per diode)
Symbol
IR *
Parameter
Test conditions
Reverse leakage current Tj = 25°C
Min.
VR = VRRM
Tj = 150°C
VF **
Forward voltage drop
Tj = 25°C
40
IF = 15A
0.95
IF = 30A
Unit
15
µA
400
V
1.2
1.76
Tj = 150°C
Pulse test:
Max.
1.55
Tj = 150°C
Tj = 25°C
Typ
1.15
1.45
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
2
To evaluate the conduction losses use the following equation: P = 0.94 x IF(AV) + 0.017 I F (RMS)
Table 6: Dynamic Characteristics (per diode)
Symbol
Parameter
trr
Reverse recovery
time
Tj = 25°C
IRM
Reverse recovery
current
Tj = 125°C IF = 15A
VR = 400V
dIF/dt = 100 A/µs
tfr
Forward recovery
time
Tj = 25°C
IF = 15A
dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
VFP
Forward recovery
voltage
Tj = 25°C
IF = 15A dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
2/8
Test conditions
Min. Typ Max. Unit
IF = 0.5A Irr = 0.25A IR =1A
IF = 1A dIF/dt = 50 A/µs VR =30V
55
ns
60
85
8.5
12
A
300
ns
3.0
V
STTH30L06C
Figure 1: Conduction losses versus average
forward current (per diode)
Figure 2: Forward voltage drop versus forward
current (per diode)
IFM(A)
P(W)
100
24
δ = 0.1
22
δ = 0.2
δ = 0.5
Tj=150°C
(maximum values)
90
δ = 0.05
20
80
18
70
δ=1
16
14
60
12
50
10
40
8
Tj=25°C
(maximum values)
30
T
6
Tj=150°C
(typical values)
20
4
2
δ=tp/T
IF(AV)(A)
10
tp
0
VFM(V)
0
0
2
4
6
8
10
12
14
16
18
20
Figure 3: Relative variation of thermal
impedance junction to case versus pulse
duration
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Figure 4: Peak reverse recovery current versus
dIF/dt (typical values, per diode)
IRM(A)
Zth(j-c)/Rth(j-c)
35
1.0
VR=400V
Tj=125°C
0.9
IF=2 x IF(AV)
30
0.8
IF=IF(AV)
25
0.7
IF=0.5 x IF(AV)
0.6
20
0.5
15
0.4
0.3
10
T
0.2
Single pulse
5
0.1
δ=tp/T
tp(s)
dIF/dt(A/µs)
tp
0.0
0
1.E-03
1.E-02
1.E-01
1.E+00
Figure 5: Reverse recovery time versus dIF/dt
(typical values, per diode)
0
50
100
150
200
250
300
350
400
450
500
Figure 6: Reverse recovery charges versus
dIF/dt (typical values, per diode)
trr(ns)
Qrr(nC)
1800
800
VR=400V
Tj=125°C
700
VR=400V
Tj=125°C
1600
IF=2 x IF(AV)
1400
600
1200
IF=2 x IF(AV)
500
IF=IF(AV)
1000
400
IF=0.5 x IF(AV)
800
IF=IF(AV)
IF=0.5 x IF(AV)
300
600
200
400
100
200
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
0
50
100
150
200
250
300
350
400
450
500
0
100
200
300
400
500
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STTH30L06C
Figure 7: Reverse recovery softness factor
versus dIF/dt (typical values, per diode)
Figure 8: Relative variations of dynamic
parameters versus junction temperature
S factor
1.6
IF< 2 x IF(AV)
VR=400V
Tj=125°C
1.4
1.4
S factor
1.2
1.2
1.0
1.0
0.8
0.8
QRR
0.6
0.6
IF=IF(AV)
VR=400V
Reference: Tj=125°C
trr
IRM
0.4
0.4
0.2
0.2
dIF/dt(A/µs)
Tj(°C)
0.0
0.0
0
50
100
150
200
250
300
350
400
450
25
500
Figure 9: Transient peak forward voltage
versus dIF/dt (typical values, per diode)
50
75
100
125
Figure 10: Forward recovery time versus dIF/dt
(typical values, per diode)
tfr(ns)
VFP(V)
260
12
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
240
IF=IF(AV)
Tj=125°C
11
220
10
200
9
180
8
160
7
140
6
120
5
100
4
80
3
60
2
40
1
20
dIF/dt(A/µs)
0
dIF/dt(A/µs)
0
0
50
100
150
200
250
300
350
400
450
500
Figure 11: Junction capacitance versus
reverse voltage applied (typical values, per
diode)
0
100
200
300
400
500
Figure 12: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy FR4, eCU=35µm) (D2PAK)
Rth(j-a)(°C/W)
C(pF)
80
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
70
60
50
40
100
30
20
10
SCU(cm²)
VR(V)
10
0
1
4/8
10
100
1000
0
5
10
15
20
25
30
35
40
STTH30L06C
Figure 13: TO-247 Package Mechanical Data
DIMENSIONS
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
4.85
5.15 0.191
0.203
D
2.20
2.60 0.086
0.102
E
0.40
0.80 0.015
0.031
F
1.00
1.40 0.039
0.055
F1
3.00
0.118
F2
2.00
0.078
F3 2.00
2.40 0.078
0.094
F4 3.00
3.40 0.118
0.133
G
10.90
0.429
H 15.45
15.75 0.608
0.620
L 19.85
20.15 0.781
0.793
L1
3.70
4.30 0.145
0.169
L2
18.50
0.728
L3 14.20
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M
2.00
3.00 0.078
0.118
V
5°
5°
V2
60°
60°
Dia. 3.55
3.65 0.139
0.143
REF.
V
Dia.
V
A
H
L5
L
L2 L4
F2
F1
L1
F3
V2
F4
D
L3
F(x3)
M
G
=
=
E
5/8
STTH30L06C
Figure 14: D2PAK Package Mechanical Data
REF.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
Figure 15: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
6/8
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
2.49
2.69
0.098
0.106
0.03
0.23
0.001
0.009
0.70
0.93
0.027
0.037
1.14
1.70
0.045
0.067
0.45
0.60
0.017
0.024
1.23
1.36
0.048
0.054
8.95
9.35
0.352
0.368
10.00
10.40
0.393
0.409
4.88
5.28
0.192
0.208
15.00
15.85
0.590
0.624
1.27
1.40
0.050
0.055
1.40
1.75
0.055
0.069
2.40
3.20
0.094
0.126
0.40 typ.
0.016 typ.
0°
8°
0°
8°
STTH30L06C
Figure 16: TO-220AB Package Mechanical Data
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
Table 7: Ordering Information
Ordering type
Marking
STTH30L06CT
STTH30L06CT
STTH30L06CG
STTH30L06CG
STTH30L06CG-TR
STTH30L06CG
STTH30L06CW
STTH30L06CW
■
■
■
■
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
Package
TO-220AB
D2PAK
D2PAK
TO-247
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
2.40
2.70
0.094
0.106
10
10.40
0.393
0.409
16.4 typ.
0.645 typ.
13
14
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
Weight
2.23 g
1.48 g
1.48 g
4.46 g
Base qty
50
50
1000
50
Delivery mode
Tube
Tube
Tape & eel
Tube
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AB)
Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AB)
Table 8: Revision History
Date
07-Sep-2004
Revision
1
Description of Changes
First issue
7/8
STTH30L06C
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
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