STMICROELECTRONICS STTH30L06G-TR

STTH30L06
®
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Table 1: Main Product Characteristics
IF(AV)
30 A
VRRM
600 V
Tj
175°C
VF (typ)
1.0 V
K
trr (max)
65 ns
TO-220AC
STTH30L06D
FEATURES AND BENEFITS
■
Ultrafast switching
■
Low reverse current
■
Low thermal resistance
■
Reduces switching & conduction losses
A
A
K
DO-247
STTH30L06W
K
A
A
A
DESCRIPTION
The STTH30L06, which is using ST Turbo 2 600V
technology, is specially suited for use in switching
power supplies, and industrial applications, as
rectification and discontinuous mode PFC boost
diode.
K
D2PAK
STTH30L06G
SOD-93
STTH30L06P
A
K
DOP3I
STTH30L06PI
Table 2: Order Codes
Part Number
Marking
STTH30L06D
STTH30L06D
STTH30L06G
STTH30L06G
STTH30L06G-TR
STTH30L06G
STTH30L06W
STTH30L06W
STTH30L06P
STTH30L06P
STTH30L06PI
STTH30L06PI
January 2006
REV. 3
1/9
STTH30L06
Table 3: Absolute Ratings (limiting values)
Symbol
VRRM
IF(RMS)
Parameter
Value
Unit
Repetitive peak reverse voltage
600
V
RMS forward voltage
50
A
30
A
160
A
-65 to + 175
°C
175
°C
TO-220AC / TO-247
IF(AV)
Average forward current / D2PAK / SOT-93
DOP3I
Tc = 95°C
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
Tj
δ = 0.5
Tc = 125°C
δ = 0.5
tp = 10ms sinusoidal
Maximum operating junction temperature
Table 4: Thermal Resistance
Symbol
Rth(j-c)
Parameter
Junction to case
Value (max).
TO-220AC / TO-247 / D2PAK / SOT-93
1.1
DOP3I
1.7
Unit
°C/W
Table 5: Static Electrical Characteristics
Symbol
IR *
Parameter
Test conditions
Reverse leakage current Tj = 25°C
Min.
VR = VRRM
Tj = 150°C
VF **
Forward voltage drop
Tj = 25°C
80
IF = 30A
Max.
Unit
25
µA
800
1.55
Tj = 150°C
Pulse test:
Typ
1.0
V
1.25
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
2
To evaluate the conduction losses use the following equation: P = 0.95 x IF(AV) + 0.010 IF (RMS)
Table 6: Dynamic Characteristics
Symbol
Parameter
trr
Reverse recovery
time
Tj = 25°C
IRM
Reverse recovery
current
Tj = 125°C IF = 30A
VR = 400V
dIF/dt = 100 A/µs
tfr
Forward recovery
time
Tj = 25°C
IF = 30A
dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
VFP
Forward recovery
voltage
Tj = 25°C
IF = 30A dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
2/9
Test conditions
Min. Typ Max. Unit
IF = 0.5A Irr = 0.25A IR =1A
IF = 1A dIF/dt = 50 A/µs VR =30V
65
ns
65
90
11.5
16
A
500
ns
2.5
V
STTH30L06
Figure 1: Conduction losses versus average
forward current
Figure 2: Forward voltage drop versus forward
current
P(W)
IFM(A)
100
50
45
90
δ = 0.5
δ = 0.2
40
35
Tj=150°C
(maximum values)
80
δ = 0.1
70
δ = 0.05
δ=1
30
60
25
50
20
40
15
30
T
Tj=150°C
(typical values)
Tj=25°C
(maximum values)
20
10
5
δ=tp/T
IF(AV)(A)
10
tp
VFM(V)
0
0
0
5
10
15
20
25
30
35
0.00
40
Figure 3: Relative variation of thermal
impedance junction to case versus pulse
duration
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
Figure 4: Peak reverse recovery current
versus dI F /dt (typical values)
IRM(A)
Zth(j-c)/Rth(j-c)
1.0
45
0.9
40
0.8
35
VR=400V
Tj=125°C
IF=2 x IF(AV)
IF=IF(AV)
0.7
30
IF=0.5 x IF(AV)
0.6
25
0.5
20
0.4
15
0.3
10
0.2
Single pulse
0.1
5
tp(s)
0.0
dIF/dt(A/µs)
0
1.E-03
1.E-02
1.E-01
1.E+00
Figure 5: Reverse recovery time versus dIF/dt
(typical values)
0
50
100
150
200
250
300
350
400
450
500
Figure 6: Reverse recovery charges versus
dIF/dt (typical values)
trr(ns)
Qrr(nC)
3500
800
750
700
650
600
550
500
450
400
350
300
250
200
150
100
50
0
VR=400V
Tj=125°C
VR=400V
Tj=125°C
3000
IF=2 x IF(AV)
2500
IF=2 x IF(AV)
IF=IF(AV)
2000
IF=IF(AV)
IF=0.5 x IF(AV)
1500
IF=0.5 x IF(AV)
1000
500
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
50
100
150
200
250
300
350
400
450
500
0
100
200
300
400
500
3/9
STTH30L06
Figure 7: Reverse recovery softness factor
versus dIF/dt (typical values)
Figure 8: Relative variations of dynamic
parameters versus junction temperature
S factor
1.6
1.4
IF< 2 x IF(AV)
VR=400V
Tj=125°C
1.4
S factor
1.2
1.2
1.0
1.0
0.8
0.8
QRR
0.6
0.6
IF=IF(AV)
VR=400V
Reference: Tj=125°C
trr
IRM
0.4
0.4
0.2
0.2
dIF/dt(A/µs)
Tj(°C)
0.0
0.0
0
50
100
150
200
250
300
350
400
450
500
Figure 9: Transient peak forward voltage
versus dIF/dt (typical values)
25
50
75
100
125
Figure 10: Forward recovery time versus dIF/dt
(typical values)
tfr(ns)
VFP(V)
500
10
IF=IF(AV)
Tj=125°C
9
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
450
8
400
7
350
6
300
5
250
4
200
3
150
2
100
1
50
dIF/dt(A/µs)
0
dIF/dt(A/µs)
0
0
50
100
150
200
250
300
350
400
450
500
Figure 11: Junction capacitance versus
reverse voltage applied (typical values)
0
100
200
300
400
500
Figure 12: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy FR4, eCU=35µm) (D2PAK)
Rth(j-a)(°C/W)
C(pF)
80
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
70
60
50
40
100
30
20
10
SCU(cm²)
VR(V)
0
10
1
4/9
10
100
1000
0
5
10
15
20
25
30
35
40
STTH30L06
Figure 13: D2PAK Package Mechanical Data
REF.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
2.49
2.69
0.098
0.106
0.03
0.23
0.001
0.009
0.70
0.93
0.027
0.037
1.14
1.70
0.045
0.067
0.45
0.60
0.017
0.024
1.23
1.36
0.048
0.054
8.95
9.35
0.352
0.368
10.00
10.40
0.393
0.409
4.88
5.28
0.192
0.208
15.00
15.85
0.590
0.624
1.27
1.40
0.050
0.055
1.40
1.75
0.055
0.069
2.40
3.20
0.094
0.126
0.40 typ.
0.016 typ.
0°
8°
0°
8°
Figure 14: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
5/9
STTH30L06
Figure 15: DO-247 Package Mechanical Data
V
Dia.
V
A
H
L5
L
L2 L4
F2
L3
L1
F3
D
V2
F
G
M
E
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
4.85
5.15 0.191
0.203
D
2.20
2.60 0.086
0.102
E
0.40
0.80 0.015
0.031
F
1.00
1.40 0.039
0.055
F2
2.00
0.078
F3 2.00
2.40 0.078
0.094
G
10.90
0.429
H 15.45
15.75 0.608
0.620
L 19.85
20.15 0.781
0.793
L1 3.70
4.30 0.145
0.169
L2
18.50
0.728
L3 14.20
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M
2.00
3.00 0.078
0.118
V
5°
5°
V2
60°
60°
Dia. 3.55
3.65 0.139
0.143
Figure 16: SOD-93 Package Mechanical Data
REF.
A
C
D
D1
E
F
F3
G
H
L
L2
L3
L5
L6
O
6/9
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.70
4.90
0.185
0.193
1.17
1.37
0.046
0.054
2.50 Typ.
0.098 Typ.
1.27 Typ.
0.050 Typ.
0.50
0.78
0.020
0.031
1.10
1.30
0.043
0.051
1.75 Typ.
0.069 Typ
10.80
11.10
0.425
0.437
14.70
15.20
0.578
0.598
12.20
0.480
16.20
0.638
18.0 Typ
0.709 Typ.
3.95
4.15
0.156
0.163
31.00 Typ.
1.220 Typ.
4.00
4.10
0.157
0.161
STTH30L06
Figure 17: SOD-93 Package Mechanical Data
DIMENSIONS
REF.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.4
4.6
0.173
0.181
B
1.45
1.55
0.057
0.061
C
14.35
15.60
0.565
0.614
D
0.5
0.7
0.020
0.028
E
2.7
2.9
0.106
0.114
F
15.8
16.5
0.622
0.650
G
20.4
21.1
0.815
0.831
H
15.1
15.5
0.594
0.610
K
3.4
3.65
0.134
0.144
L
4.08
4.17
0.161
0.164
N
10.8
11.3
0.425
0.444
P
1.20
1.40
0.047
0.055
R
4.60 typ.
0.181 typ.
7/9
STTH30L06
Figure 18: TO-220AC Package Mechanical Data
REF.
H2
A
A
C
D
E
F
F1
G
H2
L2
L4
L5
L6
L7
L9
M
Diam. I
C
L5
L7
ØI
L6
L2
D
L9
F1
L4
M
F
E
G
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
10.00
10.40
0.393
0.409
16.40 typ.
0.645 typ.
13.00
14.00
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
Table 7: Ordering Information
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STTH30L06D
STTH30L06D
TO-220AC
STTH30L06G
STTH30L06G
1.90 g
50
Tube
2
1.48 g
50
Tube
2
D PAK
STTH30L06G-TR
STTH30L06G
D PAK
1.48 g
1000
Tape & reel
STTH30L06W
STTH30L06W
DO-247
4.40 g
30
Tube
STTH30L06P
STTH30L06P
SOD-93
3.79 g
30
Tube
STTH30L06P
STTH30L06P
DOP3I
4.46 g
30
Tube
■
■
■
■
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AC)
Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AC)
Table 8: Revision History
8/9
Date
Revision
Description of Changes
07-Sep-2004
1
First issue.
21-Oct-2004
2
DOP3I package added.
11-Jan-06
3
Table 3 on page 2:
. IF(RMS) corrected from 30A to 50A
. IF(AV) corrected from 50A to 30A
STTH30L06
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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