TDA2008 12W AUDIO AMPLIFIER (Vs = 22V, RL = 4Ω) DESCRIPTION The TDA2008 is a mololithic class B audio power amplifier in Pentawatt package designed for driving low impedence loads (down to 3.2Ω). The divice provides a high output current capability(up to 3A), very low harmonic and crossover distortion. In addition,the device offers the following features: – very low number of external components; – assembly ease, due to Pentawatt power package with no electrical insulations requirements; – space and cost saving; – high reliability; – flexibility in use; – thermal protection. Pentawatt ORDERING NUMBER : TDA 2008V TYPICAL APPLICATION CIRCUIT March 1993 1/9 TDA2008 PIN CONNECTION (top view) ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit Vs DC supply voltage 28 V Io Output peak current (repetitive) 3 A Io Output peak current ( non repetitive) 4 A Ptot Power dissipation at Tcase = 90°C 20 W Tstg, Tj Storage and junction temperature - 40 to 150 °C SCHEMATIC DIAGRAM 2/9 TDA2008 DC TEST CIRCUIT AC TEST CIRCUIT 3/9 TDA2008 THERMAL DATA Symbol Rth-j-case Parameter Thermal resistance junction-case max Value Unit 3 °C/W ELECTRICAL CHARACTERISTICS ( Refer to the test circuit, Vs = 18V, Tamb = 25 °C unless otherwise specified) Symbol Vs Supply voltage Vo Quiescent output voltage (pin 4) Id Quiescent drain current (pin 5) Po Output power Vi(RMS) Vi Test conditions 65 d = 10% RL = 8Ω f = 1 KHz RL = 4Ω f = 1 KHz Po = 0.5W Po = 8W Po = 0.5W Po = 12W Po = 1W RL = 4Ω d Distortion f = 1 KHz Po = 0.05 to 4W Po = 0.05 to 6W Input resistance (pin 1) Gv Voltage gain (open loop) Gv Voltage gain (closed loop) eN Input noise voltage iN Input noise current Supply voltage rejection Max. Unit 28 V 10 V 115 RL RL RL RL = 8Ω = 8Ω = 4Ω = 4Ω RL = 8Ω RL = 4Ω f = 1 KHz W 12 W f = 1 KHz RL = 8Ω 39.5 BW = 22Hz to 22 KHz Vripple = 0.5 Rg = 10KΩ RL = 4Ω f = 100 Hz mV 20 80 14 70 mV mV mV mV 40 to 15,000 Hz 0.12 0.12 70 30 mA 8 300 Frequency response (-3 dB) Ri Typ. 10.5 Input saturation voltage Input sensitivity Min. 10 B SVR 4/9 Parameter 1 1 % % 150 KΩ 80 dB 40 40.5 dB 1 5 µV 60 200 pA 36 dB TDA2008 APPLICATION INFORMATION Figure 1. Typical application circuit Figure 2. P.C. board and component layout for the circuit of fig. 1 (1:1 scale) Figure 3. 25W bridge configuration applica- tion Figure 4. P.C. board and component layout for the circuit (°) circuit of fig. 3 (1:1 scale) (°) The value of the capacitorr C3 and C4 are different to optimize the SVR (Typ. = 40 dB) 5/9 TDA2008 Figure 5. Quiescent current vs. supply voltage Figure 6. Output voltage vs. supply voltage Figure 7. Output power vs. supply voltage Fi gur e 8 . Di stor ti on vs. frequency Figure 9. Supply voltage rejection vs. frequency Figure 10. Maximum al- lowable power dissipation vs. ambient temperature 6/9 TDA2008 PRACTICAL CONSIDERATIONS Printed circuit board The layout shown in Fig. 2 is recommended. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground of the output through which a rather high current flows. Assembly suggestion No electrical insulation is needed between the package and the heat-sink. Pin length should be as short as possible. The soldering temperature must not exceed 260°C for 12 seconds. Application suggestions The recommended component values are those shown in the application circuits of Fig. 1. Different values can be used. The following table is intended to aid the car-radio designer. Component Recommended value C1 2.2µF Input DC decoupling Noise at switch-on, switch-off C2 470µF Ripple rejection. Degradation of SVR. C3 0.1µF Supply by passing. Danger of oscillation. C4 1000µF Output coupling. Higher low frequency cutoff. C5 0.1µF Frequency stability. Danger of oscillation at high frequencies with inductive loads. R1 (Gv - 1) • R2 Setting of gain. (*) Increase of drain current. R2 2.2Ω Setting of gain and SVR. Degradation of SVR. R3 1Ω Frequency stability. Danger of oscillation at high frequencies with inductive loads. Purpose Larger than recommended value Smaller than recommended value (*) The closed loop gain must be higher than 26dB. 7/9 TDA2008 PENTAWATT PACKAGE MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. A MIN. TYP. 4.8 C 1.37 D 0.054 2.4 2.8 0.094 0.110 D1 1.2 1.35 0.047 0.053 E 0.35 0.55 0.014 0.022 F 0.8 1.05 0.031 0.041 F1 1 1.4 0.039 0.055 G 3.4 0.126 0.134 0.142 G1 6.8 0.260 0.268 0.276 H2 H3 10.4 10.05 0.409 10.4 0.396 0.409 L 17.85 0.703 L1 15.75 0.620 L2 21.4 0.843 L3 22.5 0.886 L5 2.6 3 0.102 0.118 L6 15.1 15.8 0.594 0.622 L7 6 6.6 0.236 M 0.260 4.5 M1 0.177 4 Dia 0.157 3.65 3.85 0.144 0.152 E L D1 C D M A M1 L1 L2 G L7 L6 F H2 F1 Dia. G1 L3 H3 L5 8/9 MAX. 0.189 TDA2008 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A. 9/9