VN02HSP ® HIGH SIDE SMART POWER SOLID STATE RELAY TYPE V DSS R DS(on ) I OUT V CC VN02HSP 60 V 0.4 Ω 6A 36 V ■ ■ ■ ■ ■ ■ OUTPUT CURRENT (CONTINUOUS): 6A @ Tc=25oC 5V LOGIC LEVEL COMPATIBLE INPUT THERMAL SHUT-DOWN UNDER VOLTAGE SHUT-DOWN OPEN DRAIN DIAGNOSTIC OUTPUT VERY LOW STAND-BY POWER DISSIPATION DESCRIPTION The VN02HSP is a monolithic devices made using STMicroelectronics VIPower Technology, intended for driving resistive or inductive loads with one side grounded. Built-in thermal shut-down protects the chip from over temperature and short circuit. The input control is 5V logic level compatible. The open drain diagnostic output indicates open circuit (no load) and over temperature status. 10 1 PowerSO-10 BLOCK DIAGRAM August 1998 1/8 VN02HSP ABSOLUTE MAXIMUM RATING Symbol Parameter V (BR)DSS Drain-Source Breakdown Voltage Unit 60 V Output Current (cont.) 6 A IR Reverse Output Current -6 A I IN Input Current ±10 mA I OUT -V CC Reverse Supply Voltage I STAT Status Current V ESD Electrostatic Discharge (1.5 kΩ, 100 pF) P tot Tj T stg o Power Dissipation at T c ≤ 25 C -4 V ±10 mA 2000 V 29 W Junction Operating Temperature -40 to 150 o Storage Temperature -55 to 150 o CONNECTION DIAGRAMS CURRENT AND VOLTAGE CONVENTIONS 2/8 Value C C VN02HSP THERMAL DATA R thj-case R thj-amb Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max Max o 4.35 50 o C/W C/W ELECTRICAL CHARACTERISTICS (VCC = 9 to 36 V; -40 ≤ Tj ≤ 125 oC unless otherwise specified) POWER Symbol Parameter Test Conditions VCC Supply Voltage see note 1 R on On State Resistance I OUT = 3 A I OUT = 3 A Supply Current Off State On State IS Min. Typ. 5 T j = 25 o C o T j ≥ 25 C Max. Unit 36 V 0.8 0.4 Ω Ω 50 20 µA mA SWITCHING Symbol Parameter Test Conditions Min. Typ. Max. Unit t d(on) Turn-on Delay Time Of Output Current I OUT = 3 A Resistive Load Input Rise Time < 0.1 µs T j = 25 o C 5 10 20 µs Rise Time Of Output Current I OUT = 3 A Resistive Load Input Rise Time < 0.1 µs T j = 25 o C 5 15 45 µs Turn-off Delay Time Of Output Current I OUT = 3 A Resistive Load Input Rise Time < 0.1 µs T j = 25 o C 5 15 30 µs Fall Time Of Output Current I OUT = 3 A Resistive Load Input Rise Time < 0.1 µs T j = 25 o C 2 6 15 µs (di/dt) on Turn-on Current Slope I OUT = 3 A I OUT = IOV 25 ≤ T j ≤ 140 o C 0.05 0.15 0.5 2 A/µs A/µs (di/dt) off Turn-off Current Slope I OUT = 3 A I OUT = IOV 25 ≤ T j ≤ 140 o C 0.1 0.4 2 4 A/µs A/µs V demag Inductive Load Clamp Voltage I OUT = 3 A L = 1 mH -7 -4 -2 V Min. Typ. Max. Unit 0.8 V (*) V tr t d(off) tf LOGIC INPUT Symbol Parameter V IL Input Low Level Voltage VIH Input High Level Voltage V I(hyst.) Input Hysteresis Voltage I IN V ICL Test Conditions 2 0.5 Input Current V IN = 5 V Input Clamp Voltage I IN = 10 mA I IN = -10 mA 5.5 V 250 500 µA 6 -0.7 -0.3 V V 3/8 VN02HSP ELECTRICAL CHARACTERISTICS (continued) PROTECTION AND DIAGNOSTICS Symbol V STAT (•) V USD V SCL (•) Parameter Status Voltage Output Low Test Conditions Under Voltage Shut Down Status Clamp Voltage Min. Typ. Max. Unit 0.4 V 5 V 6 -0.7 -0.3 V V 1.5 5 ms 28 A 1.8 A 70 mA 60 µA I STAT = 1.6 mA 2.5 I STAT = 10 mA I STAT = -10 mA 5.5 t SC Switch-off Time in Short Circuit Condition at Start-Up R LOAD < 10 mΩ T c = 25 o C V CC = 13 V I OV Over Current R LOAD < 10 mΩ V CC = 13 V I AV Average Current in Short Circuit R LOAD < 10 mΩ T c = 85 o C V CC = 13 V I OL Open Load Current Level 9 < VCC < 32 V I OUT Leakage Current Off State T TSD Thermal Shut-down Temperature 140 160 o C TR Reset Temperature 125 145 o C 0.9 5 V OUT = 0 V (*) The VIH is internally clamped at 6V about. It is possible to connect this pin to an higher voltage via an external resistor calculated to not exceed 10 mA at the input pin. (•) Status determination > 100 ms after the switching edge. Note 1 : Above VCC = 36 V the output voltage is clamped to 36 V. Power dissipation increases and the device turns off if junction temperature reaches thermal shutdown temperature. FUNCTIONAL DESCRIPTION The device has a diagnostic output which indicates open circuit (no load) and over temperature conditions. The output signals are processed by internal logic. To protect the device against short circuit and over-current condition the thermal protection turns the integrated Power MOS off at a minimum junction temperature of 140 oC. When the temperature returns to about 125 oC the switch is automatically turned on again. To ensur the protection in all VCC conditions and in all the junction temperature range it is necessary to limit the voltage drop across Drain and Source (pin 3 and 5) at 29 V. The device is able to withstand a load dump according the test pulse 5 at level III of the ISO TR/1 7631. Above VCC = 36V the output voltage is clamped to 36V. Power dissipation increases and the device turns off if junction temperature reaches thermal shutdown temperature. PROTECTING THE DEVICE AGAINST REVERSE BATTERY The simplest way to protect the device against a continuous reverse battery voltage (-26V) is to 4/8 insert a Schottky diode between pin 1 (GND) and ground, as shown in the typical application circuit (fig. 3). The consequences of the voltage drop across this diode are as follows: - If the input is pulled to power GND, a negative voltage of -VF is seen by the device. (VIL, VIH thresholds and VSTAT are increased by VF with respect to power GND). - The undervoltage shutdown level is increased by VF. If there is no need for the control unit to handle external analog signals referred to the power GND, the best approach is to connect the reference potential of the control unit to node [1] (see application circuit infig. 4), which becomes the common signal GND for the whole control board. In this way no shift of VIH, VIL and VSTAT takes place and no negative voltage appears on the INPUT pin; this solution allows the use of a standard diode, with a breakdown voltage able to handle any ISO normalized negative pulses that occours in the automotive environment. VN02HSP TRUTH TABLE INPUT OUTPUT DIAGNOSTIC Normal Operation L H L H H H Open Circuit (No Load) L H L H H L Over-temperature L H L H H L Under-voltage L H L L H H Figure 1: Waveforms Figure 2: Over Current Test Circuit 5/8 VN02HSP Figure 3: Typical Application Circuit With A Schottky Diode For Reverse Supply Protection Figure 4: Typical Application Circuit With Separate Signal Ground 6/8 VN02HSP PowerSO-10 MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 3.35 3.65 0.132 0.144 A1 0.00 0.10 0.000 0.004 B 0.40 0.60 0.016 0.024 c 0.35 0.55 0.013 0.022 D 9.40 9.60 0.370 0.378 D1 7.40 7.60 0.291 0.300 E 9.30 9.50 0.366 0.374 E1 7.20 7.40 0.283 0.291 E2 7.20 7.60 0.283 0.300 E3 6.10 6.35 0.240 0.250 E4 5.90 6.10 0.232 e 1.27 0.240 0.050 F 1.25 1.35 0.049 0.053 H 13.80 14.40 0.543 0.567 1.80 0.047 h 0.50 L 0.002 1.20 q 1.70 α 0.071 0.067 0o 8o B 0.10 A B 10 = E4 = = = E1 = E3 = E2 = E = = = H 6 = = 1 5 B e 0.25 SEATING PLANE DETAIL "A" A C M Q D h = D1 = = = SEATING PLANE A F A1 A1 L DETAIL "A" α 0068039-C 7/8 VN02HSP Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1998 STMicroelectronics – Printed in Italy – All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. . 8/8