STMICROELECTRONICS VN02NSP

VN02NSP
VN02NPT
HIGH SIDE SMART POWER SOLID STATE RELAY
PRELIMINARY DATA
TYPE
V DSS
R DS(on )
I OUT
V CC
VN02NSP
60 V
0.4 Ω
6A
26 V
VN02NPT
60 V
0.4 Ω
6A
26 V
■
■
■
■
■
■
OUTPUT CURRENT (CONTINUOUS):
6A @ Tc=25oC
5V LOGIC LEVEL COMPATIBLE INPUT
THERMAL SHUT-DOWN
UNDER VOLTAGE SHUT-DOWN
OPEN DRAIN DIAGNOSTIC OUTPUT
VERY LOW STAND-BY POWER
DISSIPATION
DESCRIPTION
The VN02NSP/VN02NPT are monolithic devices
made using SGS-THOMSON Vertical Intelligent
Power Technology, intended for driving resistive
or inductive loads with one side grounded.
Built-in thermal shut-down protects the chip from
over temperature and short circuit.
The input control is 5V logic level compatible.
10
1
PowerSO-10TM
PPAK
The open drain diagnostic output indicates open
circuit (no load) and over temperature status.
BLOCK DIAGRAM
September 1997
1/10
VN02NSP/VN02NPT
ABSOLUTE MAXIMUM RATING
Symbol
Parameter
V (BR)DSS
Drain-Source Breakdown Voltage
Value
PowerSO-10
PPAK
60
V
Output Current (cont.)
6
A
IR
Reverse Output Current
-6
A
I IN
Input Current
±10
mA
-4
V
±10
mA
2000
V
I OUT
-V CC
Reverse Supply Voltage
I STAT
Status Current
V ESD
Electrostatic Discharge (1.5 kΩ, 100 pF)
P tot
Power Dissipation at T c ≤ 25 C
Tj
Junction Operating Temperature
T stg
o
Storage Temperature
CONNECTION DIAGRAMS
CURRENT AND VOLTAGE CONVENTIONS
2/10
Unit
58
46
W
-40 to 150
o
C
-55 to 150
o
C
VN02NSP/VN02NPT
THERMAL DATA
R thj-case
R thj-amb
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient ($)
PowerSO-10
PPAK
2.14
62.5
3.33
100
Max
Max
o
o
C/W
C/W
($) When mounted using minimum recommended pad size on FR-4 board
ELECTRICAL CHARACTERISTICS (VCC = 13 V; -40 ≤ Tj ≤ 125 oC unless otherwise specified)
POWER
Symbol
Parameter
Test Conditions
VCC
Supply Voltage
R on
On State Resistance
I OUT = 3 A
I OUT = 3 A
Supply Current
Off State
On State
IS
Min.
Typ.
7
T j = 25 o C
T j ≥ 25 o C
Max.
Unit
26
V
0.8
0.4
Ω
Ω
50
15
µA
mA
Max.
Unit
SWITCHING
Symbol
Parameter
Test Conditions
t d(on)
Turn-on Delay Time Of
Output Current
I OUT = 3 A Resistive Load
o
Input Rise Time < 0.1 µs T j = 25 C
10
µs
Rise Time Of Output
Current
I OUT = 3 A Resistive Load
o
Input Rise Time < 0.1 µs T j = 25 C
15
µs
Turn-off Delay Time Of
Output Current
I OUT = 3 A Resistive Load
o
Input Rise Time < 0.1 µs T j = 25 C
15
µs
Fall Time Of Output
Current
I OUT = 3 A Resistive Load
o
Input Rise Time < 0.1 µs T j = 25 C
6
µs
(di/dt) on
Turn-on Current Slope
I OUT = 3 A
I OUT = IOV
0.5
2
A/µs
A/µs
(di/dt) off
Turn-off Current Slope
I OUT = 3 A
I OUT = IOV
2
4
A/µs
A/µs
Max.
Unit
0.8
V
(*)
V
tr
t d(off)
tf
Min.
Typ.
LOGIC INPUT
Symbol
Parameter
V IL
Input Low Level
Voltage
VIH
Input High Level
Voltage
V I(hyst.)
Input Hysteresis
Voltage
I IN
V ICL
Test Conditions
Min.
Typ.
2
0.5
Input Current
V IN = 5 V
250
Input Clamp Voltage
I IN = 10 mA
I IN = -10 mA
6
-0.7
V
500
µA
V
V
3/10
VN02NSP/VN02NPT
ELECTRICAL CHARACTERISTICS (continued)
PROTECTION AND DIAGNOSTICS
Symbol
V STAT (•)
V USD
Parameter
Status Voltage Output
Low
Test Conditions
Min.
Typ.
I STAT = 1.6 mA
Under Voltage Shut
Down
Unit
0.4
V
6.5
V
V
V
V SCL ()
Status Clamp Voltage
I STAT = 10 mA
I STAT = -10 mA
6
-0.7
t SC
Switch-off Time in
Short Circuit Condition
at Start-Up
R LOAD < 10 mΩ T c = 25 o C
1.5
I OV
Over Current
R LOAD < 10 mΩ -40 T c 125 o C
o
Max.
5
ms
28
A
0.9
A
I AV
Average Current in
Short Circuit
I OL
Open Load Current
Level
5
T TSD
Thermal Shut-down
Temperature
140
o
C
TR
Reset Temperature
125
o
C
R LOAD < 10 mΩ T c = 85 C
70
mA
(*) The VIH is internally clamped at 6V about. It is possible to connect this pin to an higher voltage via an external resistor calculated to not
exceed 10 mA at the input pin. @NOTE = () Status determination > 100 µs after the switching edge.
FUNCTIONAL DESCRIPTION
The device has a diagnostic output which
indicates open circuit (no load) and over
temperature conditions. The output signals are
processed by internal logic.
To protect the device against short circuit and
over-current condition, the thermal protection
turns the integrated Power MOS off at a minimum
junction temperature of 140 oC. When the
temperature returns to about 125 oC the switch is
automatically turned on again.
In short circuit conditions the protection reacts
with virtually no delay, the sensor being located in
the region of the die where the heat is generated.
PROTECTING
THE
DEVICE
AGAINST
REVERSE BATTERY
The simplest way to protect the device against a
continuous reverse battery voltage (-26V) is to
insert a Schottky diode between pin 1 (GND) and
ground, as shown in the typical application circuit
(fig. 3).
4/10
The consequences of the voltage drop across
this diode are as follows:
- If the input is pulled to power GND, a negative
voltage of -VF is seen by the device. (VIL, VIH
thresholds and VSTAT are increased by VF with
respect to power GND).
The undervoltage shutdown level is increased by
VF.
If there is no need for the control unit to handle
external analog signals referred to the power
GND, the best approach is to connect the
reference potential of the control unit to node [1]
(see application circuit infig. 4), which becomes
the common signal GND for the whole control
board.
In this way no shift of VIH, VIL and VSTAT takes
place and no negative voltage appears on the
INPUT pin; this solution allows the use of a
standard diode, with a breakdown voltage able to
handle any ISO normalized negative pulses that
occours in the automotive environment.
VN02NSP/VN02NPT
TRUTH TABLE
INPUT
OUTPUT
DIAGNOSTIC
Normal Operation
L
H
L
H
H
H
Open Circuit (No Load)
H
H
L
Over-temperature
H
L
L
Under-voltage
X
L
H
Figure 1: Waveforms
Figure 2: Over Current Test Circuit
5/10
VN02NSP/VN02NPT
Figure 3: Typical Application Circuit With A Schottky Diode For Reverse Supply Protection
Figure 4: Typical Application Circuit With Separate Signal Ground
6/10
VN02NSP/VN02NPT
RDS(on) vs Junction Temperature
RDS(on) Vs Supply Voltage
RDS(on) Vs Output Current
Input Voltage vs Junction Temperature
Output Current Derating
Open Load vs Junction Temperature
7/10
VN02NSP/VN02NPT
PowerSO-10 MECHANICAL DATA
mm
DIM.
MIN.
inch
MAX.
MIN.
A
3.35
TYP.
3.65
0.132
0.144
A1
0.00
0.10
0.000
0.004
B
0.40
0.60
0.016
0.024
c
0.35
0.55
0.013
0.022
D
9.40
9.60
0.370
0.378
D1
7.40
7.60
0.291
0.300
E
9.30
9.50
0.366
0.374
E1
7.20
7.40
0.283
0.291
E2
7.20
7.60
0.283
0.300
E3
6.10
6.35
0.240
0.250
E4
5.90
6.10
0.232
e
1.27
TYP.
MAX.
0.240
0.050
F
1.25
1.35
0.049
0.053
H
13.80
14.40
0.543
0.567
1.80
0.047
h
0.50
L
0.002
1.20
q
1.70
α
0.071
0.067
0o
8o
B
0.10 A B
10
=
E4
=
=
=
E1
=
E3
=
E2
=
E
=
=
=
H
6
=
=
1
5
B
e
0.25
SEATING
PLANE
DETAIL "A"
A
C
M
Q
D
h
= D1 =
=
=
SEATING
PLANE
A
F
A1
A1
L
DETAIL "A"
α
0068039-C
8/10
VN02NSP/VN02NPT
PPAK MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.5
0.019
B2
5.2
5.4
0.204
0.212
C
0.45
0.53
0.017
0.021
C2
0.5
0.019
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
5.08
0.200
G1
2.54
0.100
H
9.35
10.1
L2
0.368
0.8
L4
0.397
0.031
0.6
1
0.023
0.039
A1
C2
A
H
A2
C
DETAIL "A"
L2
D
=
G
=
=
G1
1
=
2
=
=
=
E
=
B2
3
B
DETAIL "A"
L4
9/10
VN02NSP/VN02NPT
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
© 1997 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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