FREESCALE 33781

Freescale Semiconductor
Advance Information
Document Number: MC33781
Rev. 5.0, 11/2009
Quad DSI 2.02 Master with
Differential Drive and
Frequency Spreading
33781
The 33781 is a master device for four differential DSI 2.02 buses.
It contains the logic to interface the buses to a standard serial
peripheral interface (SPI) port and the analog circuitry to drive data
and power over the bus, as well as receive data from the remote slave
devices.
The differential mode of the 33781 generates lower
electromagnetic interference (EMI) in situations where data rates and
wiring make this a problem. Frequency spreading further reduces
interference by spreading the energy across many frequencies,
reducing the energy in any single frequency.
DIFFERENTIAL DSI 2.02 MASTER
EK SUFFIX (PB-FREE)
98ASA10556D
32-PIN SOICW EP
Features
• Four independent differential DSI (DBUS) channels
• Dual SPI interface
• Enhanced bus fault performance
• Automatic message cyclical redundancy checking (CRC)
generation and checking for each channel
• Enhanced register set with addressable buffer allows queuing of 4
independent slave commands at one time for each channel
• 8- to 16-Bit messages with 0- to 8-Bit CRC
• Independent frequency spreading for each channel
• Pseudo bus switch feature on channel 0
• Pb-free packaging designated by suffix code EK
+5.0V
VCC
DPH
CS0
DPL
MOSI
MOSI0
D0H
MISO
MISO0
D0L
RST
RST
D1H
CLK
CLK
D1L
VDD
D2H
VSS_IDDQ
D2L
SCLK1
SCLK1
D3H
MISO1
MISO1
D3L
CS1
CS1
AGND
CS
MCU1
GND
MCU2
VSUP1
SCLK0
SCLK
0.1μF
GND
Device
Temperature
Range (TA)
Package
MCZ33781EK/R2
-40°C to 90°C
32 SOICW EP
+25V
33781
VCC
ORDERING INFORMATION
VSS
GND
1.0μF
DBUS SLAVE
DBUS SLAVE
DBUS SLAVE
DBUS SLAVE
DBUS SLAVE
2.2nF capacitors from DOH, D0L,
D1H, D1L, D2H, D2L, D3H and D3L
to circuit ground are required for
proper operation
Figure 1. 33781 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VSUP1
VCC
VDD
2.5 V Regulator
DSIF
DSIS
DSIR
Protocol Engine
CLK
Spreader
VSS_IDDQ
AGND
DSIF
DSIS
Pseudo Bus Switch
DPH
DBUS
Driver/Receiver
D0H
Pseudo Bus Switch
DPL
DBUS
Driver/Receiver
DSIR
DSIF
DSIS
TESTIN
DSIR
TESTOUT
VSUP2
DBUS
Driver/Receiver
D0L
D1H
D1L
D2H
D2L
DSIF
DSIS
SCLK0
MISO0
MOSI0
SPI0,
Registers and
State Machine
CS0
DSIR
D3L
GND
GND
SCLK1
CS1
D3H
TLIM
RST
MISO1
DBUS
Driver/Receiver
SPI1,
Registers and
State Machine
GND
VSS
Figure 2. 33781 Internal Block Diagram
33781
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
RST
SCLK0
MOSI0
MISO0
SCLK1
MISO1
CS0
AGND
CS1
VSS
VDD
VPP
VCC
CLK
TESTIN
TESTOUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
GND
DPL
D0L
DPH
D0H
VSUP1
D1H
D1L
GND
D2L
D2H
VSUP2
D3H
D3L
GND
VSS_IDDQ
Figure 3. 33781 Pin Connections
Table 1. 33781 Pin Definitions
A functional description of each Pin can be found in the Functional Pin Descriptions section beginning on page 15.
Pin
Pin Name
Pin Function
Formal Name
Definition
1
RST
Reset
IC Reset
A low level on this pin returns all registers to a known state as indicated
in the sections entitled SPI0 Register and Bit Descriptions and SPI1
Communications.
2
SCLK0
Input
SPI0 Serial Data Clock Clocks data in from and out to SPI0. MISO0 data changes on the negative
transition of SCLK0. MOSI0 is sampled on the positive edge of SCLK0.
3
MOSI0
Input
SPI0 Master Out Slave SPI data into SPI0. This data input is sampled on the positive edge of
SCLK0
In
4
MISO0
Output
5
SCLK1
Input
6
MISO1
Output
SPI1 Master In Slave
Out
SPI1 data sent to the MCU by this device. This data output changes on
the negative edge of SCLK1. When CS1 is high, this Pin is highimpedance.
7
CS0
Input
SPI0 Chip Select
When this signal is high, SPI signals on SPI0 are ignored. Asserting this
pin low starts an SPI0 transaction. The SPI0 transaction is signaled as
completed when this signal returns high.
8
AGND
Ground
Analog Ground
Ground for the analog circuits. This pin is not connected internally to the
other grounds on the chip. It should be connected to a quiet ground on
the board.
9
CS1
Input
SPI1 Chip Select
When this signal is high, SPI signals on SPI1 are ignored. Asserting this
pin low starts an SPI1 transaction. The SPI1 transaction is signaled as
completed when this signal returns high.
10
VSS
Ground
Digital Ground
Digital ground connected internally to the other on-chip grounds. This
ground is connected to circuits that will consume current during IDDQ
testing.
11
VDD
Power
Digital Voltage
Output of the Internal 2.5V regulator for the digital circuits. No external
current draw is allowed from this pin.
SPI0 Master In Slave
Out
SPI0 data sent to the MCU by this device. This data output changes on
the negative edge of SCLK0. When CS0 is high, this Pin is highimpedance.
SPI1 Serial Data Clock Clocks data out from SPI1. MISO1 data changes on the negative
transition of SCLK1.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
Table 1. 33781 Pin Definitions
A functional description of each Pin can be found in the Functional Pin Descriptions section beginning on page 15.
Pin
Pin Name
Pin Function
Formal Name
12
VPP
Input
Test Mode
13
VCC
Input
Logic Supply
Regulated 5V input
14
CLK
Input
Clock Input
4.0MHz clock input
15
TESTIN
Test
Test Input
Input pin for device test. This pin must be tied to ground in the application.
16
TESTOUT
Test
Test Output
17
VSS_IDDQ
Ground
Digital Ground and
IDDQ Test
18
GND
Ground
Power Ground
Bus power return
19
D3L
Output Driver
Low Side Bus 3
Bus 3 low side
20
D3H
Output Driver
High Side Bus 3
Bus 3 high side
21
VSUP2
Power
Positive Supply for
Bus Outputs
22
D2H
Output Driver
High Side Bus 2
Bus 2 high side
23
D2L
Output Driver
Low Side Bus 2
Bus 2 low side
24
GND
Ground
Power Ground
Bus power return
25
D1L
Output Driver
Low Side Bus 1
Bus 1 low side
26
D1H
Output Driver
High Side Bus 1
Bus 1 high side
27
VSUP1
Power
Positive Supply for
Bus Outputs
28
D0H
Output Driver
High Side Bus 0
29
DPH
Output Driver High Side Pseudo Bus Pseudo Bus high side
30
D0L
Output Driver
31
DPL
Output Driver Low Side Pseudo Bus Pseudo Bus low side
32
GND
Ground
Low Side Bus 0
Power Ground
Definition
A high-voltage on this pin puts the device in test mode for IC
manufacturing test. It must be grounded in the application.
Output pin for device test. This pin is left floating in the application.
Ground reference for the digital circuits that should not consume current
during IDDQ testing. This ground is not connected to the other grounds
internally.
This supply input is used to provide the positive level output of buses 2
and 3.
This supply input is used to provide the positive level output of buses 0
and 1.
Bus 0 high side
Bus 0 low side
Bus power return
33781
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to GND unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltages
V
VSUPn
VSUP1 and
-0.3 to 26.5
VSUP2
VSUPLD
40
VCC
VCC
VDD
-0.3 to 7.0
VDD
VPP
-0.3 to 3.1
VPP
-0.3 to 10.0
–
-0.3 to VCC + 0.3
V
Maximum Voltage on DBUS Pins
VDBUS
-0.3 to VSUPn + 0.3
V
Maximum DBUS Pin Current
IDBUS
400
mA
Maximum Logic Pin Current
ILOGIC
20
mA
VESD
±2000
Load Dump VSUPn (300ms maximum - either pin)
Maximum Voltage on Logic Input/Output Pins
ESD
Voltage(1)
V
Human Body Model (HBM)
Machine Model (MM)
±200
Charge Device Model (CDM)
Corner pins
±750
All other pins
±500
THERMAL RATINGS
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-40 to 90
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Thermal Shutdown (Bus Drivers and Pseudo Bus Switch)
TSD
155 to 190
°C
Resistance, Junction-to-Ambient
RθJA
71
°C/W
Resistance, Junction-to-Board
RθJB
6
°C/W
TSOLDER
260
°C
TPPRT
Note 3
°C
Soldering Reflow Temperature
(2) (3)
Peak Package Reflow Temperature During Reflow ,
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500Ω); ESD2 testing is performed
in accordance with the Machine Model (MM) (CZAP = 200pF, RZAP = 0Ω); and Charge Body Model (CBM).
2.
3.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 4.75V ≤ VCC ≤ 5.25V, 9.0V ≤ VSUPn ≤ 25V,-40°C ≤ TA ≤ 90°C, unless otherwise
noted. Voltages relative to GND, unless otherwise noted. Typical values noted reflect the approximate mean values of the
parameter at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
High Z
–
–
16
Signal, Idle (Ibus = 0)
–
–
33
–
–
61
Unit
POWER INPUT REQUIREMENTS (VSUPn, VCC)
IVSUPT Supply Current (Test Mode, CLK = 4.0MHz)
IVSUPT
Signal, Idle (Ibus = 10mA on all channels, a total of 40mA)
IVCC Supply Current (CLK = 4.0MHz, RST = high)
mA
IVCC
mA
Signal, Idle (Ibus = 0)
–
–
10.0
Signal, Idle (Ibus = 10mA on all channels, a total of 40mA)
–
–
12.0
VVSUPnLO
9.1
–
9.9
V
tMASK
20
–
25
μs
VIH
2.0
-
VCC +0.3
Input Low Voltage
VIL
-0.3
-
1.0
Input Hysteresis(4)
VHYST
0.1
-
0.5
–
–
10
–
–
20
VSUPn Low Detect Threshold
Vcc > 4.75V
VSUPn Low Mask Time
Vcc > 4.75V
MICROCONTROLLER INTERFACE (RST, CSn, MOSI0, MISOn, SCLKn, and CLK)
I/O Logic Levels (RST, CSn, MOSI0, SCLKn, and CLK)
Input High Voltage
Input
Capacitance(4)
V
CI
CSn, MOSI0, and SCLKn
RST and CLK
Output Low Voltage
VOL
MISOn Pin = 0.3mA
Output High Voltage
V
0
–
0.8
VOH
MISOn Pin = -0.3mA
Output Leakage Current
pF
V
VCC - 0.8
–
VCC
μA
IMISO
MISOn Pin = 0V
-10
–
10
MISOn Pin = VCC
-10
–
10
-50
-30
-10
SCLKn, CSn Pull-up Current
RST Pull-down Current
VOUT = 1.0V
μA
IRSTPD
VOUT = 1.0V
CLK, MOSI0 Pull-down Current
μA
IPU
VOUT = VCC - 2.0 V
5.0
-
13
5.0
10
13
μA
IPD
Notes
4. Not measured in production.
33781
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75V ≤ VCC ≤ 5.25V, 9.0V ≤ VSUPn ≤ 25V,-40°C ≤ TA ≤ 90°C, unless otherwise
noted. Voltages relative to GND, unless otherwise noted. Typical values noted reflect the approximate mean values of the
parameter at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
BUS TRANSMITTER (DnH, DnL)
VDnD(Drop)(7)(8)
Output Bus Idle Voltage (Drop)
(6)
V
–
–
1.6
4.175
4.5
4.825
1.175
1.5
1.825
VMID(8)
VSUPn/
2 - 0.8
VSUPn/2
VSUPn /
2 +0.8
V
VCMP
0
–
30
mV
VMIDPP(IDLE)
–
–
300
mV
VMIDPP(SIGNAL)
–
–
80
mV
Fault Condition: DnH = 0V
-600
–
-200
Normal Operation
-400
–
-200
150
–
350
InH = -200mA, InL = 200mA
(7)
Output Signal High Voltage (Differential)
VDnD(HIGH)
-12.5mA ≤ InH ≤ 1.0mA, -1.0mA ≤ InL ≤ 12.5mA
(6)
V
VDnD(LOW)(7)
Output Signal Low Voltage (Differential)
(6)
-12.5mA ≤ InH ≤ 1.0mA, -1.0mA ≤ InL ≤ 12.5mA
Vmid, (DnH + DnL)/2 (Voltage Halfway Between Bus High Side and
Bus Low Side
VCM Peak to Peak (Maximum Vmid-Minimum Vmid)
For Vmid (Idle), Vmid (Signal_H), Vmid (Signal_L)(5)
Bus Driver Vmid Peak to Peak, (DnH+DnL)/2(5)
V
For Signal to Idle, Idle, Idle to Signal,
VmidPP(Idle)=Vmid(Max)- Vmid (Min)
Bus Driver Vmid Peak to Peak (Dnh+DnL)/2(5)
For Signal_H to Signal_L, Signal_L, Signal_L to Signal_H, Signal_H
VmidPP(Signal)=Vmid(Max)-Vmid(Min)
Output High Side (DnH) Driver Current Limit
ICL(HIGH)
Fault Condition: DnH = VSUPn
Output Low Side (DnL) Driver Current Limit
mA
ICL(LOW)
mA
Fault Condition: DnL = 0V
-350
–
-150
Fault Condition: DnL = VSUPn
200
–
400
Signal mode Over-current Shutdown
ISSD
20
60
mA
l ISSD l DnH, DnL
Disabled High Side (DnH) Bus Leakage (DnL open)
ILK(HIGH)
DnH = 0V
DnH = VSUPn
Disabled Low Side (DnL) Bus Leakage (DnH open)
(9)
mA
-1.0
–
1.0
-1.0
–
1.0
ILK(LOW)
mA
DnL = 0V
-1.0
–
1.0
DnL = VSUPn
-1.0
–
1.0
Notes
5. Not measured in production.
6. InH=bus current at DnH, InL=bus current at DnL
7. VDnD=VDnH-VDnL
8.
9.
Max VDnD = VSUPn - 2 * VMID_OFFSET - VDnD(Drop), VMID_OFFSET = |VMID - VSUPn / 2|
Worst Case Disabled Low Side Bus Leakage for DnL occurs with DnL = VSUP and DnH = 0V. In this configuration, the DnL leakage
current can exceed 1mA. This is not measured in production.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75V ≤ VCC ≤ 5.25V, 9.0V ≤ VSUPn ≤ 25V,-40°C ≤ TA ≤ 90°C, unless otherwise
noted. Voltages relative to GND, unless otherwise noted. Typical values noted reflect the approximate mean values of the
parameter at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
RSWH
–
8.0
16.0
Ω
RSWL
–
8.0
16.0
Ω
RPSMATCH
–
–
1.0
Ω
IDPHLK
-20
–
20
μA
IDPLLK
-20
–
20
μA
Comparator Trip Point for High Side
COMPHIGH
5.0
6.0
7.0
mA
Comparator Trip Point for Low Side
COMPLOW
5.0
6.0
7.0
mA
Comparator Trip Point for Adder
COMPADD
6.0
12
18
mA
BUS TRANSMITTER (DnH, DnL) (CONTINUED)
High Side Pseudo Bus Switch Resistance
ISWH=160mA
Low Side Pseudo Bus Switch Resistance
ISWL=160mA
Pseudo Bus Switch Matching
High Side Pseudo Bus Switch Leakage Current
DPH = Open: CH0 drivers in Idle, DPH = 0V or
CH0 drivers in Signal_H, DPH = 25V
Low Side Pseudo Bus Switch Leakage Current
DPL = Open: CH0 drivers in Idle, DPL = 25V,or
CH0 drivers in Signal_H, DPL = 0V
BUS RECEIVER (DnH, DnL)
33781
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions 4.75V ≤ VCC ≤ 5.25V, 9.0V ≤ VSUPn ≤ 25V,-40°C ≤ TA ≤ 90°C, unless otherwise
noted. Voltages relative to GND, unless otherwise noted. Typical values noted reflect the approximate mean values of the
parameter at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
CLOCK
CLK Periods (System requirement)(10)
ns
Time High
tCLKHI
75
–
Time Low
tCLKLO
75
–
–
tCLKPER
245
250
255
Time for Low-to-High Transition of the CLK Input Signal
tCLKLH
–
–
100
Time for High-to-Low Transition of the CLK Input Signal
tCLKHL
–
–
100
tRSTLO
100
–
–
ns
SPI Clock Cycle Time
tCYC
100
–
–
ns
SPI Clock High Time
tHI
40
–
–
ns
SPI Clock Low Time
tLO
40
–
–
ns
tLEAD
50
–
–
ns
Period
–
CLK Transition (System requirement)(10)
ns
Reset Low Time
SPI INTERFACE TIMING
SPI CSn Lead
Time(11)
SPI CSn Lag Time
(11)
tLAG
50
–
–
ns
SPI CS0 Time Between
Bursts(10)
tCS0HI
80
–
–
ns
SPI CS1 Time Between
Bursts(10)
tCS1HI
300
–
–
ns
10
–
–
10
–
–
Data Setup Time
tSU
MOSI0 Valid Before SCLK0 Rising Edge(11)
ns
Data Hold Time
ns
MOSI0 Valid After SCLK0 Rising Edge(11),(10)
tH
Data Valid Time
SCLKn Falling Edge to MISOn Valid, C = 50pF
Output Disable Time
tV
(12)
SCLKn, MOSI0
–
25
–
–
50
ns
tR
SCLKn, MOSI0
Fall Time (70% VCC to 30% VCC)(10)
–
tDIS
CSn Rise to MISOn Hi-Z
Rise Time (30% VCC to 70% VCC)(10)
ns
ns
–
–
10
–
–
10
tF
ns
Notes
10. Not measured in production.
11. SPI signal timing from the production test equipment is programmed to ensure compliance.
12. Conditions are verified indirectly during test.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.75V ≤ VCC ≤ 5.25V, 9.0V ≤ VSUPn ≤ 25V,-40°C ≤ TA ≤ 90°C, unless otherwise
noted. Voltages relative to GND, unless otherwise noted. Typical values noted reflect the approximate mean values of the
parameter at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
tSLEW(IDLE)
3.0
6.0
8.0
V/μs
tSLEW(SIGNAL)
3.0
6.0
8.0
V/μs
DRATE
77.1
–
200
kbps
tBIT
5.0
–
–
μs
tDBUSSTART2
2/3tBIT + (DLY-2) * tBIT
–
5/3tBIT + (DLY-2) *
tBIT
DSIF = 0.5 * VCC to DnD Fall = 5.5 V (9V < VSUPn < 40V)
tDVLD1
–
–
5.3
DSIS = 0.5 * VCC to DnD Fall = 2.8V (9V < VSUPn < 40V)
tDVLD2
–
–
1.0
DSIS = 0.5 * VCC to DnD Rise = 3.2V (9V < VSUPn < 40V)
tDVLD3
–
–
1.0
DSIF = 0.5 * VCC to DnD Rise = 6.5 V (9V < VSUPn < 40V)
tDVLD4
–
–
1.0
tOC
3.0
5.0
7.0
μs
t0LO
0.6 * tBIT
2/3 *
tBIT
0.73 * tBIT
μs
t1LO
0.3 * tBIT
1/3 *
tBIT
0.37 * tBIT
μs
BUS TRANSMITTER
Idle-to-Signal and Signal-to-Idle Slew Rate(13)
Signal High-to-Low and Signal Low-to-High Slew
Rate(13),(14) (See Data Valid DSIS to DnD Timing)
Communication Data Rate Capability(14) (Ensured by
Transmitter Data
Valid and Receiver Delay Measurements)
Data Rate(before frequency spreading)
Signal Bit Time (1 / DRATE)(14)
The Max value depends on the settings in the FSEL bits
DBUS Start Delay, CS0 Rising Edge to DBUS(14)
note: DLY is the inter-message delay selected in the
DnCTRL register
μs
Data Valid(13)
Signal mode Over-current Shutdown Delay(14)
μs
Signal Low Time for Logic Zero
33.3% Duty Cycle
(2/3*tBIT) + 10% for threshold delta
Signal Low Time for Logic One
66.7% Duty Cycle
(1/3*tBIT) + 10% for threshold delta
Notes
13. C = 2.8nF from DnH to DnL and 2.2nF from DnH and DnL to GND, capacitor tolerance = ±10%.
14. Not measured in production.
33781
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.75V ≤ VCC ≤ 5.25V, 9.0V ≤ VSUPn ≤ 25V,-40°C ≤ TA ≤ 90°C, unless otherwise
noted. Voltages relative to GND, unless otherwise noted. Typical values noted reflect the approximate mean values of the
parameter at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
IRSP = -6.0mA to DSIR = 0.5 * VCC
tDRH
–
–
500
IRSP = -6.0mA to DSIR = 0.5 * VCC
tDRL
–
–
500
ICMNR
-50
–
+50
mA
fCEN
77.1 - 2%
–
200 + 2%
kHz
Pseudo Bus On Delay Time
tPBD1
–
5
10
μs
Pseudo Bus Off Delay Time
tPBD2
–
5
10
μs
BUS RECEIVER
Receiver Delay Time (IRSP = 0mA / 11mA step)(15)
Common Mode Current Noise Rejection (2.5ms max.)
ns
SPREAD SPECTRUM
Base Frequency Range
PSEUDO BUS
Notes
15. Not measured in production.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
TIMING DIAGRAMS
DYNAMIC ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
t BIT
t BIT
Logic 1
t BIT
t BIT
Logic 0
5.0V
DSIS
0V
5.0V
DSIF
0V
t DVLD1
t SLEW(FRAME)
tDVLD4
DnD VSUPn
6.5V
t DVLD3
5.5V
t SLEW(SIGNAL)
t DVLD2
4.5V
3.2V
2.8V
1.5V
t0LO
t1LO
IOUT
6.0mA
0mA
tDRH
tDRL
5.0V
DSIR
0V
Figure 4. DBUS Timing Characteristics
33781
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
TIMING DIAGRAMS
DYNAMIC ELECTRICAL CHARACTERISTICS
DnH
VSUPn
VMID + 2.25V
VMID + 0.75V
VMID
VMID - 0.75V
VMID - 2.25V
DnL
0V
Figure 5. DBUS Normal Bus Waveforms
DnH
VSUPn
Over-voltage
Threshold
VMID + 2.25V
VMID + 0.75V
VMID (Clamped)
VMID - 0.75V
VMID - 2.25V
DnL
0V
Figure 6. DBUS Over-voltage Bus Waveforms
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
TIMING DIAGRAMS
DYNAMIC ELECTRICAL CHARACTERISTICS
CS0
VIH
VIL
VIL
tCYC
tLEAD
tLAG
tHI
SCLK0
tLO
tR
tF
VIH
VIL
VIH
VIH
VIH
VIL
tSU
tH
VIH
MOSI0
MSB
VIL
LSB
tDIS
tV
MISO0
VOH
VOL
X
MSB
VOH
LSB
VOL
X = Don’t care
VIH = 70% VCC, VOH = 70% VCC
VIL = 30% VCC, VOL = 30% VCC
Figure 7. SPI0 Interface Timing
CS1
VIH
VIL
VIL
tCYC
tLEAD
tHI
SCLK1
tLAG
tLO
VIH
VIL
tR
tF
VIH
VIH
VIH
VIL
tDIS
tV
MISO1
VOH
VOL
X
MSB
LSB
VOH
VOL
X = Don’t care
VIH = 70% VCC, VOH = 70% VCC
VIL = 30% VCC, VOL = 30% VCC
Figure 8. SPI1 Interface Timing
33781
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTIONS
INTRODUCTION
FUNCTIONAL DESCRIPTIONS
INTRODUCTION
The 33781 is intended to be used as a master device in a
distributed system. It contains both protocol generators and
physical interfaces, to allow an MCU to communicate with
devices on the bus using two different SPI interfaces. Four
differential buses are provided. The physical layer uses a
two-wire bus to carry power and signal. The physical layer
uses wave-shaped voltage signals for commands from the
master and wave-shaped current signals for responses from
the slaves. The protocol and physical layer conform to the
DSI 2.02 specification.
The equivalent bus capacitance consists of capacitors
connected between the two bus wires and capacitors
between the bus wires and ground. Because the voltage
change on either of the bus wires to ground is only 1/2 the
amount of change between the two bus wires, the
capacitance to ground only conducts half as much current as
it would if connected directly across the bus. The equivalent
bus capacitance of a capacitor to ground from the bus wires
is one half of the actual amount of the capacitor. The amount
of capacitance from either bus wire to ground should be kept
the same in order to achieve the lowest radiated EMI energy.
The 2.2nF capacitors required between the bus wires and
ground result in an equivalent of 1.1nF of capacitance across
the bus as seen by either bus wire.
Table 5 shows the voltages used for operation. Low side
(LS) is the bus wire that is the most negative and high side
(HS) is the bus wire that is the most positive. Figure 5 shows
the bus waveforms in normal operation.
Table 5. High Side and Low Side Typical Voltages (Voltage Relative to Ground)
Low Side
IDLE
0
HIGH
Vmid-2.25
High Side
LOW
(16)
Vmid-0.75
IDLE
(16)
VSUPn
HIGH
Vmid+2.25
LOW
(16)
Vmid+0.75 (16)
Notes
16. VMID = VSUPn /2.
FUNCTIONAL PIN DESCRIPTIONS
RESET (RST)
CLOCK (CLK)
When pulled low, this will reset all internal registers to a
known state as indicated in the section entitled SPI0 Register
and Bit Descriptions on page 29.
This is the main clock source for the internal logic. It must
be 4.0MHz.
CHIP SELECT n (CSn)
This input is used to select the SPIn port when pulled to
ground. When high, the associated SPIn port signals are
ignored. The SPIn transaction is signaled as completed when
this signal returns high.
MASTER OUT/SLAVE IN 0 (MOSI0)
This is the SPI data input to the device. This data is
sampled on the positive (rising) edge of SCLK0. There is no
MOSI pin or function for SPI1.
SERIAL CLOCK (SCLKn)
This is the clock signal from the SPIn master device. It
controls the clocking of data to SPIn and data reads from the
SPIn.
MASTER IN/SLAVE OUT (MISOn)
This is the SPIn data from SPIn to the SPIn master. Data
changes on the negative (falling) transition of the associated
SCLKn.
GROUND (GND)
Ground source for DSI/DBUS return.
DIGITAL GROUND (VSS)
Ground source for logic.
DIGITAL GROUND AND IDDQ (VSS_IDDQ)
Used for IDDQ testing during IC manufacturing test.
ANALOG GROUND (AGND)
Ground source for analog circuits.
POWER SOURCE (VCC)
Nominal +5.0V Regulated Input.
DIGITAL REGULATOR OUTPUT (VDD)
Nominal +2.5V internal regulator Pin. This must be
bypassed with a small capacitor to ground (100nF)
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
FUNCTIONAL DESCRIPTIONS
FUNCTIONAL PIN DESCRIPTIONS
LOW SIDE BUS (DnL)
There are four independent low side outputs, D0L, D1L,
D2L and D3L. They comprise the low side differential output
signal of the DBUS physical layer as shown in Figure 5. They
also provide power to the slave modules during the DBUS
idle time. The output of DnL should have a bypass capacitor
of 2.2nF to ground.
HIGH SIDE BUS (DnH)
There are four independent high side outputs, D0H, D1H,
D2H, and D3H. They comprise the high side differential
output signal of the DBUS physical layer. They also provide
power to the slave modules during the DBUS idle time. See
Figure 5. The output of DnH should have a bypass capacitor
of 2.2nF to ground.
POSITIVE SUPPLY FOR BUS OUTPUT (VSUPn)
This 9.0V to 25V power supply is used to provide power to
the slave devices attached to the DBUS. During the bus idle
time, the storage capacitors in the slave modules are charged
up to maintain a regulated supply to the slave device. VSUP1
powers devices DBUS0 and DBUS1, and VSUP2 powers
devices on DBUS2 and DBUS3. See Figure 9.
The two supplies are interdependent internally, however,
as can be seen in Figure 9: VSUP1 is used to create the
VCM_REF voltage for all four driver buffers, and VSUP2 is used
to supply the charge pump voltage. Consequently, both
VSUP1 and VSUP2 are required for internal functions: for
example, the internal voltage regulator VREG_8V is supplied
from VSUP1, but uses the VSUP2-derived charge pump
voltage to supply the output NMOS devices.
PSEUDO BUS (DPH AND DPL)
These bus high and bus low pins are created by closing
the pseudo bus switches attached to the D0H and D0L bus
lines internal to the 33781. This allows a second external set
of bus lines to communicate over the D0 Channel. The
pseudo bus switches are controlled by the system MCU
through SPI0.
VSUP1 (27)
RNE control for ch0, ch1, ch2
and ch3 status register
VSUP
Voltage
Monitor
GND (32)
DBUS 0
Driver/ Receiver
D0H/L
D1H/L
VCP
VREG_8V
Voltage Regulator
DBUS 1
GND (24)
V_8V
DBUS 2
VMID
Reference
for common mode voltage
VCP
VCM_REF
DBUS 3
Driver/ Receiver
D2H/L
D3H/L
VCharge_pump
VSUP2 (21)
GND (18)
Figure 9. VSUP Block Diagram
33781
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTIONS
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
MC33781 - Functional Block Diagram
Supply Voltage
Power Stage
2.5V Regulator
HCAP Charging Circuitry
DBUS Drivers
and Receivers
VSUP Voltage Monitor
Logic and Control
Clock Generation and Frequency Spreading
CRC Generation and Checking
SPI0 Registers and State Machine
SPI1 Registers and State Machine
Pseudo-bus
Switches
Over-current Sensing
Over-temperature Sensing
Supply Voltage
Logic and Control
Power Stage
Figure 10. Block Illustration
The 33781 is controlled by an MCU through the SPI0
The SPI0 port can handle 2-byte and 4-byte transfers. It
interface. It handles the digital and physical layer portions of
addresses 87 registers. The organization of the registers is
a DBUS master node. Four separate DBUS channels are
described in the section entitled SPI0 Register and Bit
included. The physical layer uses a two-wire bus with analog
Descriptions on page 29.
wave-shaped voltage and current signals. Refer to Figure 1.
SPI1 AND REGISTERS
Major subsystems include the following:
The 33781 has a second SPI port (called SPI1) that allows
• SPI0 interface and registers to a main MCU
valid response data from Bus Channel 2 and 3, along with the
• SPI1 interface and registers to a second MCU
slave address, to be read independently by a second MCU.
• Four channels of DSI 2.02 protocol state logic
This block contains the SPI1 interface logic and the response
• CRC block for each channel
registers that are read from the SPI1 interface.
• Control and status registers
The IC is an SPI slave-type device, so MISO1 (Master-In• Four addressable register sets per channel for queuing up
Slave-Out) is an output, and CS1 and SCLK1 are inputs. SPI1
to four commands and data per bus. The addressable
does not use the MOSI (Master-Out-Slave-In) pin or function
buffer acts as a circular buffer for command writes and
as it does not receive commands.
data reads.
The SPI1 port handles only 16-bit transfers. It addresses
• Pseudo Bus Switch from D0H/L to DPH/L
eight registers which are read only.
SPI0 AND REGISTERS
This block contains the SPI0 interface logic and the control
and response registers that are written to and read from the
SPI interface.
The IC is an SPI slave-type device, so MOSI0 (MasterOut-Slave-In) is an input and MISO0 (Master-In-Slave-Out) is
an output. CS0 and SCLK0 are also inputs.
PROTOCOL ENGINE
This block converts the data to be transmitted from the
registers into the DBUS sequences, and converts DBUS
response sequences to data in the registers.
The DBUS transmit protocol uses a return to 1 type data
with a duty cycle determined by the logic state. The protocol
includes Cyclical Redundancy Check (CRC) generation and
validation.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
FUNCTIONAL DESCRIPTIONS
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
VSUPn VOLTAGE MONITOR
This function monitors the voltage on the VSUPn pin. If the
voltage on the pin drops below the defined voltage threshold
for longer than the voltage threshold mask time, the 33781
will continue to send queued DBUS commands, but not set
any RNE bits in the DnSTAT registers to 1, until either the
device is reset by the RST pin or the EN bits in the DnEN
registers are first set to zero, and then to one (disabled and
then enabled). By monitoring the RNE bits the MCU will know
that communications have been disrupted and can take the
appropriate action.
Receiver
Low n
Receiver Low
n
Receiver High
n
Receiver
High n
Receiver
Sum n
Receiver Sum
n
Over-current
Signal Mode Over
Current n
Over-current
Mode
Over-current
IdleIdle
Mode
Over
Current n n
Over Tempn n Over-temp n
Over-temp
DSISn
DSIFn
hiZn
hiZn
Adder
Over-current
Over Current
Over-temp
Over
Temp
Sense
Sense
DnH
DnH
Differential
Differential
Signal
Signal
Generation
Generation
Driver
DnL
DnL
Over-voltage
Overvoltage
Common
Common
Mode
Mode
Correction
Correction
Figure 11. Driver/Receiver Block Diagram
DBUS DRIVER /RECEIVER (PHYSICAL LAYER)
There are four independent differential bus driver/receiver
blocks on the 33781. These blocks translate the transmit data
to the voltage and current needed to drive the DBUS. They
also detect the response current from the slave devices and
translate that current into digital levels. These circuits can
drive their outputs to the levels listed in Table 5.
The DBUS driver/receiver block diagram is shown in
Figure 11. The circuit uses a common driver for both the Idle
and Signal modes to minimize common mode noise. The
drivers are disabled in HiZ.
During Idle mode the driver is required to supply a high
current to recharge the Slave device storage capacitors. In
both Idle and Signal modes it is required to drive the DBUS
load capacitances and control the slew rate over a wide
supply voltage range and load conditions. Current limit, overcurrent shutdown and thermal shutdown are included to
protect the device from fault conditions. More information can
be found in the Protection and Diagnostic Features and SPI0
Register and Bit Descriptions sections.
To ensure stability of the bus drivers, capacitors must be
connected between each output and ground. These are the
DBUS common mode capacitors. In addition, a bypass
capacitor is required at VSUPn. These capacitors must be
located close to the IC Pins and provide a low-impedance
path to ground.
The internal signal DSIF controls the Idle to Signalling
state change, and internal signal DSIS controls the signal
level, high or low. DSIR is the slave device response signal to
the logic. This is shown in Table 6.
Table 6. Internal Signal Truth Table
DSIF
DSIS
TS
DSIR
DnD
0
0
0
Return Data
Signal Low
0
1
0
Return Data
Signal High
1
0
0
0
High-impedance
1
1
0
0
Idle
X
X
1
0
High-impedance
Bus wire faults on a bus do not disrupt communications on
another bus. In addition, each bus channel has independent
thermal shutdown protection. Once the channel thermal limit
is reached the bus drivers become high-impedance, the TS
bit is set to a 1 and the EN bit set to 0 in the channel DEN
register. In addition the channel address buffer registers and
pointers are reset. There is a 4 usec filter on Tlim to prevent
false triggering.
The Differential Signal Generation block converts the
DSIS signal to the DBUS differential signal voltage levels.
This differential signal is buffered and slew rate controlled by
33781
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTIONS
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
the driver. The over-voltage input causes the driver
characteristics to be modified under over-voltage conditions.
This is described in more detail in the Load Dump Operation
section.
A special requirement of the differential bus is to maintain
a low common mode voltage. This is accomplished by
monitoring the common mode voltage and modifying the
driver slew rates. This is the function of the Common Mode
Correction block.
Current signals sent by the slave are detected on both the
high side and the low side of the bus using a differential
current sense architecture. Sense resistors between the
Signal driver and the DnH and DnL outputs detect the slave
device response current. Sensing the current on both bus
lines improves the fault diagnostics of the bus. Also included
is an adder circuit which is used to improve the reception of
sensor data in the presence of common mode noise. The
comparators in the blocks output a high or low value
depending on if the input is above or below the signal
threshold.
The Receiver High, Receiver Low, and Receiver Sum
outputs are sent to the device logic block which is shown in
Figure 23. The data is sampled at the falling edge of DSIS. In
the presence of faults or common mode noise it is possible
that all three receiver circuits will not produce the same bit
pattern. To check for this, each of the three receiver filter
outputs is passed to a CRC generation and checking block.
A logic block determines which (if any) of the receiver filter
blocks has produced the correct result, by comparing the
CRC results along with the bit-by-bit XOR of the high side and
low side bit pattern. Table 7 shows how the logic determines
which (if any) receiver outputs contain a valid response. The
data is selected from either the Receiver High, Receiver Low
or Receiver Sum circuit and the ER bit is set accordingly in
the DnRnSTAT register.
If either Receiver High or Receiver Low has all 1’s for data,
including the CRC bits, then the ER bit will be set. For either
of these two conditions, the ER bit will be set regardless of
the Receiver Sum data value and regardless of whether or
not all the 1’s caused a CRC error on the High or Low side.
Note that SPI0 and SPI1 do not use the same sources for
their respective output data streams. SPI0 chooses between
Receiver High or Receiver Sum0; SPI1 chooses between
Receiver Low and Receiver Sum1.
In order to provide the maximum protection against a
single-point failure causing a disruption in communication,
the decision paths for the two SPI channels are internally
independent . For example, Receiver Sum0 and Receiver
Sum1 use different holding registers in the Receiver logic.
These registers are duplicates, although they will always hold
the same data unless there is a fault in one of the data paths.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
FUNCTIONAL DESCRIPTIONS
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
Table 7. Receiver Decision Logic
Bus Pin
Conditions
Receiver
High 6 ± 1
mA
Receiver
Low 6 ± 1
mA
Receiver
Sum 12 ±
6mA
High and
Low XOR
(bit/bit)
High and
Sum XOR
(bit/bit)
Low and
Sum XOR
(bit/bit)
Out of Spec
CRC Ok
CRC Ok
CRC Ok
CRC Ok
Receiver
High
Receiver
Low
H*L Not OK
1
Receiver
High
Receiver
Low
H*L Ok
0
Receiver
High
Receiver
Low
1
Receiver
High
Receiver
Low
0
Receiver
High
Receiver
Sum1
1
Receiver
High
Receiver
Low
N/A
1
Receiver
High
Receiver
Low
L*S Ok
0
Receiver
Sum0
Receiver
Low
L*S Not OK
1
Receiver
High
Receiver
Low
CRC Ok
N/A
Bad CRC
N/A
N/A
N/A
H*L Not OK
H*S Ok
Fault
CRC Ok
Bad CRC
CRC Ok
N/A
N/A
H*S Not OK
Fault L
Fault
CRC Ok
Bad CRC
Bad CRC
CRC OK
Bad CRC
CRC OK
SPI0
SPI1
DnRnxData DnRnxData
0
H*L Ok
Normal
ER Bit
N/A
N/A
N/A
N/A
Fault H
Bad CRC
CRC Ok
Bad CRC
N/A
N/A
N/A
1
Receiver
High
Receiver
Low
Common
Mode Noise
Bad CRC
Bad CRC
CRC Ok
N/A
N/A
N/A
0
Receiver
Sum0
Receiver
Sum1
Fault
Bad CRC
Bad CRC
Bad CRC
N/A
N/A
N/A
1
Receiver
High
Receiver
Low
PSEUDO BUS SWITCHES
Pseudo Bus Switches are provided on the Channel 0 bus.
They allow one channel to communicate via two external bus
wire sets (D0H/D0L and DPH/DPL). There is a pseudo bus
switch on both the bus high and bus low driver. Upon device
reset the bus switches are open. This allows the master to
initialize devices on D0H/D0L. After all of these slaves are
initialized, the pseudo bus switches can be closed, allowing
the devices on DPH/DPL to be initialized.
The Pseudo Bus Switches can only be commanded closed
by the BSWH and BSWL bits in the D0EN register. These bits
can also open the switch at any time.
The Pseudo Bus Switches have independent thermal
shutdown protection. Once the thermal shutdown point is
reached, the bus switch is opened (becoming highimpedance) and the BSWH and/or BSWL bit is cleared in the
channel 0 DEN register. If this occurs, the Pseudo Bus
Switches can only be closed again by setting the BSWH and/
or BSWL bit to a 1 with a write command to the channel 0
DEN register.
SPREAD SPECTRUM
The dominant source of radiated electromagnetic
interference (EMI) from the DBUS bus is due to the regular
periodic frequency of the data bits. At a steady bit rate, the
time period for each bit is the same, which results in a steady
fundamental frequency plus harmonics. This results in
undesired signals appearing at multiples of the frequency
that can be strong enough to interfere with a desired signal.
A significant decrease in radiated EMI can be achieved by
randomly changing the duration of each bit. This can
significantly reduce the amplitude by having the signal spend
a much smaller percentage of time at any specific frequency.
The signal strength of the fundamental and harmonics are
reduced directly by the percentage of time it spends on a
specific frequency.
A circuit to do this is included in this IC, and can perform
the spreading of the signal independently for each channel,
while generating the bit clock timing for the channel. This is
done in the Spread Spectrum (SS) Block Diagram shown in
Figure 12.
To implement the channel bit clock a common 64MHz
clock is created from the on board 4MHz oscillator using a
digital PLL. Multiples of this clock period (15.625 nsec) are
used to select the minimum channel bit time. The Spread
33781
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTIONS
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
Spectrum block does this by multiplying the 8-bit value in the
DxFSEL register by 2 and then adding it to the number 320
(decimal). The user must choose a minimum bit time
appropriate for his system. Factors which must be considered
are the slave response time, bus wire delays, and the
minimum idle time needed to recharge the slave H_CAPs for
the channel.
To spread the spectrum beyond this minimum bit time a
random delay based on a multiple of 1/64 MHz periods can
be added to each bit. This delay is created by a Pseudo
Random Bit Sequence Generator from which a 7-bit random
number is created. This number is further qualified by the
maximum number of counts (chosen by the DEV[2:0] bits in
4MHz Clock
the DxSSCTL registers) allowed beyond the base time
period. The resulting value is added to the minimum bit time
and fed to the bit clock logic, which generates the DSI bit
clock.
It is important for the user to select a maximum deviation
value that is appropriate for the system. A larger maximum
deviation results in spreading the bit energy to more
frequencies. However, this number also establishes the
maximum period for any random bit on that channel. If the
system requires that a minimum number of bits be transferred
within a fixed time period, then the user must select a
minimum base bit time and maximum deviation time that will
meet the criteria.
64MHz Clock
PLL
Divide by 8
24-bit PRBS
Deviation
7-bit random number
7
Select
Maximum Count Deviation
(from DxSSCTL)
7
Adder
10
Bit
Clock
Logic
Bit
Clock
3
10
320
Base Time Period
(from DxFSEL)
8
Mult x 2
Adder
9
Figure 12. Spread Spectrum Block Diagram
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
SPI0 COMMUNICATIONS
All SPI0 transactions are either 16 or 32-bits long. They
start with a command byte and can be followed by 1 or 3
bytes of data. The start of an SPI transaction is signaled by
CS0 being asserted low. The first bit sent (bit 7) of the first
byte signals a read or write (write = 1) of data. The last seven
bits (bits 6–0) of the command set a pointer to the desired
register. The 33781 uses 16-bit commands to access control
registers, and 32-bit commands to access both control
registers, and to queue up transfers over the DBUS.
Figure 13 is a diagram of 16-bit transfers and Figure 14 is a
diagram of 32-bit transfers. In these multi-byte transfers, as
long as CS0 is asserted low, each additional byte sent over
the SPI will be a read/write of data to the sequential next
register.
33781 utilizes, transmit, and receive addressable FIFOs
for sending commands and responses over the DBUS. There
are separate command and response registers, and a
transmit queue is used to allow up to 4 bus commands to be
scheduled for each bus. The transmit queue schedules
commands as a circular buffer, accessing the appropriate
command register for the command and data to be sent as
the bus becomes available. Data received in response to the
commands is queued up for sequential response back to the
MCU during the next set of SPI commands. If an SPI0
attempts to write to a transmit register that is not empty the
new command will be ignored.
Figure 14 shows an example of a write operation. During
the first byte of the SPI transaction, the first MOSI bit is 1
(write), and the last seven are the address of the register to
be accessed. During this command byte, MISO returns
dummy bits set to all zeros. During the next SPI transactions,
MOSI updates the data in the register pointed to in the
previous byte with new data, while reading back the old data
via MISO.
During an SPI0 transaction the 33781 checks for SPI
framing errors. A framing error is defined as any number of
clocks received that is not either 16 or 32. If that occurs, all
bits sent by the SPI master are discarded and no registers
are update.
SCLK
MOSI
WRITE COMMAND
POINT TO REGISTER
DATA TO
REGISTER
MISO
00000000
DATA FROM
REGISTER
CS0
Figure 13. SPI016-Bit Burst Transfer Example.
SCLK
MOSI
WRITE COMMAND
POINT TO D0R0H
DATA TO D0R0H
DATA TO D0R0L
MISO
00000000
DATA FROM D0R0H
DATA FROM D0R0L
XXXXXXXX
DATA FROM D0R0STAT
CS0
Figure 14. SPI0 32-Bit Burst Transfer Example
The bit definitions for SPI0 depend on the type of SPI
Figure 13 shows the bit encoding for 16-bit SPI0 burst
transfer, and if the transfer will be to/from the addressable
transfers. In this transfer the first byte contains the address of
FIFOs, whether the DBUS for that channel is set for Long
the control register to be written to or read from, and the
Words or Enhanced Short words.
second byte is the data to be written. The SPI0 response is
the data from that register, latched at the falling edge of CS0.
If the address pointed to by the first byte is not a control
33781
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
register, the transfer is considered to have a framing error
and no write will occur.
Figure 16 shows the bit encoding for 32-bit SPI0 burst
transfers when the DBUS channel is set for long words. In
this transfer, the first byte contains the address of the control
register to be written to and read from, the second byte is the
data to/from that register, and the next two bytes are the data
to/from the next numerically successive registers. In the case
of reading or writing from the addressable FIFO registers, the
1st data byte would be the DnRnH byte, the next byte would
be the DnRnL byte, and the third byte would be the
DnRnSTAT byte as shown in Figure 15. Notice that in this
case, the 4th Tx byte is don’t care and is not written. If this
transfer would be sent to an address in the control register
section of the register bank, the bytes sent and returned
would be first the addressed register, and then the next
consecutive registers.
Figure 17 shows the bit encoding for 32-bit SPI0 burst
transfers when the DBUS channel is set for enhanced short
words. This transfer mode is only valid when accessing the
addressable FIFO portion of the register set. In this case, the
first byte is again the 1st address of the register to be
accessed in this read/write, the second byte contains the
upper two bits of the data to be written, and the third byte is
the lower 8-bits of data to be written. The SPI0 response
encoding begins with the 2nd byte in the transfer with the 4bit DBUS address of the slave, which sent the data contained
in the rest of the word. This is followed by the 10-bits of data
from the DBUS slave, and then the value in the DnRnSTAT
register.
Although it looks like the read and write for an address are
occurring at the same time, the changes caused earlier
during the same burst would not be reflected by the data
returned, because the DnRnSTAT register is latched at CS0
going low.
Refer to the section SPI0 Register and Bit Descriptions on
page 29 for the bit descriptions in Figure 15, Figure 16, and
Figure 17.
Bit 7
Bit6
BIt5
Bit4
Bit3
Bit2
Bit1
Bit0
First TX Byte
R/W
ADDR6
ADDR5
ADDR4
ADDR3
ADDR2
ADDR1
ADDR0
Second TX Byte
D7
D6
D5
D4
D3
D2
D1
D0
Bit 7
Bit6
BIt5
Bit4
Bit3
Bit2
Bit1
Bit0
First RX Byte
0
0
0
0
0
0
0
0
Second RX Byte
D7
D6
D5
D4
D3
D2
D1
D0
Figure 15. SPI0 Communications, 16-Bit Burst Transfer Bit Definitions
Bit 7
Bit6
BIt5
Bit4
Bit3
Bit2
Bit1
Bit0
First TX Byte
R/W
ADDR6
ADDR5
ADDR4
ADDR3
ADDR2
ADDR1
ADDR0
Second TX Byte
D15
D14
D13
D12
D11
D10
D9
D8
Third TX Byte
D7
D6
D5
D4
D3
D2
D1
D0
Fourth TX Byte
X
X
X
X
X
X
X
X
Bit 7
Bit6
BIt5
Bit4
Bit3
Bit2
Bit1
Bit0
First RX Byte
0
0
0
0
0
0
0
0
Second RX Byte
D15
D14
D13
D12
D11
D10
D9
D8
Third RX Byte
D7
D6
D5
D4
D3
D2
D1
D0
Fourth RX Byte
ER
TE
SDS
RNE
ICL
0
FIX1
FIX0
Figure 16. SPI0 Communications, 32-Bit Burst Transfer Long Word DBUS Transfer Bit Definitions
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Bit 7
Bit6
BIt5
Bit4
Bit3
Bit2
Bit1
Bit0
First TX Byte
R/W
ADDR6
ADDR5
ADDR4
ADDR3
ADDR2
ADDR1
ADDR0
Second TX Byte
X
X
X
X
X
X
D9
D8
Third TX Byte
D7
D6
D5
D4
D3
D2
D1
D0
Fourth TX Byte
X
X
X
X
X
X
X
X
Bit 7
Bit6
BIt5
Bit4
Bit3
Bit2
Bit1
Bit0
First RX Byte
0
0
0
0
0
0
0
0
Second RX Byte
SA3
SA2
SA1
SA0
0
0
D9
D8
Third RX Byte
D7
D6
D5
D4
D3
D2
D1
D0
Fourth RX Byte
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
Figure 17. SPI0 Communications, 32-Bit Burst Transfer Enhanced Short Word DBUS Bit Definitions
SPI1 COMMUNICATIONS
All SPI1 transactions are read only, are 16-bits in length,
and are asynchronous to SPI0. There is no MOSI pin or
function associated with SPI1, since there are no commands
sent. Figure 18 shows the signals associated with an SPI1
transfer, and Figure 19 contains the order of bits sent for
each SPI1 transaction.
SPI1 transfers start with the 1st SCLK1 transition after
CS1 asserts and ends once CS1 negates. The start of an SPI
transaction is signaled by CS1 being asserted low. If the SPI1
logic sees more than 16 SCLK1 pulses while CS1 is
asserted, zeros are returned for all additional bits (bits
beyond bit 15). If a SPI1 transaction contains less than 16bits (too few SCLK cycles), the data that was in process of
being sent during the transaction is discarded and not saved
for retry.
There are eight registers which can be read by SPI1 in a
cyclic fashion. Four of these registers are associated with bus
channel 2, and four are associated with bus channel 3. Data
is deposited into these registers under the following
conditions:
When the bus channel 2 is set for enhanced 10-bit short
words, the SPI1 state machine monitors outgoing bus
addresses and commands on the channel. If the command
sent is $2 (Request AN0), the address portion of the
command is saved. The response received on the next
command is stored into one of the four 16-bit register pointed
to by the channel 2 cyclic buffer write pointer, along with the
address that generated that response (saved from the
previous transaction) with the bits “01”, completing the 16 bit
write. These last two bits indicate that the transaction
occurred on channel 2. The data bits will only be written if the
status bits for that bus transaction all indicate no errors. If a
status error is indicated, the address and channel indicator
bits are stored as described, but the data bits are all set to
zeros. If there was a bus driver shutdown during the
transaction, no buffer write will occur. Further transactions
are written to the next cyclic buffer register in the same way,
overwriting data if necessary.
This same sequence occurs for channel three
transactions, except that the channel indicator bits are “10”,
and writes occur to a separate set of four 16-bit cyclic
registers.
If the channel has been put into loop mode, the same
sequence is used except the buffer write occurs only if the
data is all ones or all zeros, and the saved address from the
previous transaction is the complement of the data. The
channel indicator bits are written the same as if the channel
were in normal mode. The buffer pointer always advances,
even if the buffer is not written, so that it is synchronous with
the SPI0 RX buffer pointer.
The channel buffers are not cleared, in the case of a
channel abort.
Reads from this register by the SPI1 master are also
accomplished in a cyclic buffer way, except the two channels
are concatenated, with channel 3 following channel 2 in the
cyclic sequence. During these buffer reads, if a buffer
position does not contain data, it is skipped. After each buffer
location is read it is cleared by the SPI1 logic.
CSB
SLCK
MISO
b00 b01 b02 b03 b04 b05 b06 b07 b08 b09 b10 b11 b12 b13 b14 b15
Figure 18. SPI1 16-Bit Burst Transfer Example
33781
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
.
SPI
Data Bit
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Bit 8
Bit 9
Bit
10
Bit
11
Bit
12
Bit
13
Bit
14
Bit
15
Read
Only
DO0
DO1
DO2
DO3
DO4
DO5
DO6
DO7
DO8
DO9
A0
A1
A2
A3
C0
C1
Figure 19. SPI1 Bit Encoding
DO[0:9]- Data Bits
C[0:1] - Channel indicator Bits
The received data bits from the bus channel transaction. If
the transaction had any CRC or SDS errors (See page 32
and page 33), then these bits are set to all zeros.
The bits indicate which bus channel the data came from.
“01” indicates channel 2, and “10” indicates channel 3.
DBUS COMMUNICATIONS
A[0:3] - Sensor Address Bits
The address of the slave that sent the data. This is a copy
of the address sent out during the previous bus transaction.
Bit n
…………………
The DBUS messages contain data from the DnH and DnL
registers. A CRC pattern is automatically appended to each
message. The data and CRC lengths are programmed by the
DnLENGTH register. Figure 20 shows the structure of the
DBUS message.
Bit 0
CRC n
……
CRC 0
Figure 20. DBUS Communications Message
DBUS Driver/Receiver communications involve a frame
At the end of a DBUS transfer (and after the CRC error
(DSIF), a data signal (DSIS), and a data return (DSIR) signal.
status is stable), the RNE flag is set to indicate there is data
These are signals internal to the IC associated with the
in the register available to be read.
protocol engine.
DATA RATE
A message starts with a falling edge on the DSIF signal,
which marks the start of a frame. There is a one bit-time delay
The base data rate is determined by the system clock
before the MSB of data appears on DSIS. Data bits start with
(CLK) and the values in the DnFSEL register. The CLK is
a falling edge on DSIS. The low time is 1/3 of the bit time for
assumed to be 4MHz. The CLK is converted to a 64MHz
a 1, and 2/3 of a bit time for a 0. Data is transmitted on DSIS
internal clock with a digital PLL, which is used to form the bit
and received on DSIR simultaneously. Receive data is the
rate clock. The minimum bit clock period which may be
captured level on DSIR at the end of each bit time. As a
programmed is:
message is received, it is stored bit-by-bit into the appropriate
(1/16*fCLK) x 320 = 5 usec
receive register. For each data value received, there is a oneHowever, this period may not meet overall system
bit status flag (ER) to indicate whether or not there was a
requirements
for minimum bit time. Longer base clock
CRC error while receiving the data. At the end of the bit time
periods can be selected by using the DxFSEL register. There
for the last CRC bit, DSIF returns to a logic high (Idle level).
are 8 bits in the DxFSEL register representing values from 0
A minimum delay is imposed between successive frames as
to 255. The complete equation for determining the base clock
determined by the DnCTRL register.
period is:
Users initiate a message by writing (via the SPI0 interface
((1/16*fCLK) x (320 +2x)) where x = 0 to 255
from the MCU) to the high and low byte of the data registers
Table
8 gives some examples of the base data rate for
(DnRnH/L). Transactions are scheduled once the CS0 for
f CLK = 4.0MHz.
that transfer rises. When 9- to 16-bit messages are to be
Table 8. Examples of Base Data Rate
sent, the user writes to the DnH register first, and then the
DnL register, before the combined 9 to 16-bit data value
Base Bit Period
Base Bit Frequency
FSEL
DnH:DnL is sent on the DBUS. The user should first check
(usec)
(kbps)
the TE status flag to be sure the command register is not full
00000000
5.000
200.0
before writing a new data value to DnH and/or DnL. When the
00000001
5.031
198.8
minimum inter-frame delay has been satisfied, and CS0 has
risen, and if no SPI0 framing error has occurred, DSIF will go
00001101
5.406
184.9
low, indicating the start of a new transfer frame.
00101000
6.250
160.0
11111110
12.938
77.3
11111111
12.969
77.1
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
CRC GENERATION /CHECKING
DnRnSTAT register is set at the end of the message along
with the RNE bit.
When no remote peripheral responds to a message, the
data pattern received will be all zeros with a CRC value of 0,
which may be detected as a CRC error depending on the
values of CRCLEN[3:0], CRCPOLY[7:0], and
CRCSEED[7:0].
Whenever a message is sent on the DBUS, a 0- to 8-bit
CRC value is computed and serially sent as the next n bits
after the LSB of the data. The CRC length, polynomial, and
initial seed are determined by the CRCLEN[3:0],
CRCPOLY[7:0], and CRCSEED[7:0] control register fields.
The message, including the CRC bits, is passed along to a
remote peripheral, which computes a separate CRC value as
the message data is received. If this computed and CRC
does not agree with the CRC value received in the message,
the peripheral device considers the message invalid.
Messages received include a 0- to 8-bit CRC value, which
was computed in the peripheral device that is responding. As
the message is received, a separate 0- to 8-bit CRC value is
computed and is compared with the CRC value in the
received message. If these values do not agree, the message
is considered invalid and the ER status bit in the associate
CRC COMPUTATION
The CRC algorithm uses a programmable initialization
value, or seed of CRCSEED[7:0], and a programmable
polynomial of CRCPOLY[7:0]. Figure 21 is a VHDL
description of the CRC algorithm for the DBUS standard 4-bit
CRC, with its initial value of 1010. A seed value is chosen so
that a zero data value will generate a CRC value of 1010. A
block diagram of the default CRC calculation is shown in
Figure 22.
--------------------------------------------------------------------------- Calculates the 4-bit CRC (x^4 + 1) serially for 8 to 16 bits of data.
-------------------------------------------------------------------------constant CRCPoly: std_logic_vector: = “0001”; -- x^4 +1
constant InitCrc: std_logic_vector: = “1010”;
procedure SerialCalculateCRC4(CRC: input std_logic_vector;Data: in std_logic) is variable Xor1: std_logic;
begin
Xor1: = CRC(3) xor Data;
CRC: = CRC(2 downto 0) & ‘0’; -- Shift left 1 bit
if Xor1 = ‘1’ then
CRC: = CRC xor CRCPoly
end if;
end SerialCalculateCRC4;
Figure 21. CRC Algorithm
C3
C2
C1
C0
T
T
T
T
1X4
+
0X3
+
0X2
+
0X1
Input Data
+
+X0
= X4+1
Figure 22. Default CRC Block Diagram
MESSAGE SIZE SPECIAL CASES
The response to any 8- to 15-bit message is expected to
be another 8- to 15-bit message, and the response to any
16-bit message is expected to be another 16-bit message.
This gives rise to some special cases when there is a
transition from one message size to a different message size.
Some messages must be long words (16 bits of data), and
others can be short words (8 to 15 bits of data).
The following are examples where the word is a standard
DSI formatted short word (8 bits of data and 4 bits of CRC).
Example 1: If the previous message was a short word and
the current message is a long word, the response message
(which is also a short word) finishes before the current
message frame, and the CRC bits look like data bits in the
long word format. Since the CRC validation of this short word
message response is not reliable, this short word response
should not be used.
Example 2: If the previous message was a long word and
the current message is a short word, the response message
(which is also a long word) cannot finish before the current
message frame. Bits three to zero of the data and the CRC
bits are lost. Data bits seven to four of the 16-bit response
33781
26
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
message look like the CRC bits of an 8-bit response and
almost certainly would not be correct. Because the response
is incomplete and the CRC check is probably not valid, this
response is not useful.
The long word to short word message size transition
normally only occurs after setting up the DBUS peripherals.
During address setup, a message with address 0000 is sent
to attempt to set the address of the next peripheral on the
daisy-chained bus. Before any peripherals have been
assigned an address, their bus switches are opened so the
addressing message only goes to the first peripheral in line.
As each peripheral gets an address, it closes its bus switch
so the next address assignment command can reach the next
peripheral in line on the bus. Each peripheral responds to an
address assignment only once (during the next message
after the command that set its address). After the last
peripheral has been assigned an address, any subsequent
address assignments will receive no response. When the
master MCU fails to receive a response, it knows it has
passed the last peripheral. At this point, short word messages
may be sent. The first such message will have no meaningful
response associated with it.
The first message after reset is also a special case,
because there was no previous message, therefore there will
be no meaningful response during the first message transfer.
1/3RD BIT CLOCK
CLK 64
MHz
FREQUENCY
SPREADING and
CLOCK DIVIDERS
BUS Driver/Receiver Logic
Addressed Rx Buffer
data
SPI0
control regs
enable regs
poly regs
seed regs
length regs
spread dev
spread fsel
mask ID
check pattern
test mode regs
RSTB
16
data
5
stat
data
stat
data
stat
data
stat
data
16
x pop
ptr
data
PORB
data
16
stat
4
stat
Addressed Tx Buffer
data
Loop Sel
Loop
Mode
Mux
CRC
CRC
check
CRC
check
check
push
slave
addr
data
bit pointer
receiver lowN
receiver highN
receiver sumN
Filter
signal mode
over currentN
Filter
pop
data
Filter
CRC
generate
Tx not empty
enN
abort
MISO0
DSIFn
HZN
MISO1
DBUS XFER
STATE MACHINE
Loop Sel
SPI1 Registers
CSB0
SCLK1
over tempN
DSISn
SCLK0
MOSI0
idle mode
over currentN
16
data
reg pointer
Sample
Filter
Filter
SPI1
10
4
data
addr
data
addr
data
addr
data
addr
data
addr
Misc. Functions
CSB1
Filter
VSUP voltage
compare
Filter
Bus switch
over temp
Figure 23. Logic Block Diagram
LOGIC BLOCK DIAGRAM DESCRIPTION
Figure 23, Logic Block Diagram, shows a block diagram of
the major logic blocks in the IC.
SPI0
The SPI0 is a standard slave serial peripheral interface.
This interface provides two-way communications between
the IC and an MCU. The MCU can write to registers that
control the operation of the IC, and read back the conditions
in the IC using the SPI. It can also write data to be sent out
on the DBUS, and read data that was returned on the DBUS.
The register pointer and bit pointer are used to control which
registers and bits are being written to, and read from using
the SPI. Its operation is described in detail in the section
entitled SPI0 COMMUNICATIONS on page 22.
The register set consists of transmit, receive, control, and
status registers. They are written and read using the SPI0
interface, and are affected by events in the IC. Detailed
descriptions of their operation and use can be found in
section SPI0 Register and Bit Descriptions.
SPI1
The SPI1 is a slave serial peripheral interface. It operates
asynchronously to the SPI0. It uses 16-bit transfers and is
read only. The MOSI function is not implemented. SPI1 only
reads the SPI1 8 16-bit circular buffer registers.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
27
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
SPI1 REGISTERS
An eight position circular buffer made up of 16-bit words.
Reads of these registers occur in a round robin (sequential
order with wrap around at the end) fashion. If a buffer does
not contain any data it is skipped during the round robin
sequence. More information on this buffer can be found in the
section SPI1 Communications.
RST
Asserting this pin low will cause the part to reset, forcing
registers to a known state and resetting the SPI0 and SPI1
buffer pointers. All bus activity will be halted and not allowed
to restart, and no SPI activity will be recognized until the RST
goes to a logic high level.
ADDRESSED TX BUFFER
The Addressed TX Buffer is a cyclic register set that allows
up to four transmit data packets to be stored for future
transmission on the DBUS. This is done to prevent the
overwrite of transmit data if the transmission of the previous
data has not been completed. Each buffer is a 2-byte set that
contains the high byte and low byte of a DBUS command.
The transmit buffer queue looks for the lowest register
number in the channel with data to be sent, and sends it over
the DBUS. It then checks the next sequential buffer - if there
is data to be sent it will send it. If not, that buffer will be
skipped and the next buffer sent if it contains data. If no other
buffers have data ready to be sent, the queue moves back to
the top of the buffer and continues checking until data is
available.
ADDRESSED RX BUFFER
The Addressed RX Buffer is a cyclic register set that
allows up to four responses to be stored without being
transferred to the MCU via the SPI. This is done so that data
will not be lost, even if the MCU takes time to read the
response data. Each buffer is a 3-byte set that contains the
data high byte, data low byte, and status word of a DBUS
response.
The received data from DBUS transactions is stored in the
same receive buffer number as the transmit buffer for that
transaction.
BUS DRIVER/RECEIVER LOGIC
This block controls the physical layer drivers and receive
data from the physical layer receivers. The physical layer
converts the 0V to 5.0V low power logic signals to the higher
voltage and drive levels required for the bus. It also converts
the low current (0mA to 11mA typical) loading of the response
signal from the slave to logic voltage levels, to allow the
response from the slaves to be received.
Each channel contains a CRC generator, that adds a
series of bits to each of the transmitted data words sent out
on the DBUS. The CRC bits are created from the data pattern
and are used by the slave devices to determine if one or more
of the data bits sent was in error. The detailed operation and
control of this function is covered in the section entitled CRC
GENERATION /CHECKING on page 26.
This block also checks the CRC bits that have been added
to the end of the response by the slave device. For a given
pattern of received data, a new CRC is generated and
compared to the CRC bits received. This is performed on the
received data from the bus high side, bus low side and bus
sum circuits in the bus receiver. The results of these checks,
determine if the data are valid, and whether or not the error
bit is set as shown in Table 9. This bit is read back using the
SPI during the same SPI transaction that reads the response,
in order to keep them associated with each other. The CRC
bits are removed by the IC and not seen by the MCU, when
reading the data registers. Operation of the CRC Check is
covered in the section entitled CRC GENERATION /
CHECKING on page 26.
33781
28
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
SPI0 REGISTER AND BIT DESCRIPTIONS
of control registers, along with separate command and data
registers, for queuing up to four commands. There are also
registers containing check pattern data.
The 33781 has 87 registers associated with the SPI0
interface, shown in Table 8. Each bus channel has its own set
Table 9. Register List
Register
Address
Register
Name
Register Definition
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0000000
D0R0H
DBUS 0 Reg 0 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0000001
D0R0L
DBUS 0 Reg 0 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
0000010
D0R0STAT
DBUS 0 Reg 0 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0000011
D0R1H
DBUS 0 Reg 1 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0000100
D0R1L
DBUS 0 Reg 1 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
0000101
D0R1STAT
DBUS 0 Reg 1 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0000110
D0R2H
DBUS 0 Reg 2 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0000111
D0R2L
DBUS 0 Reg 2 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
0001000
D0R2STAT
DBUS 0 Reg 2 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0001001
D0R3H
DBUS 0 Reg 3 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0001010
D0R3L
DBUS 0 Reg 3 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
DBUS 0 Reg 3 Status
0001011
D0R3STAT
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0001100
D0CTRL
DBUS 0 Control Register
-
-
DLYB
DLYA
-
LOOP1
LOOP0
MS
0001101
D0EN
DBUS 0 Enable Register
TS
ISDD
-
-
-
BSWH
BSWL
EN
0001110
D0POLY
0001111
0010000
D0SEED
D0LENGTH
DBUS 0 Polynomial
DBUS 0 CRC Seed
DBUS 0 Short Word and
CRC Lengths
CRC
CRC
CRC
CRC
CRC
CRC
CRC
CRC
POLY7
POLY6
POLY5
POLY4
POLY3
POLY2
POLY1
POLY0
CRC
CRC
SEED7
SEED6
CRCSEE CRCSEE CRCSEE CRCSEE CRCSEE CRCSEE
D5
D4
D3
D2
D1
D0
SW
SW
SW
SW
CRC
CRC
CRC
CRC
LEN3
LEN2
LEN1
LEN0
LEN3
LEN2
LEN1
LEN0
0010001
D0SSCTRL
DBUS 0 Spread Spectrum
Control
-
-
-
-
-
DEV2
DEV1
DEV0
0010010
D0FSEL
DBUS 0 Frequency Select
FSEL7
FSEL6
FSEL5
FSEL4
FSEL3
FSEL2
FSEL1
FSEL0
0010011
RESERVED Writes/reads of this address
are ignored
-
-
-
-
-
-
-
-
0010100
RESERVED Writes/reads of this address
are ignored
-
-
-
-
-
-
-
-
0010101
D1R0H
DBUS 1 Reg 0 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0010110
D1R0L
DBUS 1 Reg 0 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
0010111
D1R0STAT
DBUS 1 Reg 0 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0011000
D1R1H
DBUS 1 Reg 1 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0011001
D1R1L
DBUS 1 Reg 1 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
0011010
D1R1STAT
DBUS 1 Reg 1 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0011011
D1R2H
DBUS 1 Reg 2 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0011100
D1R2L
DBUS 1 Reg 2 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
0011101
D1R2STAT
DBUS 1 Reg 2 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0011110
D1R3H
DBUS 1 Reg 3 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0011111
D1R3L
DBUS 1 Reg 3 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
29
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Table 9. Register List (continued)
Register
Address
Register
Name
0100000
D1R3STAT
Register Definition
DBUS 1 Reg 3 Status
0100001
D1CTRL
DBUS 1 Control Register
0100010
D1EN
DBUS 1 Enable Register
0100011
D1POLY
0100100
0100101
D1SEED
D1LENGTH
DBUS 1 Polynomial
DBUS 1 CRC Seed
DBUS 1 Short Word and
CRC Lengths
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
-
-
DLYB
DLYA
-
LOOP1
LOOP0
MS
TS
ISDD
-
-
-
-
-
EN
CRC
CRC
CRC
CRC
CRC
CRC
CRC
CRC
POLY7
POLY6
POLY5
POLY4
POLY3
POLY2
POLY1
POLY0
CRC
CRC
SEED7
SEED6
CRCSEE CRCSEE CRCSEE CRCSEE CRCSEE CRCSEE
D5
D4
D3
D2
D1
D0
SW
SW
SW
SW
CRC
CRC
CRC
CRC
LEN3
LEN2
LEN1
LEN0
LEN3
LEN2
LEN1
LEN0
0100110
D1SSCTRL
DBUS 1 Spread Spectrum
Control
-
-
-
-
-
DEV2
DEV1
DEV0
0100111
D1FSEL
DBUS 1 Frequency Select
FSEL7
FSEL6
FSEL5
FSEL4
FSEL3
FSEL2
FSEL1
FSEL0
0101000
RESERVED Writes/reads of this address
are ignored
-
-
-
-
-
-
-
-
0101001
RESERVED Writes/reads of this address
are ignored
-
-
-
-
-
-
-
-
0101010
D2R0H
DBUS 2 Reg 0 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0101011
D2R0L
DBUS 2 Reg 0 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
0101100
D2R0STAT
DBUS 2 Reg 0 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0101101
D2R1H
DBUS 2 Reg 1 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0101110
D2R1L
DBUS 2 Reg 1 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
0101111
D2R1STAT
DBUS 2 Reg 1 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0110000
D2R2H
DBUS 2 Reg 2 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0110001
D2R2L
DBUS 2 Reg 2 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
DBUS 2 Reg 2 Status
0110010
D2R2STAT
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0110011
D2R3H
DBUS 2 Reg 3 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
0110100
D2R3L
DBUS 2 Reg 3 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
0110101
D2R3STAT
DBUS 2 Reg 3 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
0110110
D2CTRL
DBUS 2 Control Register
0110111
D2EN
DBUS 2 Enable Register
0111000
D2POLY
0111001
0111010
D2SEED
D2LENGTH
DBUS 2 Polynomial
DBUS 2 CRC Seed
DBUS 2 Short Word and
CRC Lengths
-
-
DLYB
DLYA
-
LOOP1
LOOP0
MS
TS
ISDD
-
-
-
-
-
EN
CRC
CRC
CRC
CRC
CRC
CRC
CRC
CRC
POLY7
POLY6
POLY5
POLY4
POLY3
POLY2
POLY1
POLY0
CRC
CRC
SEED7
SEED6
CRCSEE CRCSEE CRCSEE CRCSEE CRCSEE CRCSEE
D5
D4
D3
D2
D1
D0
SW
SW
SW
SW
CRC
CRC
CRC
CRC
LEN3
LEN2
LEN1
LEN0
LEN3
LEN2
LEN1
LEN0
0111011
D2SSCTRL
DBUS 2 Spread Spectrum
Control
-
-
-
-
-
DEV2
DEV1
DEV0
0111100
D2FSEL
DBUS 2 Frequency Select
FSEL7
FSEL6
FSEL5
FSEL4
FSEL3
FSEL2
FSEL1
FSEL0
0111101
RESERVED Writes/reads of this address
are ignored
-
-
-
-
-
-
-
-
0111110
RESERVED Writes/reads of this address
are ignored
-
-
-
-
-
-
-
-
33781
30
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Table 9. Register List (continued)
Register
Address
Register
Name
Register Definition
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0111111
D3R0H
DBUS 3 Reg 0 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
1000000
D3R0L
DBUS 3 Reg 0 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
1000001
D3R0STAT
DBUS 3 Reg 0 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
1000010
D3R1H
DBUS 3 Reg 1 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
1000011
D3R1L
DBUS 3 Reg 1 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
DBUS 3 Reg 1 Status
1000100
D3R1STAT
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
1000101
D3R2H
DBUS 3 Reg 2 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
1000110
D3R2L
DBUS 3 Reg 2 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
1000111
D3R2STAT
DBUS 3 Reg 2 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
1001000
D3R3H
DBUS 3 Reg 3 Upper Byte
D15
D14
D13
D12
D11
D10
D9
D8
1001001
D3R3L
DBUS 3 Reg 3 Lower Byte
D7
D6
D5
D4
D3
D2
D1
D0
1001010
D3R3STAT
DBUS 3 Reg 3 Status
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
1001011
D3CTRL
DBUS 3 Control Register
-
-
DLYB
DLYA
-
LOOP1
LOOP0
MS
1001100
D3EN
DBUS 3 Enable Register
1001101
D3POLY
DBUS 3 Polynomial
1001110
D3SEED
DBUS 3 CRC Seed
1001111
D3LENGTH
DBUS 3 Short Word and
CRC Lengths
1010000
D3SSCTRL
DBUS 3 Spread Spectrum
Control
1010001
D3FSEL
1010010
TS
ISDD
-
-
-
-
-
EN
CRC
CRC
CRC
CRC
CRC
CRC
CRC
CRC
POLY7
POLY6
POLY5
POLY4
POLY3
POLY2
POLY1
POLY0
CRC
CRC
SEED7
CRCSEE CRCSEE CRCSEE CRCSEE CRCSEE CRCSEE
D5
D4
D3
D2
D1
D0
SEED6
SW
SW
SW
SW
CRC
CRC
CRC
CRC
LEN3
LEN2
LEN1
LEN0
LEN3
LEN2
LEN1
LEN0
-
-
-
-
-
DEV2
DEV1
DEV0
DBUS 3 Frequency Select
FSEL7
FSEL6
FSEL5
FSEL4
FSEL3
FSEL2
FSEL1
FSEL0
MASKID
Mask Version ID Code
FPAR
ID6
ID5
ID4
ID3
ID2
ID1
ID0
1010011
CHKCD0
Check Pattern 0
CKPTN2 CKPTN2 CKPTN2 CKPTN2 CKPTN1 CKPTN1 CKPTN1 CKPTN1
3
2
1
0
9
8
7
6
1010100
CHKCD1
Check Pattern 1
CKPTN1 CKPTN1 CKPTN1 CKPTN1 CKPTN1 CKPTN1 CKPTN9 CKPTN8
5
4
3
2
1
0
1010101
CHKCD2
Check Pattern 2
CKPTN7 CKPTN6 CKPTN5 CKPTN4 CKPTN3 CKPTN2 CKPTN1 CKPTN0
1010110
NCKCD0
Negative Check Pattern 0
NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN
23
22
21
20
19
18
17
16
1010111
NCKCD1
Negative Check Pattern 1
NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN
15
14
13
12
11
10
9
8
1011000
NCKCD2
Negative Check Pattern 2
NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN NCKPTN
7
6
5
4
3
2
1
0
1011001
RESERVED Writes/reads of this address
are ignored
-
-
-
-
-
-
-
-
1011010
RESERVED Writes/reads of this address
are ignored
-
-
-
-
-
-
-
-
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
DnRnH REGISTERS
The bit assignments are shown in Figure 24. Even if a
short word of 8 bits is selected for this bus (MSn = 1), this
register must be written in the SPI burst sequence. When the
short word length is set at other than 8 bits, this register will
contain the bits above eight, starting with the ninth bit in the
least significant bit position of the register. Unused bit
positions are don’t care values.
These are read/write registers. There are sixteen of these
registers, four for each of the buses, as shown in Table 8.
When written to, the data is the high byte of a 9- to16-bit
command. When read, it is the high byte of a 9- to 16-bit
return on the DBUS. Writing to this register and the low byte
register without a framing error schedules a DBUS
transaction.
SPI Data Bit
Bit 7
6
5
4
3
2
1
0
Read/Write
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
0
0
0
0
0
0
0
0
Reset
Figure 24. DnRnH Data Register Bit Assignments
DnRnL REGISTERS
register and the high byte register without a framing error,
schedules a DBUS transaction. The bit assignments are
shown in Figure 25
If this address is pointed to by the first SPI0 byte of a SPI
burst transaction, that transaction is ignored.
These are read/write registers. There are sixteen of these
registers, four for each of the buses. When written to, the data
is the low byte of a 16-bit command. When in read, it is the
low byte of a 16-bit return on the DBUS. Writing to this
SPI Data Bit
Bit 7
6
5
4
3
2
1
0
Read/Write
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
Reset
Figure 25. DnRnL Data Register Bit Assignments
DnRnSTAT REGISTER
CS0 is de-asserted. This is done to ensure that partial
updates will not occur. If this address is pointed to by the first
SPI0 byte of a SPI burst transaction, that transaction is
ignored.
The bit assignments are shown in Figure 26.
There are read-only registers. These registers cover the
status of their associated DnRnH and DnRnl registers. The
values are latched when CS0 is asserted low. Any changes of
status detected by these bits will not update the register until
SPI Data Bit
Bit 7
6
5
4
3
2
1
0
Read
ER
TE
SDS
RNE
ICL
0
FIX0
FIX1
Reset
0
1
0
0
0
0
0
1
Figure 26. DnRnSTAT Register Bit Assignments
ER–CRC Error Bit
• 0 = CRC value for the data in the read buffer was
correct.
• 1 = CRC value for the data in the read buffer was not
correct (data not valid).
CRC errors are associated with each receive buffer, so
that each buffer has a bit to indicate whether the data in that
buffer was received correctly. Whenever a received data
value is available in the DnRnH and DnRnL registers, the
associated CRC error status is available at ERn in the
associated DnRnSTAT register. The ER bit is set or cleared
whenever data is written from the DBUS into the DnRnH/L
receive registers. If Channel Thermal Shutdown or Idle and
SIgnal Mode Disable occur, these bits will be reset along with
the other channel register bits.
TE–Transmit Register Empty Bit
• 0 = Transmit buffer not empty.
• 1 = Transmit buffer empty.
This bit indicates that data has been written to the
associated channel register high and/or low, but has not been
read for sending on the DBUS. The bit is set to 0 on the rising
33781
32
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
During Idle mode, the current limit is independently sensed
on both the high side and the low side of the bus driver. An
over-current fault condition occurs if either DnH or DnL is
within the sourcing or sinking limit (500mA). This is
characterized by both DnH and DnL voltage levels being
simultaneously at either ground or the bus voltage VBUS.
The ICL bit is set and the drivers are disabled if either of
the following conditions are true:
• the fault condition occurs continuously for 2.5μs
• the fault condition occurs four times with 50μs or less
between occurrences
Figure 27 shows a representation of the over-current fault
condition circuitry.
edge of CS0 after a SPI0 write to the associated DnRnH/L
registers. It is set to 1 once the DBUS state machine
completes sending the DnRnH/L data in the buffer over the
DBUS.
If SPI0 attempts to write to a transmit register that is not
empty, the new command will be ignored.
SDS - Signal Mode Shutdown
• 0 = Bus driver is active.
• 1 = High side or low side bus driver had a current
shutdown during signal mode in this DBUS transaction.
The bus driver current is independently sensed on both the
high side and the low side of the driver during signaling mode.
This bit is set if either driver exceeds the over-current
detection threshold for greater than the delay time. In that
event, the driver is disabled (becomes high-impedance) for
the remainder of that DBUS transaction.
The MCU can use this bit along with other fault condition
bits to detect that the data in this buffer may be invalid.
LIM_DH_H
LIM_DL_H
Over-current Fault
LIM_DH_L
RNE–Receive Register Not Empty Bit
LIM_DL_L
• 0 = No new data ready.
• 1 = Data is available to be read.
This bit is set when the DBUS writes to the associated
DnRnH and DnRnL registers. The bit is cleared on the rising
edge of CS0 after a read of the DnRn STAT register. This bit
is cleared even if a SPI0 framing error occurred during the
SPI burst transfer that read the receive register.
This bit will not be set if the VSUP voltage falls below the
low voltage detect threshold for longer than the VSUP low
mask time during the associated bus transfer.
Figure 27. Over-current Fault Condition for ICL Bit
Fix[0:1] - Fixed Bits
These are hard coded bits - FIX0 is always zero and FIX1
is always one. These bits are the last two bits transmitted
during the SPI message. Since their values are always fixed,
these bits enable the Main MCU software to determine if the
SPI data was shifted due to one too many, or one too few SPI
clocks.
DnCTRL REGISTER
ICL - Idle Mode Double Current Limit Bit (Idle Mode
Shutdown)
The read/write DnCTRL register sets up conditions to be
used on the DBUS. There are four of these registers, one for
each of the buses. The bit assignments are shown in
Figure 28.
• 0 = Idle mode current limit not active.
• 1 = Idle mode current limit active.
SPI Data Bit
Bit 7
6
5
4
3
2
1
0
Read/Write
-
-
DLYB
DLYA
-
LOOP1
LOOP0
MS
Reset
0
0
0
0
0
0
0
0
Figure 28. Dn Control Register Bit Assignment
high to IDLE voltage transition) to the start of a new DBUS
Each bus n has an associated DnCTRL register. This
transaction (signaled by the start of the IDLE voltage to signal
register should be written to before data is sent over its bus.
high transition).
A write to the register will abort any current activity on the bus.
Any bit changes will take place on the next DBUS transaction
following the conclusion of the SPI write to the register. Refer
to the Protocol Engine section for more detail.
Table 10. DLY[B:A] Frame Spacing
DLY[B:A]–Interframe Delay for Channel n
These bits specify the minimum delay between transfer
frames on the bus as illustrated in Table 10. For example,
when DLY[B:A] is set to 00, there is a minimum of four bit
times of IDLE voltage level. The time is measured from the
end of a DBUS transaction (signaled by the start of the signal
DLY[B:A]
Minimum Delay Between Frames
(Bit Times)
00
4
01
5
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
33
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
disables the bus channel and clears the EN bit in the DnEN
register.
Table 10. DLY[B:A] Frame Spacing (continued)
10
6
11
8
MS–Message Size for Channel n
• 0 = Long Word.
• 1 = Short Word
The Long Word will contain 16 bits of data and 0 to 8 bits
of CRC. The Short Word can be made to have between 8 and
15 bits of data and 0 to 8 bits of CRC. Long words are
generally used for configuration and setup messages. Short
words are generally used for DBUS data transactions.
LOOP[1:0]- LOOP MODE CONTROL
• 00, 01, 10 = Loop Mode disabled.
• 11 = Loop Mode enabled
When loop mode is enabled, the transmitter and receiver
circuits are connected within the IC. This allows data to be
passed directly through the transmit and receive circuits
without going out on the DBUS channel. When LOOP mode
is enabled, the DBUS channel is disconnected from the
transmitter and receiver circuits, so that any bus fault
conditions do not interfere with this test. Setting this bit also
DnEN REGISTER
This read/write register is used to enable or disable each
of the buses. It also allows the channel thermal shutdown and
bus driver shutdown bits to be read. The bit assignments are
shown in Figure 29.
SPI Data Bit
Bit 7
6
5
4
3
Read/Write
TS
ISDD
-
-
-
0
0
0
0
0
Reset
2
1
BSWH
BSWL
(D0EN only) (D0EN only)
0
0
0
EN
0
Figure 29. DnEN Register Bits
TS – Indicates a Thermal Shutdown on Channel n
• 0 = No thermal shutdown occurring on the Channel.
• 1 = Thermal shutdown has occurred on the Channel.
If the channel bus thermal limit is reached for either of the
channel bus drivers, the channel drivers are disabled and the
TS bit is set. There is a 4 μsec filter on Tlim to prevent false
triggering. When this bit is set, the channel registers are all
reset along with the buffer pointers. Any DBUS transfer that
was in progress is stopped.
If the shutdown occurs on channel zero, the pseudo bus
switches are also opened and the BSWH and BSWL bits are
cleared. If the thermal limit is reached on either of the pseudo
bus switches (but not on the channel zero drivers), the bus
switches are opened, only the BSWH and BSWL bits are
cleared, and no other register bits are changed.
The TS bit is cleared after a zero has been written to the
TS bit.
ISDD - Idle and Signal Mode Disable on Channel n
• 0 = Idle and signal mode are active on the Channel.
• 1 = During signaling mode, the bus driver has shut
down for sequential transactions on the Channel and
the bus drivers are now disabled (high-impedance).
If a channel high side or low side bus driver over-current
limit is reached during signaling mode in 2 consecutive
frames, the bus drivers are disabled and the ISDD bit is set.
If the condition occurs on channel zero, the pseudo bus
switches are also opened and the BSWH and BSWL bits are
cleared. In addition, the channel buffer registers are reset, the
buffer pointers are reset, and the EN bit is cleared. The
remainder of the channel registers are not changed. Any
DBUS transfer that was in progress is stopped. The ISDD bit
is cleared when the MCU writes a zero to this bit.
BSWH - Bus Switch High Enable
• 0 = Channel 0 Bus High Switch Open
• 1 = Channel 0 Bus High Switch Close
Channel 0 of the 33781 has a switch on both the high side
and the low side of the bus output driver to allow the channel
to drive two separate sets of bus wires. Through this bus
switch the bus receiver can also receive data from slaves on
both of these buses. When the BSWH bit is written as zero,
the high side bus switch will be open. When the bit is written
as a 1, the high side bus switch will be closed. Reads of this
bit show the current state of the high side bus switch.
The BSWH bit is cleared and the bus switch opened if a
channel zero thermal shutdown occurs, if the channel zero
EN bit is cleared or ISDD bit is set, or if the high side or low
side pseudo bus thermal limit is exceeded. It is necessary to
write a one to the BSWH bit to close the switch again.
BSWL - Bus Switch Low Enable
• 0 = Channel 0 Bus Low Switch Open
• 1 = Channel 0 Bus Low Switch Close
When the BSWL bit is written as zero, the low side bus
switch will be open. When the bit is written as a 1, the low side
bus switch will be closed. Reads of this bit show the current
state of the low side bus switch.
The BSWL bit is cleared and the bus switch opened, if a
channel 0 thermal shutdown occurs, if the channel zero EN
33781
34
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
bit is cleared or the ISDD bit is set, or if the high side or low
side pseudo bus thermal limit is exceed. It is necessary to
write a one to the BSWL bit to close the switch again.
stopped. If the write is to channel 0, the pseudo bus switches
are also opened and the BSWH and BSWL bits are cleared.
The EN bit is also cleared and the channel disabled if a
thermal shutdown occurs. It is necessary to write a 1 to the
EN bit to turn it back on.
EN – Controls Enabling and Disabling of Channel
• 0 = The Channel is disabled.
• 1 = The Channel is enabled.
When the channel is disabled, the channel addressed
buffer data bits, the status register bits, and the buffer
pointers are reset. Any DBUS transfer that was in progress is
SPI Data Bit
Read/Write
Reset
Bit 7
6
5
DnPOLY REGISTERS
These read/write registers control the polynomial used for
calculating the CRC that is transmitted/received on the DBUS
channels. There are four of these registers, one for each
DBUS channel. The bit assignments are shown in Figure 30.
4
3
2
1
0
CRCPOLY7 CRCPOLY6 CRCPOLY5 CRCPOLY4 CRCPOLY3 CRCPOLY2 CRCPOLY1 CRCPOLY0
0
0
0
1
0
0
0
1
Figure 30. Dn Polynomial Register Bit Assignments
Each bit represents a polynomial term in the CRC
A write to the register will abort any current activity on the
equation. Bit 7 represents x7, bit 6 represents x6, and so on.
bus. Any bit changes will take place on the next DBUS
Both the short and long word command use the same
transaction following the conclusion of the SPI write to the
polynomial. The polynomial bits beyond what is specified in
register.
the CRCLEN[3:0] registers are ignored, and the most
significant term of each polynomial is assumed to be on. So,
DnSEED REGISTERS
for example, to represent a 6-bit CRC with a polynomial of
These read/write registers control the initial value, or seed,
x6+ x3 + 1, the value in DnPOLY is xx001001. Bits 7 and 6 are
used
for calculating the CRC that is transmitted/received on
ignored in this case. These registers reset to 00010001 (x4 +
the DBUS channels. There are four of these registers, one for
1), which is the default DSI value (bit 4 does not need to be
each DBUS channel. The bit assignments are shown in
on for this case, but is included for readability).
Figure 31.
SPI Data Bit
Read/Write
Reset
Bit 7
6
CRCSEED7 CRCEED6
0
0
5
4
3
2
1
0
CRCEED5
CRCEED4
CRCEED3
CRCEED2
CRCEED1
CRCEED0
0
0
1
0
1
0
Figure 31. Dn CRC Seed Register Bit Assignments
The bits in these registers form a word that is used as the
transaction following the conclusion of the SPI write to the
seed for the CRC calculations. Both the short and long word
register.
commands use the same seed. The seed bits beyond what is
specified in the CRCLEN[3:0] registers are ignored. So, for
DnLENGTH REGISTERS
example, to represent a 6-bit CRC with a seed 010101, the
These read/write registers control the short word lengths
value in DnSEED is xx010101. Bits 7 and 6 are ignored in this
and CRC lengths for data that is transmitted/received on the
case. These registers reset to 00001010, which is the default
DBUS channels. There are four of these registers, one for
DSI value.
each DBUS channel. The bit assignments are shown in
A write to the register will abort any current activity on the
Figure 32.
bus. Any bit changes will take place on the next DBUS
SPI Data Bit
Bit 7
6
5
4
3
2
1
0
Read/Write
SWLEN3
SWLEN2
SWLEN1
SWLEN0
CRCLEN3
CRCLEN2
CRCLEN1
CRCLEN0
1
0
0
0
0
1
0
0
Reset
Figure 32. Dn Short Word and CRC Length Register Bit Assignments
A write to the register will abort any current activity on the
transaction following the conclusion of the SPI write to the
bus. Any bit changes will take place on the next DBUS
register.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
CRCLEN[3:0] values range from 0 bits (no CRC) to 8 bits. If
an attempt is made to write a value that is greater than 8 bits,
the value 8 (1000) is automatically written into this register.
The CRCLEN[3:0] value overrides the CRCPOLY and
CRCSEED bit values that are beyond what the CRCLEN[3:0]
specifies.
SWLEN[3:0]–Short Word Length in Bits
These bits specify the bit length of the short word
command that will be sent onto the specified DBUS channel.
The reset value for these bits is 1000 (8 bits), which is the
default DSI value. Allowed SWLEN[3:0] values range from
8 bits to 15 bits. If an attempt is made to write a value that is
less than 8 bits, a 1 is automatically written to SWLEN3,
thereby making the register value greater than or equal to 8
bits.
DnSSCTRL REGISTERS
These registers control the operation of the spread
spectrum circuits.
A write to the register will abort any current activity on the
bus. Any bit changes will take place on the next DBUS
transaction following the conclusion of the SPI write to this
register. The bit assignments are shown in Figure 33.
CRCLEN[3:0]–CRC Length in Bits
These bits specify the bit length of CRCs that are sent out
with commands and read back in. The length is valid for both
short and long word commands. The reset value for these
bits is 0100 (4 bits), which is the default DSI value. Allowed
SPI Data Bit
Bit 7
6
5
4
3
2
1
0
Read/Write
-
-
-
-
-
DEV2
DEV1
DEV0
Reset
0
0
0
0
0
0
0
0
Figure 33. Dn Spread Spectrum Control Register Bit Assignment
period to the base time period plus 1 μsec in 64 equal steps.
The mode with deviation disabled may be used to achieve
fine control of the bit rate without frequency spreading.
DEV[2:0]–Spread Spectrum Frequency Deviation for
Channel n
These bits control the frequency deviation of the spread
spectrum signalling.
DnFSEL REGISTERS
DEV[2:0] = 000 - No Deviation.
DEV[2:0] = 001 - 16 1/64 MHz periods Max Deviation
DEV[2:0] = 010 - 32 1/64 MHz periods Max Deviation
DEV[2:0] = 011 - 64 1/64 MHz periods Max Deviation
DEV[2:0] = 100 - 78 1/64 MHz periods Max Deviation
The deviation is the max number of 1/64MHz time periods
which are randomly added to the base time period to achieve
the spread spectrum effect. So for example, if you choose
DEV=011, the bit time will randomly vary from the base time
These read/write registers control the spread spectrum
base time period. There are four of these registers, one for
each DBUS channel. The bit assignments are shown in
Figure 34.
A write to one of these registers will abort any current
activity on the bus. Any bit changes will take place on the next
DBUS transaction following the conclusion of the SPI write to
the register. Refer to the Spread Spectrum section for more
detail.
SPI Data Bit
Bit 7
6
5
4
3
2
1
0
Read/Write
FSEL7
FSEL6
FSEL5
FSEL4
FSEL3
FSEL2
FSEL1
FSEL0
0
0
1
0
1
0
0
0
Reset
Figure 34. Dn Frequency Selection Register Bit Assignments
DnFSEL[7:0] - Channel Frequency Selection Bits
These bits select the channel base time period. These bits
determine the minimum bit time (maximum bit frequency for
a channel. The equation for the minimum bit time is:
((1/16*fCLK) x (320 +2x)) where x = 0 to 255 (decimal)
The hex value for x in the equation is represented by the
FSEL[7:0] bits
With a 4MHz clock and these bits set to zero the max bit
rate is 200kbps. Table 8 gives some examples of the max bit
rate and minimum bit time for f CLK = 4.0MHz.
MASKID REGISTER
This read-only register contains seven mask ID bits for the
silicon. This ID can reflect the version, design change
number, or other encoded information. The purpose is for the
central module CPU to be able to know what version of silicon
33781
36
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
is in the system. The Fuse Parity Error Bit is also included in
this register. The bit encoding is shown in Figure 35
SPI Data Bit
Read Only
Reset
Bit 7
6
5
4
3
2
1
0
FPAR
ID6
ID5
ID4
ID3
ID2
ID1
ID0
0
0
0
0
0
0
0
1
Figure 35. Mask ID Register Bit Assignments
FPAR – Fuse Parity Error Bit
ID[6:0] – Mask ID number
• 0 = No fuse parity error.
• 1 = There is a fuse parity error.
Some parameters in the device are trimmed by fuses.
Since these parameters can be impacted by the state of the
fuses, a fuse parity is calculated and stored during device
manufacturing. When the device is powered up, the current
fuse parity is checked against the stored parity. If they do not
match this bit is set. This bit is also set if the part is
untrimmed.
The mask ID that identifies different versions or revisions
of the device.
SPI Data Bit
Check Pattern and Negative Check Pattern
RegisteRS
These read-only registers are for checking whether there
is a stuck bus bit. These registers are read as a 3 byte burst
using a standard SPI burst frame The bit encoding is shown
in Figure 36 and Figure 37
Bit 7
6
5
4
3
2
1
0
Read
CKPTN23
CKPTN22
CKPTN21
CKPTN20
CKPTN19
CKPTN18
CKPTN17
CKPTN16
Reset
1
0
1
0
1
0
1
0
Read
CKPTN15
CKPTN14
CKPTN13
CKPTN12
CKPTN11
CKPTN10
CKPTN09
CKPTN08
Reset
0
1
0
1
0
1
0
1
Read
CKPTN07
CKPTN06
CKPTN05
CKPTN04
CKPTN03
CKPTN02
CKPTN01
CKPTN00
Reset
1
0
1
0
1
0
1
0
1
0
Figure 36. Check Pattern Registers Bit Assignments
SPI Data Bit
Read
Reset
Read
Reset
Read
Reset
Bit 7
6
5
4
3
2
NCKPTN23 NCKPTN22 NCKPTN21 NCKPTN20 NCKPTN19 NCKPTN18 NCKPTN17 NCKPTN16
0
1
0
1
0
1
0
1
NCKPTN15 NCKPTN14 NCKPTN13 NCKPTN12 NCKPTN11 NCKPTN10 NCKPTN09 NCKPTN08
1
0
1
0
1
0
1
0
NCKPTN07 NCKPTN06 NCKPTN05 NCKPTN04 NCKPTN03 NCKPTN02 NCKPTN01 NCKPTN00
0
1
0
1
0
1
0
1
Figure 37. Negative Check Pattern Registers Bit Assignments
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
37
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
PROTECTION AND DIAGNOSTIC FEATURES
OVER-CURRENT PROTECTION
Current limiters on the outputs prevent damage in the case
of shorts. Running in current limit results in high power
dissipation of the IC. If the power dissipation becomes high
enough, the die temperature will rise above its maximum
rating and an over-temperature circuit on the IC will shut
down the DBUS Driver/Receiver block.
Each channel high and low side bus drivers have current
limits for protection of both this device and slave devices
connected on the DBUS. During idle mode, the DnH drivers
have a high value current limit when sourcing current to allow
the drivers to charge the slave power storage capacitors, and
a lower value current limit when sinking current and slewing
the load capacitance. Conversely, the DnL drivers have a
high value current limit when they are sinking current, and a
lower value current limit when they are sourcing current.
In addition, the device monitors the current limit on each
channel to see if the channel is in “double current limit” during
every idle state. See ICL - Idle Mode Double Current Limit Bit
(Idle Mode Shutdown) on page 33. If the idle current limit is
detected, the ICL bit is set in the DnSTAT register for the next
DBUS transaction.
During signaling mode, the drivers incorporate a gross
current limit and an over-current shutdown. The current
shutdown is set at a low value, such that the channel high and
low side bus driver will shut down if the sourcing or sinking
current remains at a value larger than the response current.
The over-current shutdown is delayed by a filter to allow the
load capacitors to be slewed without causing a shutdown.
The purpose of the gross current limit is to protect the
drivers during the filter delay time. This current limit is set
higher than the peak current required to slew the load
capacitance.
The signals from the sourcing and sinking current
detection circuits are connected to a logical OR. The
combined signal passes through a common filter before
setting the over-current latch. During signaling mode, the
over-current shutdown disables both bus drivers and sets the
SDS (Signal Driver Shutdown) bit in the appropriate DnSTAT
register. The drivers remain high-impedance until the end of
Frame, when the bus returns to the Idle state.
The end of Frame clears the over-current shutdown state,
allowing the bus drivers to retry in the next Frame. However,
if the signal mode over-current shutdown occurs in two
sequential frames for the channel, the bus drivers are
disabled and can only be re-enabled on command from the
MCU. The ISDD bit is also set in the channel DEN register. If
the affected channel is channel 0 this set of conditions also
disables the pseudo bus switch.
THERMAL PROTECTION
Independent thermal protection is provided for each
channel and the Pseudo bus switches. The thermal limit cell
is located adjacent to the bus drivers for each channel, such
that both drivers are protected. When a thermal fault is
detected, the channel drivers are disabled (Hi-Z) until they
are re-enabled via the SPI. The thermal protection
incorporates hysteresis, preventing the channel bus drivers
from being re-enabled until the temperature has decreased.
Thermal fault information is reported via the DEN register.
See DnEN Register section for a description of the fault
reporting and clearing of the EN bits.
LOAD DUMP OPERATION
During an over-voltage condition (e.g., when load dump is
applied at the VSUPn pins), the DBUS voltage waveform is
modified to ensure that power dissipation is minimized,
DBUS timing is not violated, and internal components are
protected.
The midpoint of the signalling voltage is clamped at about
13V, such that for VSUPn greater than 26V, the signalling
voltage levels do not increase. An over-voltage detection
circuit connected to DnH, having a threshold at about 26V,
causes the slew rates and driver conditions to be modified.
For a Signal-to-Idle transition, this causes the DnH voltage to
rise rapidly to the Idle state, and the DnL voltage is
maintained close to zero. For an Idle-to-Signal transition, the
DnH voltage will decrease rapidly until the over-voltage
threshold is reached, when normal operation resumes.
During this rapid fall of DnH, the DnL voltage is maintained
close to zero by forcing that driver on. See Figure 6.
RESET FUNCTION
A low level on RST forces all internal registers to a known
(reset) state and the receive and transmit queue pointers are
reset. Because the DBUS channels are now disabled (ENn =
0), the DBUS lines are tri-stated.
ABORT FUNCTION
An abort is generated on a channel whenever a control
register (DnCTRL, DnPOLY, DnSEED, DnLENGTH,
DnSSCTRL or DnFSEL) is addressed while writing, even if
the data is unchanged. No other register writes cause an
abort, and reads of any register do not cause an abort. The
abort is only taken for the channel where the write occurs - all
other channels are not effected. The DEN register is not
affected by an abort.
The abort occurs as soon as the address of the control
register is received on the SPI. Any DBUS transfer that was
in progress is stopped, and DBUS lines return to their Idle
states. The abort condition remains true throughout the SPI0
write to the DBUS control registers. After the last bit of the
DBUS control register is written, the channel addressed
buffer data bits and the SPI1 registers are cleared, the status
register bits are reset, and the transmit and receive queue
pointers are reset for both SPI0 and SPI1. The programmed
inter-frame delay is then enforced (using the new values of
the delay control bits) to allow reservoir capacitors in remote
33781
38
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
nodes to charge. In the case of DLY changing, any partial
inter-frame delay based on old control settings is lost.
ENABLE (DISABLE) FUNCTION
When a DBUS channel is disabled, the 33781 device
forces its bus output to tri-state. When the channel is disabled
the channel addressed buffer data bits are cleared, the status
register bits are reset, and the transmit and receive queue
reset. Any DBUS transfer that was in progress is stopped.
CHANNEL LOOP FUNCTION
When loop mode is enabled the transmitter and receiver
circuits are connected within the IC. This allows data to be
passed directly through the transmit and receive circuits
without going out on the DBUS channel. When LOOP mode
is enabled the DBUS channel is disconnected from the
transmitter and receiver circuits so that any bus fault
conditions do not interfere with this test. When the loop
function is enabled, the EN bit in the DnEN register is cleared,
the buffer data bits are cleared, the status register bits are
reset, and the transmit and receive queue reset the by the
state machine. When the loop mode is exited the state
machine sets the registers to their reset state and resets the
transmit and receive queue. This allows proper start up of bus
transactions.
The channel queue pointers work the same as in non-loop
mode.
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.
EK SUFFIX (PB-FREE)
32-PIN
98ASA10556D
ISSUE B
33781
40
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGE DIMENSIONS
EK SUFFIX (PB-FREE)
32-PIN
98ASA10556D
ISSUE B
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
41
PACKAGE DIMENSIONS
EK SUFFIX (PB-FREE)
32-PIN
98ASA10556D
ISSUE B
33781
42
Analog Integrated Circuit Device Data
Freescale Semiconductor
REVISION HISTORY
PACKAGE DIMENSIONS
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
1
3/2008
• Initial Release
2
5/2008
3
7/2008
4
7/2008
•
•
•
•
•
5.0
11/2009
• Changed Part Number from PCZ33781EK/R2 to MCZ33781EK/R2
Deleted rows from Figure 7, Receiver Decision Logic
Corrected several parameter adjustments
Numerous minor label and limit changes to Electrical Characteristics
Text corresponding to the changes in the Electrical Characteristics were also made.
Changed line to read: In addition, the device monitors the current limit on each channel
to see if the channel is in “double current limit” during every idle state. In the OVERCURRENT Protection
33781
Analog Integrated Circuit Device Data
Freescale Semiconductor
43
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
[email protected]
Asia/Pacific:
Freescale Semiconductor China Ltd.
Exchange Building 23F
No. 118 Jianguo Road
Chaoyang District
Beijing 100022
China
+86 10 5879 8000
[email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or +1-303-675-2140
Fax: +1-303-675-2150
[email protected]
Information in this document is provided solely to enable system and
software implementers to use Freescale Semiconductor products. There are
no express or implied copyright licenses granted hereunder to design or
fabricate any integrated circuits or integrated circuits based on the
information in this document.
Freescale Semiconductor reserves the right to make changes without further
notice to any products herein. Freescale Semiconductor makes no warranty,
representation or guarantee regarding the suitability of its products for any
particular purpose, nor does Freescale Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or
incidental damages. “Typical” parameters that may be provided in Freescale
Semiconductor data sheets and/or specifications can and do vary in different
applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer
application by customer’s technical experts. Freescale Semiconductor does
not convey any license under its patent rights nor the rights of others.
Freescale Semiconductor products are not designed, intended, or authorized
for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other
application in which the failure of the Freescale Semiconductor product could
create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold Freescale
Semiconductor and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and
reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized
use, even if such claim alleges that Freescale Semiconductor was negligent
regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of
Freescale Semiconductor, Inc. All other product or service names
are the property of their respective owners.
© Freescale Semiconductor, Inc. 2009. All rights reserved.
MC33781
Rev. 5.0
11/2009