Freescale Semiconductor Technical Data MPXV5004G Rev 7, 05/2005 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV5004G SERIES The MPXV5004G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. INTEGRATED PRESSURE SENSOR 0 TO 3.92 kPA (0 TO 400 mm H2O) 1.0 TO 4.9 V OUTPUT Features • Temperature Compensated over 10° to 60°C • Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations • Durable Thermoplastic (PPS) Package SMALL OUTLINE PACKAGES THROUGH-HOLE J Typical Applications • • Washing Machine Water Level Ideally Suited for Microprocessor or Microcontroller-Based Systems ORDERING INFORMATION(1) Device Type ThroughHole Surface Mount MPXV5004G7U CASE 482B-03 MPXV5004GC7U CASE 482C-03 Case No. MPXV Series Order No. Packing Options Device Marking 482B MPXV5004G7U Rails MPXV5004G 482C MPXV5004GC7U Rails MPXV5004G 1 N/C 5 N/C 482 MPXV5004G6U Rails MPXV5004G 2 VS 6 N/C 482 MPXV5004G6T1 Tape & Reel MPXV5004G 482A MPXV5004GC6U Rails MPXV5004G 3 GND 7 N/C 482A MPXV5004GC6T1 Tape & Reel MPXV5004G 4 VOUT 8 N/C 1351 MPXV5004DP Trays MPXV5004G 1368 MPXV5004GVP Trays MPXV5004G 1369 MPXV5004GP Trays MPXV5004G PIN NUMBERS(1) 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. 1. MPXV5004G series pressure sensors are available in the basic element package or with a pressure port. Two packing options are offered for the surface mount configuration. SMALL OUTLINE PACKAGES SURFACE MOUNT MPXV5004G6U CASE 482-01 MPXV5004GC6U CASE 482A-01 MPXV5004DP CASE 1351-01 © Freescale Semiconductor, Inc., 2005. All rights reserved. MPXV5004GVP CASE 1368-01 MPXV5004GP CASE 1369-01 VS Gain Stage #2 and Ground Reference Shift Circuitry Thin Film Temperature Compensation and Calibration Circuitry Sensing Element GND VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device. Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings (1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 16 kPa Storage Temperature TSTG –30 to +100 °C TA 0 to +65 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units Pressure Range POP 0 — 3.92 400 kPa mm H2O Supply Voltage(1) VS 4.75 5.0 5.25 VDC IS — — 10 mAdc Supply Current Span at 306 mm H2O (3 kPa) (2) VFSS — 3.0 — V Offset(3) (4) VOFF 0.75 1.0 1.25 mV Sensitivity V/P — 1.0 9.8 — V/kPa mV/mm H2O Accuracy(5) — — — ±1.5 ±2.5 %VFSS %VFSS 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • Offset Stability: Output deviation, after 1000 temperature cycles, *30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. • TcSpan: Output deviation over the temperature range of 10 to 60°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between autozero and measurement. MPXV5004G 2 Sensors Freescale Semiconductor ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV5004G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available Fluorosilicone Gel Die Coat from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MPXV5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure 3 The output will saturate outside of the specified pressure range. Stainless Steel Cap Die P1 Thermoplastic Case Wire Bond Lead Frame P2 Die Bond Differential Sensing Element Figure 2. Cross-Sectional Diagram (Not to Scale) 5.0 +5 V Vout OUTPUT 4.0 IPS 1.0 µF 0.01 µF GND 470 pF Output (V) Vs TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 1.5% VFSS VS = 5.0 V ± 0.25 Vdc TEMP = 10 to 60°C 3.0 Typical Max 2.0 Min 1.0 2 kPa 200 mm H2O Figure 3. Recommended Power Supply Decoupling and Output Filtering. (For additional output filtering, please refer to Application Note AN1646.) 4 kPa 400 mm H2O Figure 4. Output versus Pressure Differential (See Note 5 in Operating Characteristics) MPXV5004G Sensors Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Part Number Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below. Case Type MPXV5004GC6U/T1 Side with Port Attached 482A MPXV5004G6U/T1 Pressure (P1) Side Identifier Stainless Steel Cap 482 MPXV5004GC7U 482C Side with Port Attached MPXV5004G7U 482B Stainless Steel Cap MPXV5004GP 1369 Side with Port Attached MPXV5004DP 1351 Side with Port Marking MPXV5004GVP 1368 Stainless Steel Cap INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPXV5004G 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS -ANOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 -BG 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C -T- SEATING PLANE DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.210 0.220 5.33 5.59 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0˚ 15˚ 0˚ 15˚ 0.405 0.415 10.29 10.54 0.540 0.560 13.72 14.22 K M J DETAIL X CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. -A4 5 N -BG 0.25 (0.010) 8 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C -T- INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15˚ 0˚ 15˚ 0˚ 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115 SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE MPXV5004G 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.006 (0.15) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) θ L D A1 DETAIL G 8 1 b 0.004 (0.1) 8X F M C A B E1 B N GND +Vout Vs -Vout N/C N/C N/C N/C STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. ∅T M A P STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 8X 0.004 (0.1) K DETAIL G C SEATING PLANE N/C Vs GND Vout N/C N/C N/C N/C NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T θ INCHES MILLIMETERS MIN MAX MIN MAX 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0˚ 7˚ 0˚ 7˚ CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.006 (0.15) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) θ L D A1 DETAIL G 8 1 8X b F 0.004 (0.1) M E1 B N C A B STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. GND +Vout Vs -Vout N/C N/C N/C N/C STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. N/C Vs GND Vout N/C N/C N/C N/C ∅R ∅T K A 8X P 0.004 (0.1) M DETAIL G C SEATING PLANE NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T R θ INCHES MILLIMETERS MAX MAX MIN MIN 7.62 0.300 7.11 0.280 0.25 0.05 0.002 0.010 1.07 0.96 0.038 0.042 12.32 11.81 0.465 0.485 0.690 BSC 17.52 BSC 11.81 12.32 0.485 0.465 0.100 BSC 2.54 BSC 6.10 6.60 0.260 0.240 3.43 2.92 0.135 0.115 1.52 1.02 0.040 0.060 2.41 1.90 0.055 0.035 1.39 0.095 0.89 0.075 0.28 0.011 0.23 0.009 3.30 2.79 0.110 0.130 10.54 10.28 0.405 0.415 7˚ 0˚ 0˚ 7˚ CASE 1368-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) θ L D A1 DETAIL G 8 1 b 0.004 (0.1) NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. 8X F M E1 B N ∅T K A P C A B 8X M 0.004 (0.1) DETAIL G C SEATING PLANE DIM A A1 b D E E1 e F K L M N P T θ INCHES MILLIMETERS MIN MAX MIN MAX 0.300 0.330 7.11 7.62 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.245 0.255 6.22 6.47 0.120 0.130 3.05 3.30 0.061 0.071 1.55 1.80 0.270 0.290 6.86 7.36 0.080 0.090 2.03 2.28 0.009 0.011 0.23 0.28 0.115 0.125 2.92 3.17 0˚ 7˚ 0˚ 7˚ CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 9 NOTES MPXV5004G 10 Sensors Freescale Semiconductor NOTES MPXV5004G Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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