FREESCALE MPXAZ6115AC6U

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Pressure
Freescale Semiconductor
MPXA6115A
Rev 5, 10/2009
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXxx6115A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of onchip integration make the pressure sensor a logical and economical choice
for the system designer.
The MPXxx6115A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
MPXA6115A
MPXH6115A
MPXHZ6115A
Series
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 V Output
Application Examples
• Aviation Altimeters
• Industrial Controls
• Engine Control/Manifold Absolute
Pressure (MAP)
• Weather Station and Weather
Reporting Device Barometers
Features
•
•
•
•
•
•
•
Resistant to High Humidity and Common Automotive Media
Improved Accuracy at High Temperature
Available in Small and Super Small Outline Packages
1.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated from -40° to +125°C
Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
Case
Device Name
No.
None
Small Outline Package (MPXA6115A Series)
# of Ports
Single
Pressure Type
Differential
Absolute
Device
Marking
MPXA6115A6U
482
•
MPXA6115A6T1
482
•
MPXA6115AC6U
482A
•
MPXA6115AC6T1
482A
•
MPXA6115AC7U
482C
•
Small Outline Package (Media Gel Resistant) (MPXAZ6115A Series)
•
•
•
•
•
MPXA6115A
MPXA6115A
MPXA6115A
MPXA6115A
MPXA6115A
MPXAZ6115A6U
482
•
MPXAZ6115AC6U
482A
MPXAZ6115AC6T1
482A
MPXAZ6115AP
1369
MPXAZ6115APT1
1369
Super Small Outline Package (MPXH6115A Series)
•
•
•
•
•
•
•
•
•
MPXAZ6115A
MPXAZ6115A
MPXAZ6115A
MPXAZ6115A
MPXAZ6115A
•
•
•
•
•
•
MPXH6115A
MPXH6115A
MPXH6115A
MPXH6115A
MPXH6115A6U
MPXH6115A6T1
MPXH6115AC6U
MPXH6115AC6T1
1317
1317
1317A
1317A
Dual
•
•
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
Gauge
Pressure
ORDERING INFORMATION
Small Outline Package (Media Gel Resistant) (MPXHZ6115A Series)
MPXHZ6115A6U
MPXHZ6115A6T1
MPXHZ6115AC6U
MPXHZ6115AC6T1
1317
1317
1317A
1317A
•
•
•
•
•
•
•
•
MPXHZ6115A
MPXHZ6115A
MPXHZ6115A
MPXHZ6115A
SMALL OUTLINE PACKAGES
MPXA6115A6U/T1
MPXAZ6115A6U
CASE 482-01
MPXA6115AC6U/T1
MPXAZ6115AC6U/T1
CASE 482A-01
MPXA6115AC7U
CASE 482C-03
MPXAZ6115AP/T1
CASE 1369-01
SUPER SMALL OUTLINE PACKAGES
MPXH6115A6U/T1
MPXHZ6115A6U/T1
CASE 1317-04
MPXH6115AC6U/T1
MPXHZ6115AC6U/T1
CASE 1317A-04
MPXA6115A
2
Sensors
Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
15
—
115
kPa
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
—
6.0
10
mAdc
Minimum Pressure Offset(2)
@ VS = 5.0 Volts
(0 to 85°C)
Voff
0.133
0.200
0.268
Vdc
Full Scale Output(3)
@ VS = 5.0 Volts
(0 to 85°C)
VFSO
4.633
4.700
4.768
Vdc
Full Scale Span(4)
@ VS = 5.0 Volts
(0 to 85°C)
VFSS
4.433
4.500
4.568
Vdc
Accuracy(5)
(0 to 85°C)
—
—
—
±1.5
%VFSS
Sensitivity
V/P
—
45.9
—
mV/kPa
(6)
Response Time
tR
—
1.0
—
ms
Warm-Up Time(7)
—
—
20
—
ms
Offset Stability(8)
—
—
±0.25
—
%VFSS
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXA6115A
Sensors
Freescale Semiconductor
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Units
Maximum Pressure (P1 > P2)
Pmax
400
kPa
Storage Temperature
Tstg
-40° to +125°
°C
Operating Temperature
TA
-40° to +125°
°C
Output Source Current @ Full Scale Output(2)
Io +
0.5
mAdc
Output Sink Current @ Minimum Pressure Offset(2)
Io -
-0.5
mAdc
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
3
GND
Gain Stage #2
and Ground
Reference
Shift
Circuitry
4
VOUT
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXA6115A
4
Sensors
Freescale Semiconductor
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0° to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXxx6115A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluorosilicone
Gel Die Coat
Stainless
Steel Cap
Die
P1
Wire Bond
Thermoplastic
Case
Lead
Frame
Die Bond
Absolute Element
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale)
+5.0 V
VS Pin 2
100 nF
MPXxx6115A
to ADC
Vout Pin 4
47 pF
GND Pin 3
51 K
Figure 3. Typical Application Circuit
(Output Source Current Operation)
5.0
4.5
4.0
Output (Volts)
3.5
Transfer Function:
Vout = Vs* (.009*P-.095) ± Error
VS = 5.0 Vdc
TEMP = 0 to 85ºC
MAX
TYP
3.0
2.5
2.0
1.5
1.0
MIN
0.5
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output vs. Absolute Pressure
MPXA6115A
Sensors
Freescale Semiconductor
5
Pressure
Transfer Function (MPXxx6115A)
Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.0 ± 0.25 Vdc
Temperature Error Band
MPXxxA6115A SERIES
4.0
Break Points
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
- 40
0 to 85
125
3
1
1.75
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in Cº
NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
0.0
20
40
60
80
100
120
Pressure (in kPa)
-1.0
-2.0
Pressure
15 to 115 (kPa)
Error (Max)
±1.5 (kPa)
-3.0
MPXA6115A
6
Sensors
Freescale Semiconductor
Pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.100 TYP
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
mm
0.100 TYP 8X
2.54
Figure 5. SOP Footprint (Case 482)
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 6. SSOP Footprint (Case 1317 and 1317A)
MPXA6115A
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
M
T B
A
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
N
H
C
J
-TSEATING
PLANE
PIN 1 IDENTIFIER
K
M
DIM
A
B
C
D
G
H
J
K
M
N
S
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
10.29
10.54
18.01
18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXA6115A
8
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–A–
4
5
N –B–
G
0.25 (0.010)
8
1
M
T B
D 8 PL
S A
S
DIM
A
B
C
D
G
J
K
M
N
S
V
W
DETAIL X
S
W
V
PIN 1
IDENTIFIER
C
–T–
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.026
0.034
0.100 BSC
0.009
0.011
0.100
0.120
0_
15 _
0.444
0.448
0.540
0.560
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.66
0.864
2.54 BSC
0.23
0.28
2.54
3.05
0_
15 _
11.28
11.38
13.72
14.22
6.22
6.48
2.92
3.17
SEATING
PLANE
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPXA6115A
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXA6115A
10
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXA6115A
Sensors
Freescale Semiconductor
11
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPXA6115A
12
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPXA6115A
Sensors
Freescale Semiconductor
13
Pressure
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPXA6115A
14
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXA6115A
Sensors
Freescale Semiconductor
15
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXA6115A
16
Sensors
Freescale Semiconductor
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MPXA6115A
Rev. 5
11/2009
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