FSA8108 Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys Features Detection Description Audio Plug Connection Volume Up/Down Key Press Send/End Key Press VDD 2.7 to 4.5V VIO 1.6V to VDD THD (MIC) 0.01% Typical LDO Output for MIC Bias Voltage 2.4V ESD (IEC 61000-4-2) 15kV Operating Temperature Package -40°C to 85°C 12-Ball WLCSP Top Mark Ordering Information G6 FSA8108BUCX Detects 3- or 4-Pole Audio Accessories Removes Audio Jack Pop-and-Click Caused by MIC Bias Detects Key Press: Volume Up/Down, Send/End Stuck Send/End Key Recovery LDO Output for MIC Bias Voltage Related Resources For samples and questions, please contact: [email protected]. Applications The FSA8108 is an audio jack detection switch for 3- or 4pole accessories that detects the audio plug connection. The detection circuit monitors the microphone bias voltage to detect a volume up/down or send/end key press. For system flexibility, the FSA8108 features an I2C port with registers to allow programmability of AC timing specifications. Cellular Phones, Smart Phones MP3 and PMP (Portable Media Player) Figure 1. © 2011 Fairchild Semiconductor Corporation FSA8108 • Rev. 1.0.0 Typical Application Diagram www.fairchildsemi.com FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys August 2012 0.03 C E 2X F A 0.80 B 1.20 PIN 1 AREA (Ø0.200) Cu Pad (Ø0.300) Solder Mask 0.40 D 0.40 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.378±0.018 0.208±0.021 0.625 0.547 0.05 C C SEATING PLANE D SIDE VIEWS 0.005 0.80 0.40 1.20 A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. D C B A 0.40 NOTES: C A B Ø0.260±0.02 12X C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. (Y)±0.018 F D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. 1 2 3 (X)±0.018 E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS ±39 MICRONS (547-625 MICRONS). BOTTOM VIEW F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILENAME: MKT-UC012ACrev1. Figure 14. 12-Ball, 3x4 Array, 0.4mm Pitch, 250µm Ball, Wafer-Level Chip-Scale Package (WLCSP) Nominal Values Bump Pitch Overall Package Height Silicon Thickness Solder Bump Height Solder Bump Diameter 0.4mm 0.586mm 0.378mm 0.208mm 0.260mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Ordering Information Part Number FSA8108BUCX Operating Temperature Range Top Mark Package -40 to +85°C G6 12-Ball, 3x4 Array, 0.4mm Pitch, 250µm Ball, Wafer-Level Chip-Scale Package © 2011 Fairchild Semiconductor Corporation FSA8108 • Rev. 1.0.0 D E X Y 1.56mm 1.16mm 0.18mm 0.18mm www.fairchildsemi.com 20 FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys Physical Dimensions FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys 21 www.fairchildsemi.com © 2011 Fairchild Semiconductor Corporation FSA8108 • Rev. 1.0.0 FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys 22 www.fairchildsemi.com © 2011 Fairchild Semiconductor Corporation FSA8108 • Rev. 1.0.0 FSA8108 — Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys 23 www.fairchildsemi.com © 2011 Fairchild Semiconductor Corporation FSA8108 • Rev. 1.0.0