NC7WZ16 TinyLogic® UHS Dual Buffer Features Description Ultra-High Speed: tPD 2.4ns (Typical) into 50pF at 5V VCC High Output Drive: ±24mA at 3V VCC Power Down High-Impedance Inputs/Outputs The NC7WZ16 is a dual buffer from Fairchild’s Ultra® High Speed Series of TinyLogic . The device is fabricated with advanced CMOS technology to achieve ultra-high speed with high output drive while maintaining low static power dissipation over a very broad VCC operating range. The device is specified to operate over the 1.65V to 5.5V VCC range. The inputs and outputs are high impedance when VCC is 0V. Inputs tolerate voltages up to 7V independent of VCC operating voltage. Proprietary Noise/EMI Reduction Circuitry Broad VCC Operating Range: 1.65V to 5.5V Matches Performance of LCX when Operated at 3.3V VCC Over-Voltage Tolerance Inputs Facilitate 5V to 3V Translation Ultra-Small MicroPak™ Packages Space-Saving SC70 Package Ordering Information Part Number Top Mark Package Packing Method NC7WZ16P6X Z16 6-Lead SC70, EIAJ SC-88a, 1.25mm Wide 3000 Units on Tape & Reel NC7WZ16L6X C7 6-Lead MicroPak™, 1.00mm Wide 5000 Units on Tape & Reel NC7WZ16FHX C7 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch 5000 Units on Tape & Reel © 1999 Fairchild Semiconductor Corporation NC7WZ16 • Rev. 1.0.4 www.fairchildsemi.com NC7WZ16 — TinyLogic® UHS Dual Buffer December 2010 NC7WZ16 — TinyLogic® UHS Dual Buffer Connection Diagrams IEEC/IEC Figure 1. Logic Symbol Pin Configurations Figure 2. SC70 (Top View) Figure 3. MicroPak™ (Top Through View) Notes: 1. AAA represents Product Code Top Mark (see ordering code). 2. Orientation of Top Mark determines Pin One location. Read the top product code mark left to right. Pin One is the lower left pin. Figure 4. Pin 1 Orientation Pin Definitions Pin # SC70 Pin # MicroPak™ Name Description 1 1 A1 2 2 GND 3 3 A2 Input 4 4 Y2 Output 5 5 VCC 6 6 Y1 Input Ground Supply Voltage Output Function Table Y= A Inputs Output A Y L L H H H = HIGH Logic Level L = LOW Logic Level © 1999 Fairchild Semiconductor Corporation NC7WZ16 • Rev. 1.0.4 www.fairchildsemi.com 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol VCC VIN VOUT IIK Parameter Min. Max. Unit Supply Voltage -0.5 7.0 V DC Input Voltage -0.5 7.0 V DC Output Voltage -0.5 7.0 V -50 mA DC Input Diode Current VIN < 0V IOK DC Output Diode Current VOUT < 0V -50 mA IOUT DC Output Source / Sink Current ±50 mA DC VCC or Ground Current ±100 mA +150 °C ICC or IGND TSTG Storage Temperature Range -65 TJ Junction Temperature Under Bias +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) +260 °C SC70-6 PD ESD Power Dissipation NC7WZ16 — TinyLogic® UHS Dual Buffer Absolute Maximum Ratings 180 MicroPak™-6 130 MicroPak2™-6 120 Human Body Model, JEDEC:JESD22-A114 4000 Charge Device Model, JEDEC:JESD22-C101 2000 mW V Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol VCC VIN VOUT tr,tf TA Parameter Conditions Min. Max. Supply Voltage Operating 1.65 5.50 Supply Voltage Data Retention 1.50 5.50 V Input Voltage 0 5.5 V Output Voltage 0 VCC V VCC=1.8V, 2.5V ±0.2V 0 20 VCC=3.3V ±0.3V 0 10 VCC=5.5V ±0.5V 0 5 -40 +125 Input Rise and Fall Times Operating Temperature SC70-6 θJA Unit Thermal Resistance ns/V °C 425 MicroPak™-6 500 MicroPak2™-6 560 °C/W Note: 3. Unused inputs must be held HIGH or LOW. They may not float. © 1999 Fairchild Semiconductor Corporation NC7WZ16 • Rev. 1.0.4 www.fairchildsemi.com 3 Symbol Parameter VCC (V) TA=25°C Conditions Min. Typ. TA=-40 to +85°C Max. Min. VIH HIGH Level Control Input Voltage 1.65 to 1.95 0.75VCC 0.75VCC 2.3 to 5.5 0.70VCC 0.70 VCC VIL LOW Level Control Input Voltage 1.65 to 1.95 0.25VCC 0.25VCC 2.3 to 5.5 0.30VCC 0.30VCC 1.65 1.55 1.65 1.55 1.80 1.70 1.80 1.70 2.20 2.30 2.20 2.90 3.00 2.90 IOH=-100µA 2.30 3.00 VOH HIGH Level Output Voltage 4.50 4.40 4.50 4.40 IOH=-4mA 1.29 1.52 1.21 2.30 IOH=-8mA 1.90 2.14 1.90 3.00 IOH=-16mA 2.40 2.75 2.40 3.00 IOH=-24mA 2.30 2.62 2.30 4.50 IOH=-32mA 3.80 4.13 1.65 VIN=VIH 1.65 IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current © 1999 Fairchild Semiconductor Corporation NC7WZ16 • Rev. 1.0.4 V V 3.80 0.10 0.10 0.00 0.10 0.10 0.00 0.10 0.10 3.00 0.00 0.10 0.10 4.50 0.00 0.10 0.10 IOL=4mA 0.08 0.24 0.24 2.30 IOL=8mA 0.10 0.30 0.30 3.00 IOL=16mA 0.16 0.40 0.40 3.00 IOL=24mA 0.24 0.55 0.55 4.50 IOL=32mA 0.25 0.55 0.55 0 ≥ VIN ≥ 5.5V ±0.1 ±1.0 µA VIN or VOUT=5.5V 1.0 10 µA VIN=5.5V, GND 1.0 10 µA IOL=100µA 2.30 LOW Level Output Voltage V 0.00 1.80 VOL Units Max. 1.65 0 to 5.5 0 1.65 to 5.50 VIN=VIL NC7WZ16 — TinyLogic® UHS Dual Buffer DC Electrical Characteristics V www.fairchildsemi.com 4 Symbol Parameter VCC (V) Min. 1.65 Typ. Max. Min. Max. 5.5 9.6 1.8 10.6 1.8 4.6 8.0 1.8 8.8 1.0 3.0 5.2 1.0 5.8 3.30 ± 0.30 0.8 2.3 3.6 0.8 4.0 5.00 ± 0.50 0.5 1.8 2.9 0.5 3.2 1.2 3.0 4.6 1.2 5.1 0.8 2.4 3.8 0.8 4.2 1.80 Propagation Delay TA=-40 to +85°C 1.8 2.50 ± 0.20 tPLH, tPHL TA=25°C Conditions 3.30 ± 0.30 5.00 ± 0.50 CL=15pF, RL=1MΩ CL=50pF, RL=500Ω CIN Input Capacitance 0.00 2.5 CPD Power Dissipation Capacitance(4) 3.30 10 5.00 12 Units Figure Figure 5 Figure 6 ns Figure 5 Figure 6 pF pF Figure 7 Note: 4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic). NC7WZ16 — TinyLogic® UHS Dual Buffer AC Electrical Characteristics Note: 5. CL includes load and stray capacitance; Input PRR=1.0MHz; tW =500ns Figure 5. AC Test Circuit Figure 6. AC Waveforms Note: 6. Input=AC Waveform; tr=tf=1.8ns; PRR=10 MHz Duty Cycle=50%. Figure 7. ICCD Test Circuit © 1999 Fairchild Semiconductor Corporation NC7WZ16 • Rev. 1.0.4 www.fairchildsemi.com 5 NC7WZ16 — TinyLogic® UHS Dual Buffer Physical Dimensions SYMM CL 2.00±0.20 0.65 A 0.50 MIN 6 4 B PIN ONE 1.25±0.10 1 1.90 3 0.30 0.15 (0.25) 0.40 MIN 0.10 0.65 A B 1.30 LAND PATTERN RECOMMENDATION 1.30 1.00 0.80 SEE DETAIL A 1.10 0.80 0.10 C 0.10 0.00 C 2.10±0.30 SEATING PLANE NOTES: UNLESS OTHERWISE SPECIFIED GAGE PLANE (R0.10) 0.25 0.10 0.20 A) THIS PACKAGE CONFORMS TO EIAJ SC-88, 1996. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. D) DRAWING FILENAME: MKT-MAA06AREV6 30° 0° 0.46 0.26 DETAIL A SCALE: 60X Figure 8. 6-Lead, SC70, EIAJ SC-88a, 1.25mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-6_tr.pdf. Package Designator P6X © 1999 Fairchild Semiconductor Corporation NC7WZ16 • Rev. 1.0.4 Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 6 NC7WZ16 — TinyLogic® UHS Dual Buffer Physical Dimensions 2X 0.05 C 1.45 B 2X (1) 0.05 C (0.254) (0.49) 5X 1.00 (0.75) PIN 1 IDENTIFIER 5 (0.52) 1X A TOP VIEW 0.55MAX (0.30) 6X PIN 1 0.05 C 0.05 0.00 RECOMMENED LAND PATTERN 0.05 C C 0.25 0.15 6X 1.0 DETAIL A 0.10 0.05 0.45 0.35 0.10 0.00 6X C B A C 0.40 0.30 0.35 5X 0.25 0.40 5X 0.30 0.5 (0.05) 6X DETAIL A PIN 1 TERMINAL 0.075 X 45 CHAMFER (0.13) 4X BOTTOM VIEW Notes: 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M-1994 4. FILENAME AND REVISION: MAC06AREV4 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. Figure 9. 6-Lead, MicroPak™, 1.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator L6X © 1999 Fairchild Semiconductor Corporation NC7WZ16 • Rev. 1.0.4 Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 7 NC7WZ16 — TinyLogic® UHS Dual Buffer Physical Dimensions 0.89 0.35 0.05 C 1.00 2X B A 5X 0.40 PIN 1 MIN 250uM 0.66 1.00 1X 0.45 6X 0.19 0.05 C TOP VIEW RECOMMENDED LAND PATTERN FOR SPACE CONSTRAINED PCB 2X 0.90 0.05 C 0.35 0.55MAX C 5X 0.52 SIDE VIEW 0.73 (0.08) 4X 1 DETAIL A 2 1X 0.57 0.09 0.19 6X 3 0.20 6X ALTERNATIVE LAND PATTERN FOR UNIVERSAL APPLICATION (0.05) 6X 5X 0.35 0.25 6 5 4 0.35 0.60 (0.08) 4X 0.10 .05 C C B A 0.40 0.30 BOTTOM VIEW NOTES: A. COMPLIES TO JEDEC MO-252 STANDARD B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 D. LANDPATTERN RECOMMENDATION IS BASED ON FSC DESIGN. E. DRAWING FILENAME AND REVISION: MGF06AREV3 Figure 10. 0.075X45° CHAMFER DETAIL A PIN 1 LEAD SCALE: 2X 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf. Package Designator FHX © 1999 Fairchild Semiconductor Corporation NC7WZ16 • Rev. 1.0.4 Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 8 NC7WZ16 — TinyLogic® UHS Dual Buffer © 1999 Fairchild Semiconductor Corporation NC7WZ16 • Rev. 1.0.4 www.fairchildsemi.com 9