FAIRCHILD FSSD06_12

FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Features
Description
 On Resistance Typically 4Ω, VDDH=2.7V
 ftoggle: > 120MHz
 Low On Capacitance: 9pF Typical
 Low Power Consumption: 1µA Maximum
 Conforms to Secure Digital (SD), Secure Digital I/O
The FSSD06 is a two-port multiplexer that allows Secure
Digital (SD), Secure Digital I/O (SDIO), and Multimedia
Card (MMC) host controllers to be expanded out to
multiple cards or peripherals. This configuration enables
the CMD, CLK, and D[3:0] signals to be multiplexed to
dual-card peripherals. It is optimized for 1-bit / 4-bit SD /
MMC applications.
(SDIO), and Multimedia Card (MMC) Specifications
 Supports 1-Bit / 4-Bit Host Controllers (VDDH=1.65V to
3.6V) Communicating with High-Voltage (2.7-3.6V)
and Dual-Voltage Cards (1.65-1.95V, 2.7-3.6V)
-
VDDH=1.65 to 3.6V, VDDC1/C2=VDDH to 3.6V
The architecture includes the necessary bi-directional
data and command transfer capability for single highvoltage cards or dual-voltage supply cards. The clock
path for the FSSD06 is a uni-directional buffer with an
integrated pull-up for high-impedance mode.
Typical applications involve switching in portables and
consumer applications: cell phones, digital cameras,
home theater monitors, portable GPS units, and printers.
 24-Lead MLP (3.5 x 4.5mm) and UMLP Packages
Applications
 Cell Phone, PDA, Digital Camera, Portable GPS
 LCD Monitor, Home Theater PC/TV, All-in-One Printer
Analog Symbol Diagram
VDDC1
/OE
S
Control
VDDC2
VDDH
5
DAT[0:3], CMD
5
CLK
1DAT[0:3], 1CMD
5
V DDC1
V DD C2
RPU
RPU
2DAT[0:3], 2CMD
1CLK
2CLK
GND
Figure 1.
Analog Symbol Diagram
Ordering Information
Part Number
Operating
Temperature Range
FSSD06BQX
-40°C to +85°C
24-Lead Molded Leadless Package (MLP), JEDEC MO220, 3.5 x 4.5mm
Tape & Reel
FSSD06UMX
-40°C to +85°C
24-Lead Ultrathin Molded Leadless Package (UMLP)
Tape & Reel
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
Package Description
Packing
Method
www.fairchildsemi.com
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
March 2012
DAT[2]
3
22
VDDC1
DAT[3]
4
21
1CLK
CMD
5
20
1DAT[0]
VDDH
6
19
GND
7
CLK
1DAT[3]
1CMD
VDDC1
23
1DAT[2]
1DAT[3]
1CMD
24
/OE
1DAT[2]
1
DAT[2]
/OE
2
24
23
22
21
20
19
DAT[3]
1
18
1CLK
CMD
2
17
1DAT[0]
1DAT[1]
VDDH
3
16
1DAT[1]
18
2DAT[2]
GND
4
15
2DAT[2]
8
17
2DAT[3]
CLK
5
14
2DAT[3]
DAT[0]
9
16
2CMD
DAT[0]
6
13
2CMD
DAT[1]
10
15
VDDC2
2DAT[0]
2CLK
Figure 3.
9
10
11
12
VDDC2
2DAT[1]
MLP Pin Assignments
8
2CLK
S
Figure 2.
7
2DAT[0]
14
2DAT[1]
13
S
12
DAT[1]
11
UMLP Pin Assignments
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Pin Configuration
Pin Definitions
Name
Description
VDDH
Power Supply (Host ASIC)
VDDC1, VDDC2
Power Supply (SDIO Peripheral Card Ports)
/OE
Output Enable (Active Low)
S
Select Pin
1DAT[3:0], 2DAT[3:0], 1CMD, 2CMD
SDIO Card Ports
DAT[3:0], CMD
SDIO Common Ports
CLK, 1CLK, 2CLK
Clock Path Ports
Truth Table
/OE
S
Function
LOW
LOW
CMD, CLK, DAT[3:0] connected to 1CMD, 1CLK, 1DAT[3:0]; 2CLK pulled HIGH via RPU
LOW
HIGH
CMD, CLK, DAT[3:0] connected to 2CMD, 2CLK, 2DAT[3:0]; 1CLK pulled HIGH via RPU
HIGH
X
All Ports High Impedance; 1CLK, 2CLK pulled HIGH via RPU
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
2
VDDH
1.65 – 3.60V
VDDC1
FSSD06
VDD H to 3.6V
RT
GND
CMD, DAT[3:0]
1CMD, 1DAT[3:0]
5
5
Processor
1CLK
Secure Data /
Multimedia Card
2:1 Peripheral
Expander
CLK
WiFi,
Bluetooth,
MMC or SD
Module
VDDC2
VDD H to 3.6V
RT
Note: External resistors (R T) are
recommended if card supplies are
allowed to float in the application.
The resistors should be >500K to
minimize power consumption.
GND
2CMD, 2DAT[3:0]
5
2CLK
/OE
S
GND
Figure 4.
WiFi,,
Bluetooth,
MMC or SD
Module
Typical Application Diagram
Functional Description
The FSSD06 enables sharing the ASIC/baseband
processor SDIO port(s) to two peripheral cards,
providing bi-directional support for dual-voltage
SD/SDIO or MMC cards available in the marketplace.
Each SDIO port of the FSSD06 has its own supply rail,
allowing peripheral cards with different supplies to be
interfaced to the host. The peripheral card supplies must
be equal or greater than the host to minimize power
consumption. The independent VDDH, VDDC1, and VDDC2
are defined by the supplies connected from the
application Power Management ICs (PMICs) to the
FSSD06. The clock path is a uni-directional buffered
path rather than a bi-directional switch port.
CLK Bus
The 1CLK and 2CLK outputs are bi-state buffer
architectures, rather than a switch I/O, to ensure 52MHz
incident wave switching. When there is no
communication on the bus (IDLE), the FSSD06 can be
disabled with the /OE pin. When this pin is pulled HIGH,
the nCLK outputs are also pulled HIGH. Along with
nCMD, nDAT[3:0] goes high-impedance to ensure that
the CLK path between the FSSD06 and the peripheral
does not float.
IDLE State CMD/DAT Bus “Parking”
The SD and MMC card specifications were written for a
direct point-to-point communication between host
controller and card. The introduction of the FSSD06 in
that path, as an expander, requires that the functional
operation and system latency not be impacted by the
FSSD06 switch characteristics. Since there are various
card formats, protocols, and configurable controllers, a
/OE pin is available to facilitate a fast IDLE transition for
the nCMD/nDAT[3:0] outputs. Some controllers, rather
than simply placing CMD/DAT into high-impedance
mode, may pull their outputs HIGH for a clock cycle prior
to going into high-impedance mode (referred to as
“parking” the output). Some legacy controllers pull their
outputs HIGH versus high impedance.
CMD, DAT Bus Pull-ups
The 1CMD, 2CMD, 1DAT[3:0], and 2DAT[3:0] ports do
not have, internally, the system pull-up resistors as
defined in the MMC or SD card system bus
specifications. The system bus pull-up must be added
external to the FSSD06. The value, within the specific
specification limits, is a function of the individual
application and type of card or peripheral connected. For
SD card applications, the RCMD and RDAT pull-ups should
be between 10kΩ and 100kΩ. For MMC applications,
the RCMD pull-ups should be between 4.7kΩ and 100kΩ
and the RDAT pull-ups between 50kΩ and 100kΩ. The
card-side 1CMD, 2CMD, 1DAT[3:0], and 2DAT[3:0]
outputs have a circuit that facilitates incident wave
switching, so the external pull-up resistors ensure
retention of the output high level.
If the /OE pin is left LOW and the controller places the
CMD/DAT[3:0] outputs into high impedance, the
nCMD/nDAT[3:0] output rise time is a function of the RC
time constant through the switch path. It is
recommended that the host controller pull CMD and
DAT[3:0] HIGH for one cycle before pulling /OE HIGH.
This facilitates parking all nCMD/nDAT[3:0] outputs
HIGH before putting the switch I/Os in high impedance.
The /OE pin can be used to place the 1CMD, 2CMD,
1DAT[3:0] and 2DAT[3:0] into high-impedance mode
when the system enters IDLE state (see IDLE State
CMD/DAT Bus “Parking”).
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Typical Application Diagram
www.fairchildsemi.com
3
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Conditions
Min.
Max.
Unit
4.6
V
4.6
V
VDDH
Supply Voltage
-0.5
VDDC1,VDDC2
Supply Voltage
-0.5
VSW
(1)
VCNTRL(1)
VCLKI(1)
VCLKO(1)
(2)
VDDx +
1DAT[3:0], 2DAT[3:0], 1CMD,
2CMD Pins
-0.5
0.3V
(4.6V maximum)
V
DAT[3:0], CMD Pins
-0.5
(2)
VDDx + 0.3V
(4.6V maximum)
V
Control Input Voltage
S, /OE
-0.5
4.6
V
CLK Input Voltage
CLK
-0.5
4.6
V
Switch I/O Voltage
CLK Output Voltage
1CLK, 2CLK
-0.5
(2)
VDDx +
0.3V
(4.6V maximum)
V
-50
mA
IINDC
Input Clamp Diode Current
ISW
Switch I/O Current
SDIO Continuous
50
mA
Peak Switch Current
SDIO Pulsed at 1ms Duration,
<10% Duty Cycle
100
mA
+150
C
+150
C
+260C
C
ISWPEAK
TSTG
Storage Temperature Range
TJ
Max Junction Temperature
TL
Lead Temperature
ESD
Human Body Model
(JEDEC: JESD22-A114)
-65
Soldering, 10 Seconds
I/O to GND
8
Supply to GND
9
All Other Pins
5
Charged Device Model (JEDEC: JESD22-C101)
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Absolute Maximum Ratings
kV
2
kV
Notes:
1. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed.
2. VDDx references the specific SDIO port VDD rail (i.e. VDDC1, VDDC2, VDDH).
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Minimum
Maximum
Unit
Supply Voltage - Host Side
1.65
3.6V
V
VDDC1, VDDC2
Supply Voltage - SDIO Cards
VDDH
3.6V
V
VCNTRL
Control Input Voltage - VS,V/OE
0
VDDH
V
VDDH
VCLKI
VSW
Parameter
Clock Input Voltage - VCLKI
0
VDDH
V
Switch I/O Voltage - CMD, DAT[3:0]
0
VDDH
V
Switch I/O Voltage - 1CMD, 1DAT[3:0]
0
VDDC1
V
0
VDDC2
V
-40
+85
°C
50
°C/W
Switch I/O Voltage - 2CMD, 2DAT[3:0]
°C
Operating Temperature
JA
Thermal Resistance (free air), MLP24
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
4
All typical values are for VDDH=1.8V at 25°C unless otherwise specified.
Symbol
Parameter
VDDC1 /
VDDC2 (V)
Conditions
TA=- 40°C to +85°C
Min.
Typ.
Max.
Unit
Common Pins
VIK
Clamp Diode Voltage
2.7
IIK=-18mA
VIH
Control Input Voltage
High
2.7
VIL
Control Input Voltage Low
2.7
IIN
S, /OE Input High Current
3.6
VDDH=1.95V, VCNTRL=0V to
VDDH
IOZ
Off Leakage, Current of
all ports
3.6
VDDH=1.95V, VSW =0V to VDDX
IPU
CLK Pull-up Current
3.6
VCLKI=VDDH VCLKO=0V,
/OE=VDDH
VOHC
CLK Output Voltage High
2.7
IOH=-2mA
VOLC
CLK Output Voltage Low
3.6
IOL=-2mA
RPU
CLK Pull-up Resistance(3)
RON
Switch On Resistance(4)
2.7
VCMD, DAT[3:0]=0V, ION=-2mA,
See Figure 5
4
∆RON
Delta On Resistance(4, 5)
2.7
VCMD, DAT[3:0]=0V, ION=- 2mA
0.8
VDDH=1.65V
-1.2
1.3
V
0.5
-1
-1.0
0.5
1
µA
1.0
µA
35
µA
V
2.4
90
50
100
mV
kΩ
6
Ω
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
DC Electrical Characteristics at 1.8V VDDH
Ω
Power Supply
ICC(VDDH)
ICC(VDDC1,
VDDC2)
∆ICARD
VDDH=1.95V, VSW=0 or VDDH,
IOUT=0
1
µA
3.6
VSW=0 or VDDx, IOUT=0,
VCLKI=VDDH, VCLKO=Open,
/OE=0V
1
µA
3.6V
/ 0V
VSW=0 or VDDx, IOUT=0,
VCLKI=VDDH, VCLKO=Open,
/OE=0V
1
µA
Quiescent Supply Current
(Host)
0
Quiescent Supply Current
(SDIO Cards)
Delta ICC(VDDC1, VDDC2) for
One Card Powered Off
Notes:
3. Guaranteed by characterization, not production tested.
4. On resistance is determined by the voltage drop between the switch I/O pins at the indicated current through the switch.
5. ∆ RON=RON max – RON min measured at identical VCC, temperature, and voltage.
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
5
All typical values are for VDDH=2.7V at 25°C unless otherwise specified.
Symbol
Parameter
VDDC1 /
VDDC2 (V)
Conditions
TA=- 40°C to +85°C
Min.
Typ.
Max.
Unit
Common Pins
VIK
Clamp Diode Voltage
2.7
VIH
Control Input Voltage
High
2.7
VIL
Control Input Voltage Low
2.7
IIN
S, /OE Input High Current
3.6
IOZ
Off Leakage Current of all
ports
3.6
IPU
CLK Pull-up Current
IIK=-18mA
VDDH=2.7V
-1.2
1.8
V
0.8
VDDH=3.6V, VCNTRL=0V to
VDDH
VDDH=3.6V, VSW =0V to VDDX
3.6
VCLKI=VDDH, VCLKO=0V,
/OE=VDDH
-1
-1.0
0.5
1
µA
1.0
µA
50
µA
VOHC
CLK Output Voltage High
2.7
IOH=-2mA
V
VOLC
CLK Output Voltage Low
3.6
IOL=-2mA
RPU
CLK Pull-up Resistance(6)
RON
Switch On Resistance(7)
2.7
VCMD, DAT[3:0]=0V, ION=-2mA
See Figure 5
2.5
∆RON
Delta On Resistance(7,8)
2.7
VCMD, DAT[3:0]=0V, ION=- 2mA
0.8
Quiescent Supply Current
(Host)
0
VDDH=3.6V, VSW=0 or VDDH,
IOUT=0
1
µA
Quiescent Supply Current
(SDIO Cards)
3.6
VSW=0 or VDDx, IOUT=0,
VCLKI=VDDH , VCLKO=Open,
/OE=0V
1
µA
3.6V/0V
0V/3.6V
VSW=0 or VDDx, IOUT=0,
VCLKI=VDDH, VCLKO=Open,
/OE=0V
1
µA
2.4
90
50
100
mV
kΩ
6.0
Ω
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
DC Electrical Characteristics at 2.7V VDDH
Ω
Power Supply
ICC(VDDH)
ICC(VDDC1,
VDDC2)
∆ICARD
Delta ICC(VDDC1, VDDC2) for
One Card Powered Off
Notes:
6. Guaranteed by characterization, not production tested.
7. On resistance is determined by the voltage drop between the switch I/O pins at the indicated current through the switch.
8. ∆RON=RON max – RON min measured at identical VCC, temperature, and voltage.
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
6
All typical values are for VDDH=1.8V at 25°C unless otherwise specified.
Symbol
Parameter
VDDC1 /
VDDC2 (V)
tON1
Turn-On Time,
S, /OE to CMD, DAT[3:0]
2.7 to 3.6
tOFF1
Turn-Off Time,
S, /OE to CMD, DAT[3:0]
Switch Propagation
Delay(9)
Conditions
TA=- 40°C to +85°C
Unit
Typ.
Max.
VSW =0V, RL=1kΩ, CL=30pF
See Figure 7, Figure 8
10
24
ns
2.7 to 3.6
VSW =0V, RL=1kΩ, CL=30pF
See Figure 7, Figure 8
7
22
ns
2.7 to 3.6
See Figure 9
1
ns
Switch Skew
CMD, DAT[3:0]
2.7 to 3.6
RL=1kΩ, CL=30pF
2
ns
tON2
Turn-On Time,
S, /OE to 1CLK, 2CLK
2.7 to 3.6
VSW =0V, RL=1kΩ, CL=30pF
See Figure 7, Figure 8
17
35
ns
tOFF2
Turn-Off Time
S, /OE to 1CLK, 2CLK
2.7 to 3.6
VSW =0V, RL=1kΩ, CL=30pF
See Figure 7, Figure 8
10
28
ns
tPDCLK
Clock Propagation Delay
2.7 to 3.6
RL=1kΩ, CL=30pF
See Figure 11
3.0
5.5
ns
OIRR
Off Isolation(9)
2.7 to 3.6
f=10MHz, RT=50Ω, CL=30pF,
See Figure 12
-60
dB
Xtalk
Non-Adjacent Channel
Crosstalk(9)
2.7 to 3.6
f=10MHz, RT=50Ω, CL=30pF,
See Figure 13
-60
dB
ftoggle
Clock Frequency(9)
2.7 to 3.6
CL=30pF
120
MHz
tPD
Min.
(9, 10)
tSKEW
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
AC Electrical Characteristics at 1.8V VDDH
Notes:
9. Guaranteed by characterization, not production tested.
10. Skew is determined by |TPLH - TPHL | for worst-case temperature and VDDX.
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
7
All typical values are for VDDH=2.7V at 25°C unless otherwise specified.
Symbol
Parameter
VDDC1 /
VDDC2 (V)
Conditions
TA=- 40°C to +85°C
Min.
Typ.
Max.
Unit
tON1
Turn-On Time
S, /OE to CMD, DAT[3:0]
2.7 to 3.6
VSW =0V, RL=1kΩ, CL=30pF
See Figure 7, Figure 8
8
17
ns
tOFF1
Turn-Off Time
S, /OE to CMD, DAT[3:0]
2.7 to 3.6
VSW =0V, RL=1kΩ, CL=30pF
See Figure 7, Figure 8
6
13
ns
Switch Propagation
Delay(11)
2.7 to 3.6 See Figure 9
tPD
1
ns
1.5
ns
(12)
Switch Skew
CMD, DAT[3:0]
2.7 to 3.6 RL=1kΩ, CL=30pF
tON2
Turn-On Time
S, /OE to 1CLK, 2CLK
2.7 to 3.6
VSW =0V, RL=1kΩ, CL=30pF
See Figure 7, Figure 8
15
25
ns
tOFF2
Turn-Off Time
S, /OE to 1CLK, 2CLK
2.7 to 3.6
VSW =0V, RL=1kΩ, CL=30pF
See Figure 7, Figure 8
10
25
ns
tPDCLK
Clock Propagation Delay
2.7 to 3.6
RL=1kΩ, CL=30pF
See Figure 11
1.5
3.0
ns
OIRR
Off Isolation(11)
2.7 to 3.6
f=10MHz, RT=50Ω, CL=30pF
See Figure 12
-60
dB
Xtalk
Non-Adjacent Channel
Crosstalk(11)
2.7 to 3.6
f=10MHz, RT=50Ω, CL=30pF
See Figure 13
-60
dB
ftoggle
Clock Frequency(11)
2.7 to 3.6 CL=30pF
120
MHz
tSKEW
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
AC Electrical Characteristics at 2.7V VDDH
Notes:
11. Guaranteed by characterization, not production tested.
12. Skew is determined by |TPLH - TPHL | for worst-case temperature and VDDX.
Capacitance
Symbol
Parameter
Conditions
TA=- 40°C to +85°C
Min.
Typ.
Control and CLK Pin Input
Capacitance
VDDH=0V
2.5
CON
Common Port On Capacitance
(CDAT[3:0], CMD)
VDDH=1.8V,VDDC1=VDDC2=2.7V,
V/OE=0V, Vbias=0V, f=1MHz
See Figure 15
9.0
COFF
Input Source Off Capacitance
VDDH=1.8V,VDDC1=VDDLH2=2.7V,
V/OE=3.3V, Vbias=0V, f=1MHz
See Figure 14
4.0
CIN (S, /OE, CLK)
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
Max.
Unit
pF
www.fairchildsemi.com
8
V ON
nDAT[3:0],nCMD
I OZ
NC
DAT[3:0],CMD
A
V IN
GND
Select
RON =
Figure 5.
Select
GND
VS =
V ddl
0 orV
VS =
VON / ION
V IN
I ON
On Resistance
Figure 6.
GND
0 orV
V ddl
Off Leakage (Each Switch Port is
Tested Separately)
V DDx
tRISE = 2.5ns
DAT[3:0],
CMD
nDAT[3:0],nCMD
RL
VSW
Vddx
V OUT
CL
RS
GND
tFALL = 2.5ns
Input - VCNTRL
10%
GND
GND
90%
90%
V ddx /2
V ddx /2
10%
VOH
VS
Output - VOUT
GND
VOL
RL , RS , and CL are function of application
environment (see AC Tables for specific values)
CL includes test fixture and stray capacitance
Figure 7.
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Test Diagrams
50%
Vol + 0.15V
tON
t
OFF
AC Test Circuit Load
Figure 8.
Turn On/Off Time Waveforms
V DDx
tRISE = 2.5ns
tFALL = 2.5ns
CLK
1CLK,
2CLK
Vddx
90%
Input - VSW
10%
GND
Vddx /2
90%
V ddx/2
10%
GND
GND
Output-- VOUT
Figure 9.
V OUT
CL
RS
VOH
VOL
RL
VCLKI
tpLH
VS
50%
50%
GND
tpHL
RL , RS , and CL are function of application
environment (see AC Tables for specific values)
CL includes test fixture and stray capacitance
Switch Propagation Delay Waveform
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
Figure 10.
AC Test Circuit Load (CLK)
www.fairchildsemi.com
9
tRISE = 2.5ns
t FALL = 2.5ns
Network Analyzer
RS
Vddx
90%
Input - VCLKI
V ddx /2
10%
GND
90%
V ddx /2
10%
VS
VOHC
VOLC
tpLH
VS
GND
V OUT
GND
RT
RS and R T are function of application
environment (see AC Tables for specific values)
50%
50%
V IN
GND
GND
Output - VCLKO
Figure 11.
GND
RT
tpHL
GND
Off -Isolation = 20 Log (VOUT / VIN )
CLK Propagation Delay Waveforms
Figure 12.
Channel Off Isolation
Network Analyzer
NC
RS
V IN
GND
VS
VS
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Test Diagrams (Continued)
GND
GND
RT
GND
GND
RT
VOUT
RS and RT are function of application environment
GND
(see AC Tables for specific values)
CROSSTALK = 20 Log (VOUT / VIN )
Figure 13.
Channel-to-Channel Crosstalk
nDAT[3:0], nCMD, nCLK
Capacitance
Meter
S
Capacitance
Meter
VS =
0 orVddh
f = 1MHz, Vbias = 0V
S
VS =
0 or Vddh
f = 1MHz,Vbias = 0V
nDAT[3:0], nCMD, nCLK
nDAT[3:0], nCMD, nCLK
Figure 14.
Channel Off Capacitance
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
Figure 15.
Channel On Capacitance
www.fairchildsemi.com
10
Package
Designator
Tape Selection
Number Cavities
Cavity Status
Cover Tape
Status
Leader (Start End)
125 (Typical)
Empty
Sealed
Carrier
3000
Filled
Sealed
Trailer (Hub End)
75 (Typical)
Empty
Sealed
MPX
Tape Dimensions
Dimensions are in millimeters unless otherwise noted.
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Tape and Reel Specifications
Reel Dimensions
Dimensions are in inches (millimeters) unless otherwise noted.
Tape Size
(12.00mm)
A
B
C
D
N
W1
W2
13.000
0.059
0.512
0.795
2.165
0.488
0.724
(330.00)
(1.50)
(13.00)
(20.00)
(55.00)
(12.40)
(18.40)
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
11
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Physical Dimensions
Figure 16.
24-Lead Molded Leadless Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
12
2.80
2.23
0.66
0.10 C
A
2.50
2X
24
B
0.56
19
1
0.40
2.23
PIN #1 IDENT
3.70
3.40
13
7
0.10 C
0.23
2X
TOP VIEW
RECOMMENDED LAND PATTERN
0.55 MAX.
0.10 C
0.15
SEATING
PLANE
0.08 C
C
0.05
0.00
SIDE VIEW
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Physical Dimensions
7
23X
0.35
0.45
13
0.40
1
24
0.45
0.55
19
BOTTOM VIEW
Figure 17.
0.15
24X
0.25
0.10 C A B
0.05 C
24-Lead Ultrathin Molded Leadless Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
13
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
14