Praetorian III® 4, 6, 8-Channel EMI Filter Array with ESD Protection CM1457 Functional Description Features • Four, six, or eight channels of EMI filtering The CM1457 is an inductor-based (L-C) EMI filter array • ±15kV ESD protection (IEC 61000-4-2, contact with ESD protection, which integrates four, six, or eight discharge) at external pins filters in a CSP form factor with 0.40mm pitch. Each EMI Greater than -40dB of attenuation at 1GHz filter channel of the CM1457 is implemented with the MIL_STD_883 international ESD standard component value of 6pF-35nH–4.7pF-35nH–1.8pF. The Chip Scale Package (CSP) with 0.40mm pitch and cut-off frequency at -3dB attenuation is 300MHz and can 0.25mm CSP solder ball which features extremely be used in applications where the data rates are as high as low parasitic inductance for optimum filter and 160Mbps, while providing greater than -35dB attenuation ESD performance over the 800MHz to 2.7GHz frequency range. The parts OptiGuardTM coating for improved reliability at include ESD diodes on every I/O pin and provide a high assembly level of protection against electrostatic discharge (ESD). RoHS-compliant, lead-free finishing The ESD protection diodes connected to the external filter • • • • ports are designed and characterized to safely dissipate Applications ESD strikes of ±15kV, which is beyond the maximum requirement of the IEC61000-4-2 international standard. • LCD and camera data lines in mobile handsets • I/O port protection for mobile handsets, notebook This device is particularly well suited for wireless handsets, computers, PDAs, etc. • mobile LCD modules and PDAs because of its small EMI filtering for data ports in cell phones, PDAs or package format and easy-to-use pin assignments. In notebook computer • • • particular, the CM1457 is ideal for EMI filtering and Wireless handsets Handheld PCs/PDAs LCD and camera modules protecting data and control lines for the LCD display and camera interface in mobile handsets. The CM1457 incorporates OptiGuardTM which results in Note: Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. See http://www.wlcspforum.org/documents/pdf/ap217.pdf for download. improved reliability at assembly. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space savings vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball. Block Diagram 35nH Cn* (Externa l Pi ns) 6p F 35 nH 4 .7p F 1 .8 p F An* (Interna l Pins) GND (Pins B1 -B4) ©2010 SCILLC. All rights reserved. May 2010 – Rev. 4 Publication Order Number: CM1457/D CM1457 Pin Configurations Rev. 4 | Page 2 of 9 | www.onsemi.com CM1457 Pin Descriptions PIN NUMBER -04 -06 -08 A1 A1 A1 A2 A2 A3 A4 PIN DESCRIPTION PIN NUMBER PIN DESCRIPTION -04 -06 -08 Filter #1 (Internal) C1 C1 C1 Filter #1 (External) A2 Filter #2 (Internal) C2 C2 C2 Filter #2 (External) A3 A3 Filter #3 (Internal) C3 C3 C3 Filter #3 (External) A4 A4 Filter #4 (Internal) C4 C4 C4 Filter #4 (External) A5 A5 Filter #5 (Internal) C5 C5 Filter #5 (External) A6 A6 Filter #6 (Internal) C6 C6 Filter #6 (External) A7 Filter #7 (Internal) C7 Filter #7 (External) A8 Filter #8 (Internal) C8 Filter #8 (External) B1 B1 B1 GND B2 B2 B2 GND B3 B3 GND B4 GND Ordering Information Bumps Package Ordering Part Number1 Part Marking2 10 15 20 CSP CSP CSP CM1457-04CP CM1457-06CP CM1457-08CP N57 (w) N57 (yww) N57 (yyww) Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Note 2: (w/yww/yyww) = date code Absolute Maximum Ratings PARAMETER RATING UNITS -65 to +150 °C DC current per Inductor 15 mA DC Package Power Rating 0.5 W Storage Temperature Range Rev. 4 | Page 3 of 9 | www.onsemi.com CM1457 Standard Operating Conditions PARAMETER Operating Temperature Range RATING UNITS -40 to +85 °C Electrical Operating Characteristics (see Note 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS LTOT Total Channel Inductance 70 nH RTOT Total Channel DC Resistance 45 Ω CTOT_0V Total Channel Capacitance, 0V bias 0V dc; 1MHz, 30mV rms CTOT_2.5V Total Channel Capacitance, 2.5V bias 2.5V dc; 1MHz, 30mV rms VST Stand-off Voltage I = 10μA ILEAK Diode Leakage Current VIN = +3.3V VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA VESD fC In-system ESD Withstand Voltage a) Contact discharge per IEC 61000-4-2 standard, Level 4 (External Pins) b) Contact discharge per IEC 61000-4-2 standard, Level 4 (Internal Pins) 20 24 12.5 pF 5.5 5.6 -1.5 pF V 0.1 0.5 μA 6.8 -0.8 9.0 -0.4 V V Notes 2 and 3 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω ±15 kV ±2 kV 300 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Unused pins are left open. Rev. 4 | Page 4 of 9 | www.onsemi.com MHz CM1457 Performance Information Insertion Loss Vs. Frequency (0V Bias) 0 dB -10 dB -20 dB -30 dB -40 dB -50 dB 3 10 100 1000 FREQUENCY (MHz) Insertion Loss Vs. Frequency (2.5V Bias) Rev. 4 | Page 5 of 9 | www.onsemi.com 2000 6000 CM1457 CM1457-04CP Mechanical Specifications The 10-bump CM1457-04CP package dimensions are shown below. Package Specifications Package Custom CSP Bumps 10 Millimeters Inches Dim Min Nom Max Min Nom Max A1 1.627 1.672 1.717 0.0641 0.0658 0.0676 A2 1.008 1.053 1.098 0.0397 0.0415 0.0432 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.195 0.200 0.205 0.0077 0.0079 0.0081 B3 0.342 0.347 0.352 0.0135 0.0137 0.0139 B4 0.342 0.347 0.352 0.0135 0.0137 0.0139 C1 0.186 0.236 0.286 0.0073 0.0093 0.0113 C2 0.130 0.180 0.230 0.0051 0.0071 0.0090 D1 0.545 0.615 0.685 0.0215 0.0242 0.0270 D2 0.378 0.419 0.460 0.0149 0.0165 0.0181 Package Dimensions for CM1457-04CP Chip Scale Package Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1457-04CP 1.67 X 1.05 X 0.615 1.80 X 1.27 X 0.73 8mm 178mm (7") 3500 4mm 4mm Rev. 4 | Page 6 of 9 | www.onsemi.com CM1457 CM1457-04CP Mechanical Specifications The 15-bump CM1457-06CP package dimensions are shown below. Package Specifications Package Custom CSP Bumps 15 Millimeters Inches Dim Min Nom Max Min Nom Max A1 2.427 2.472 2.517 0.0956 0.0973 0.0992 A2 1.008 1.053 1.098 0.0397 0.0415 0.0432 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.195 0.200 0.205 0.0077 0.0079 0.0081 B3 0.342 0.347 0.352 0.0135 0.0137 0.0139 B4 0.342 0.347 0.352 0.0135 0.0137 0.0139 C1 0.187 0.237 0.287 0.0074 0.0093 0.0113 C2 0.130 0.180 0.230 0.0051 0.0071 0.0090 D1 0.545 0.615 0.685 0.0215 0.0242 0.0270 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1457-06CP Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1457-06 2.47 X 1.05 X 0.615 2.59 X 1.27 X 0.73 8mm 178mm (7") 3500 4mm 4mm Rev. 4 | Page 7 of 9 | www.onsemi.com CM1457 CM1457-08CP Mechanical Specifications The 20-bump CM1457-08CP package dimensions are shown below. Package Specifications Package Custom CSP Bumps 20 Dim Millimeters Min Nom Max Inches Min Nom Max A1 3.227 3.272 3.317 0.1270 0.1288 0.1306 A2 1.008 1.053 1.098 0.0397 0.0415 0.0432 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.195 0.200 0.205 0.0077 0.0079 0.0081 B3 0.342 0.347 0.352 0.0135 0.0137 0.0139 B4 0.342 0.347 0.352 0.0135 0.0137 0.0139 Package Dimensions for CM1457-08CP Chip Scale C1 0.186 0.236 0.286 0.0073 0.0093 0.0113 Package C2 0.130 0.180 0.230 0.0051 0.0071 0.0090 D1 0.545 0.615 0.685 0.0215 0.0242 0.0270 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1457-08CP 3.27 X 1.05 X 0.615 3.40 X 1.27 X 0.73 12mm 330mm (13") 3500 4mm 4mm Rev. 4 | Page 8 of 9 | www.onsemi.com CM1457 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev. 4 | Page 9 of 9 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative