Apr. 2010 Graphic Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved. -1- Apr. 2010 Product Guide Graphic Memory 1. GRAPHIC MEMORY ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 12 13 14 K 4 X XX XX X X X - X X XX Speed SAMSUNG Memory Temperature & Power DRAM Package Type Product Density & Refresh Revision Interface (VDD, VDDQ) Organization Bank 1. SAMSUNG Memory 2. DRAM 3. Product N: W: J : G: gDDR2 SDRAM gDDR3 SDRAM GDDR3 SGRAM GDDR5 SGRAM 10. Revision M: B : D: F : H: Q: gDDR3 E : 100FBGA(Halogen Free & Lead Free) H : 96FBGA(Halogen Free & Lead Free) GDDR3 B : 136FBGA(Lead Free) H : 136FBGA(Halogen Free & Lead Free) GDDR5 H : 170FBGA(Halogen Free & Lead Free) 12. Temperature & Power(VDD) 16 : x16 32 : x32 8. Bank C : Commercial Normal J : Commercial High L : Commercial Low 13~14. Speed 1A1) 112) 12 14 15 16 18 19 20 22 25 3 : 4Banks 4 : 8Banks 9. Interface ( VDD, VDDQ) Q 5 6 F K : : : : : SSTL_2 (1.8V, 1.8V) SSTL_2 (1.8V,1.8V,LP) SSTL_15 (1.5V,1.5V) POD_15 (1.5V,1.5V) POD_18 (1.8V,1.8V) : 2nd Gen. : 4th Gen. : 6th Gen. : 8th Gen. : 10th Gen. : 26th Gen. gDDR2 H : 84FBGA(Halogen Free & Lead Free) B : 84FBGA(Halogen Free & Lead Free & Flip Chip) : 512M, 8K/64ms : 512M, 8K/32ms : 1G, 8K/32ms : 1G, 8K/64ms : 2G, 8K/64ms : 4G, 8K/64ms 6~7. Organization A C E G I Z 11. Package Type 4~5. Density & Refresh 51 52 10 1G 2G 4G 1st Gen. 3rd Gen. 5th Gen. 7th Gen. 9th Gen. 17th Gen. : : : : : : : : : : : 0.935ns (2.1Gbps) 1.07ns (1.8Gbps) 1.25ns (1.6Gbps) 1.4ns (1.4Gbps) 1.5ns (1.3Gbps) 1.6ns (1.2Gbps) 1.8ns (1.1Gbps) 1.875ns (1.06Gbps) 2.0ns (1.0Gbps) 2.2ns (0.9Gbps) 2.5ns (0.8Gbps) 28 03 04 05 5C 06 6A 07 7A 08 09 : : : : : : : : : : : 0.28ns 0.33ns 0.40ns 0.50ns 0.56ns 0.62ns 0.66ns 0.71ns 0.77ns 0.8ns 0.9ns (7.0Gbps) (6.0Gbps) (5.0Gbps) (4.0Gbps) (3.6Gbps) (3.2Gbps) (3.0Gbps) (2.8Gbps) (2.6Gbps) (2.4Gbps) (2.2Gbps) NOTE : 1)Graphic high speed binning was unified to EDP binning(2000Mbps→2133Mbps) 2)Graphic high speed binning was unified to EDP binning(1800Mbps→1866Mbps) -2- Apr. 2010 Product Guide Graphic Memory 2. GRAPHIC MEMORY COMPONENT PRODUCT GUIDES Product Density Banks Part Num. PKG & Speed K4N51163QG HC20/25 512Mb Z-die K4N51163QZ HC20/25 1Gb E-die K4N1G164QE HC20/25 1Gb F-die K4N1G164QF BC20/25 1Gb E-die K4W1G1646E HC1A/11 12/15 512Mb G-die 4Banks gDDR2 SDRAM Interf. Ref. Voltage(V) SSTL_18 8K/64ms 1.8V ± 0.1V HC12/15 128Mx16 SSTL_15 8K/64ms 1.5V ± 0.075V 2Gb C-die K4W2G1646C HC1A/11 12/15 128Mx16 K4J52324KI HC7A/08 1A/12/14 16Mx32 8Banks PKG Type Status Halogen-Free & Lead-Free Mass Production Halogen-Free, Lead-Free & Flip-Chip CS May. ’10 64Mx16 8Banks K4W2G1646B 512Mb I-die 84ball FBGA 64Mx16 2Gb B-die GDDR3 SGRAM PKG. 32Mx16 8Banks gDDR3 SDRAM Org. 96ball FBGA Halogen-Free & Lead-Free Mass Production CS May. ’10 Pseudo Open_ Drain 1.8V ± 0.1V 8K/32ms 136ball FBGA Halogen-Free & Lead-Free Mass Production Mass Production 1Gb E-die K4J10324KE HC7A/08 1A/12/14 1Gb E-die 8Banks K4G10325FE HC04/05 5C 32Mx32 POD_15 8K/32ms 1.5V ± 0.045V 170ball FBGA Halogen-Free & Lead-Free Mass Production TBD 64Mx32 POD_15 16K/32ms 1.5V ± 0.045V 170ball FBGA Halogen-Free & Lead-Free CS May. ’10 GDDR5 SGRAM 2Gb C-die 16Banks K4G20325FC 32Mx32 -3- 1.8V ± 0.1V