Home Contact Us My Fairchild Part #, Keyword, Cross -reference Home > SG6841SZ Product Folder > Customer Qualification Report Print SG6841SZ Email Favorite More... Highly-Integrated Green-Mode PWM Controller Qualification Data Test Standards: ? ? ? ? ? Moisture Sensitivity: 2 Thermal Impedance: 141 Physical Dimensions: SOIC ESD HBM: 3 ESD MM: 250 Attribute Value UOM General Information SG6841SZ K&60&4&Z Device Marking(TOP MARK) Family Code 0GD Package Type SOIC Package Description 008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1) Pin Count 8 Maximum Reflow Temperature 260C Restriction of Hazardous Substance Standard Plating Finish Matte Sn Base Metal/Leadframe Material Copper,Iron,Zinc,Phosphorus,Silver Lead Pitch 1270 Minimum Lead Spacing 760 Die Fabrication Fabrication Process Identifier SG6841C Package Assembly* Plating Finish Layer Thickness 8.0um - 13um Thermal Impedance (Theta JA) 141 Moisture Sensitivity °C/Watt 2 Electrical Test ESD Human Body Model (HBM) ESD Machine Model (MM) *If an attribute is listed twice, either can be used on the part. Products | Applications | Design Support | About Fairchild Investor Relations | Careers | Contact Us | Site Map | RSS Privacy Policy | Site Terms & Conditions | Standard Terms & Conditions of Sale © Copyright 2011 Fairchild Semiconductor. All rights reserved. 3 V 250 V