STPS10L25D/G ® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 10 A VRRM 25 V Tj (max) 150 °C VF (max) 0.35 V K A FEATURES AND BENEFITS A n n n VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION OPTIMIZED CONDUCTION / REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST EFFICIENCY IN THE APPLICATIONS AVALANCHE CAPABILITY SPECIFIED NC K D2PAK STPS10L25G TO-220AC STPS10L25D DESCRIPTION Single Schottky rectifier suited to Switched Mode Power Supplies and high frequency DC to DC converters. This device is especially intended for use as a rectifier at the secondary of 3.3V SMPS units. ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 25 V IF(RMS) RMS forward current 30 A IF(AV) Average forward current Tc = 140°C δ = 0.5 10 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 200 A IRRM Repetitive peak reverse current tp=2 µs square F=1kHz 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 3 A PARM Repetitive peak avalanche power tp = 1µs 5500 W - 65 to + 150 °C 150 °C 10000 V/µs Tstg Tj dV/dt * : Storage temperature range Tj = 25°C Maximum operating junction temperature * Critical rate of rise of reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) July 2003 - Ed : 4B 1/5 STPS10L25D/G THERMAL RESISTANCE Symbol Rth (j-c) Parameter Value Unit 1.5 °C/W Junction to case STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions Tests Conditions IR * Reverse leakage current Tj = 25°C Min. VR = VRRM Tj = 125°C VF * Forward voltage drop Typ. 135 Tj = 25°C IF = 10 A Tj = 125°C IF = 10 A Tj = 25°C IF = 20 A Tj = 125°Χ IF = 20 A 0.30 Max. Unit 800 µA 260 mA 0.46 V 0.35 0.55 0.41 0.48 * tp = 380 µs, δ < 2% Pulse test: To evaluate the maximum conduction losses use the following equation : P = 0.22 x IF(AV) + 0.013 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature ( δ = 0.5). PF(av)(W) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 IF(av)(A) 12 δ = 0.2 δ = 0.1 δ = 0.5 δ = 0.05 Rth(j-a)=Rth(j-c) 10 8 δ=1 6 Rth(j-a)=50°C/W 4 T T 2 IF(av) (A) 0 1 2 3 4 5 6 δ=tp/T 7 8 9 δ=tp/T tp 0 10 11 Fig. 3: Normalized avalanche power derating versus pulse duration. 0 25 50 75 100 125 150 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 Tamb(°C) tp 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 2/5 Tj(°C) tp(µs) 0.1 1 0 10 100 1000 0 25 50 75 100 125 150 STPS10L25D/G Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 200 180 160 140 120 100 80 60 IM 40 20 0 1E-3 Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=25°C 0.6 δ = 0.5 Tc=75°C 0.4 δ = 0.2 Tc=100°C t t(s) δ=0.5 T δ = 0.1 0.2 1E-2 1E-1 1E+0 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). δ=tp/T tp(s) Single pulse 0.0 1E-4 1E-3 1E-2 tp 1E-1 1E+0 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(nF) IR(mA) 5E+2 5.0 Tj=150°C F=1MHz Tj=25°C 1E+2 Tj=125°C 1E+1 1.0 1E+0 1E-1 Tj=25°C VR(V) 1E-2 0 5 10 15 20 25 Fig. 9: Forward voltage drop versus forward current (maximum values). 100.0 0.1 VR(V) 1 2 5 10 20 30 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS10L25G only) Rth(j-a) (°C/W) IFM(A) 80 70 10.0 Typical values Tj=150°C 60 Tj=125°C 50 40 1.0 Tj=25°C 30 20 VFM(V) 0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 10 0 S(Cu) (cm²) 0 4 8 12 16 20 24 28 32 36 40 3/5 STPS10L25D/G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. Millimeters Min. A E A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 C2 L2 D L L3 A1 B2 R C B G A2 M * V2 Max. 4.40 4.60 2.49 2.69 0.03 0.23 0.70 0.93 1.14 1.70 0.45 0.60 1.23 1.36 8.95 9.35 10.00 10.40 4.88 5.28 15.00 15.85 1.27 1.40 1.40 1.75 2.40 3.20 0.40 typ. 0° 8° Inches Min. Max. 0.173 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.045 0.067 0.017 0.024 0.048 0.054 0.352 0.368 0.393 0.409 0.192 0.208 0.590 0.624 0.050 0.055 0.055 0.069 0.094 0.126 0.016 typ. 0° 8° * FLAT ZONE NO LESS THAN 2mm FOOT PRINT DIMENSIONS (in millimeters) n 16.90 10.30 5.08 1.30 3.70 8.90 4/5 Cooling method: by conduction (method C) STPS10L25D/G PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. Min. A H2 C L5 L7 ØI L6 L2 D L9 F1 L4 M F E G n n n n Millimeters A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I Inches Max. Min. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 4.95 5.15 10.00 10.40 16.40 typ. 13.00 14.00 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.194 0.202 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 Cooling method : C Recommended torque value : 0.55 m.N Maximum torque value : 0.70 m.N Ordering type Marking Package Weight Base qty Delivery mode STPS10L25D STPS10L25D TO-220AC 1.86g 50 Tube STPS10L25G STPS10L25G D2PAK 1.48g 50 Tube STPS10L25G-TR STPS10L25G D2PAK 1.48g 1000 Tape & reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5