STMICROELECTRONICS STPS1545R

STPS1545D/F/FP/R/G
®
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
15 A
VRRM
45 V
Tj (max)
175 °C
VF (max)
0.57 V
A
A
K
FEATURES AND BENEFITS
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREMELY FAST SWITCHING
INSULATED
PACKAGE:
ISOWATT220AC,
TO-220FPAC
Insulating voltage = 2000V DC
Capacitance = 12pF
AVALANCHE CAPABILITY SPECIFIED
■
K
TO-220AC
STPS1545D
TO-220FPAC
STPS1545FP
■
■
■
A
■
DESCRIPTION
Single chip Schottky rectifier suited for Switch
Mode Power Supply and high frequency DC to DC
converters.
Packaged in TO-220AC, ISOWATT220AC,
TO-220FPAC, I2PAK or D2PAK, this device is
intended for use in low voltage, high frequency
inverters, free wheeling and polarity protection
applications.
ABSOLUTE RATINGS (limiting values)
Symbol
A
A
I2PAK
STPS1545R
K
ISOWATT220AC
STPS1545F
K
A
NC
D2PAK
STPS1545G
Parameter
VRRM
Repetitive peak reverse voltage
IF(RMS)
RMS forward current
IF(AV)
K
Average forward current
δ = 0.5
TO-220AC,
I2PAK, D2PAK
Tc = 155°C
ISOWATT220AC
TO-220FPAC
Tc = 130°C
Value
Unit
45
V
30
A
15
A
220
A
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
IRRM
Repetitive peak reverse current
tp = 2 µs square F = 1kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
3
A
PARM
Repetitive peak avalanche power
tp = 1µs
6000
W
- 65 to + 175
°C
Tstg
Tj
dV/dt
* :
Storage temperature range
Tj = 25°C
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
175
°C
10000
V/µs
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
July 2003 - Ed: 5F
1/7
STPS1545D/F/FP/R/G
THERMAL RESISTANCES
Symbol
Rth (j-c)
Parameter
Value
Unit
TO-220AC, I PAK,
D2PAK
1.6
°C/W
ISOWATT220AC
TO-220FPAC
4.0
2
Junction to case
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests Conditions
IR *
Reverse leakage current
Tj = 25°C
Min.
Typ.
Max.
Unit
200
µA
11
40
mA
0.5
0.57
V
VR = VRRM
Tj = 125°C
VF *
Forward voltage drop
Pulse test :
Tj = 125°C
IF = 15 A
Tj = 25°C
IF = 30 A
Tj = 125°C
IF = 30 A
0.84
0.65
0.72
* tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation :
P = 0.42 x IF(AV) + 0.01 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Average current
temperature (δ = 0.5).
PF(av)(W)
δ = 0.1
δ = 0.2
δ = 0.5
δ = 0.05
8
δ=1
6
4
T
2
δ=tp/T
IF(av) (A)
0
0
ambient
IF(av)(A)
12
10
versus
2
4
6
8
10
12
14
tp
16
18
Fig. 3: Normalized avalanche power derating
versus pulse duration.
18
16
14
12
10
8
6
4
2
0
Rth(j-a)=Rth(j-c)
ISOWATT220AC
Rth(j-a)=15°C/W
T
δ=tp/T
0
Tamb(°C)
tp
25
50
75
100
125
150
175
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
TO-220AC
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
2/7
Tj(°C)
tp(µs)
0.1
1
0
10
100
1000
0
25
50
75
100
125
150
STPS1545D/F/FP/R/G
Fig. 5-1: Non repetitive surge peak forward current versus overload duration (maximum values)
(TO-220AC, I2PAK and D2PAK).
IM(A)
200
180
160
140
120
100
80
60
IM
40
20
0
1E-3
Fig. 5-2: Non repetitive surge peak forward current versus overload duration (maximum values)
(ISOWATT220AC, TO-220FPAC).
IM(A)
120
100
80
Tc=100°C
Tc=125°C
40
Tc=125°C
IM
20
t
t
t(s)
δ=0.5
δ=0.5
1E-2
1E-1
1E+0
Fig. 6-1: Relative variation of thermal transient impedance junction to case versus pulse duration
(TO-220AC, I2PAK and D2PAK).
0
1E-3
t(s)
1E-2
1E-1
1E+0
Fig. 6-2: Relative variation of thermal transient impedance junction to case versus pulse duration
(ISOWATT220AC, TO-220FPAC).
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.8
0.8
0.6
δ = 0.5
0.6
Tc=75°C
60
Tc=75°C
Tc=100°C
0.4
δ = 0.5
0.4
T
0.2
δ = 0.2
0.2
δ = 0.1
δ=tp/T
tp(s)
Single pulse
0.0
1E-4
1E-3
1E-2
δ = 0.1
tp
1E-1
T
δ = 0.2
tp(s)
Single pulse
1E+0
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
0.0
1E-3
1E-2
δ=tp/T
1E-1
1E+0
tp
1E+1
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
IR(µA)
2000
5E+4
F=1MHz
Tj=25°C
Tj=150°C
1E+4
Tj=125°C
1000
Tj=100°C
1E+3
Tj=75°C
1E+2
Tj=50°C
1E+1
Tj=25°C
1E+0
500
200
VR(V)
VR(V)
0
5
10
15
20
25
30
35
40
45
100
1
2
5
10
20
50
3/7
STPS1545D/F/FP/R/G
Fig. 9: Forward voltage drop versus forward
current (maximum values).
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed
circuit board FR4, Cu=35µm) (D2PAK).
IFM(A)
Rth(j-a) (°C/W)
80
100.0
70
Typical values
Tj=125°C
60
Tj=25°C
10.0
50
40
Tj=125°C
30
1.0
20
10
VFM(V)
0.1
0.0
0.2
0.4
0.6
0.8
0
1.0
1.2
1.4
1.6
S(Cu) (cm²)
0
5
10
15
20
25
30
35
PACKAGE MECHANICAL DATA
TO-220FPAC
REF.
A
H
B
Dia
L6
L2
L7
L3
L5
D
F1
L4
F
G1
G
4/7
E
A
B
D
E
F
F1
G
G1
H
L2
L3
L4
L5
L6
L7
Dia.
DIMENSIONS
Millimeters
Inches
Min.
Max.
4.4
4.6
2.5
2.7
2.5
2.75
0.45
0.70
0.75
1
1.15
1.70
4.95
5.20
2.4
2.7
10
10.4
16 Typ.
28.6
30.6
9.8
10.6
2.9
3.6
15.9
16.4
9.00
9.30
3.00
3.20
Min.
Max.
0.173
0.181
0.098
0.106
0.098
0.108
0.018
0.027
0.030
0.039
0.045
0.067
0.195
0.205
0.094
0.106
0.393
0.409
0.63 Typ.
1.126
1.205
0.386
0.417
0.114
0.142
0.626
0.646
0.354
0.366
0.118
0.126
40
STPS1545D/F/FP/R/G
PACKAGE MECHANICAL DATA
ISOWATT220AC
DIMENSIONS
A
H
REF.
B
Millimeters
Diam
Min.
L6
L7
L2
L3
F1
D
E
G
Max.
Min.
Typ.
Max.
A
4.40
4.60
0.173
0.181
B
2.50
2.70
0.098
0.106
D
2.40
2.75
0.094
0.108
E
0.40
0.70
0.016
0.028
F
0.75
1.00
0.030
0.039
F1
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
H
10.00
10.40 0.394
0.409
L2
F
Typ.
Inches
16.00
0.630
L3
28.60
30.60 1.125
1.205
L6
15.90
16.40 0.626
0.646
L7
9.00
9.30
0.354
0.366
Diam
3.00
3.20
0.118
0.126
PACKAGE MECHANICAL DATA
I²PAK
REF.
DIMENSIONS
Millimeters
A
E
c2
L2
D
L1
A1
b2
L
b1
b
e
c
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
b
0.70
0.93
0.028
0.037
b1
1.14
1.17
0.044
0.046
b2
1.14
1.17
0.044
0.046
c
0.45
0.60
0.018
0.024
c2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
E
10.0
10.4
0.394
0.409
L
13.1
13.6
0.516
0.535
L1
3.48
3.78
0.137
0.149
L2
1.27
1.40
0.050
0.055
5/7
STPS1545D/F/FP/R/G
PACKAGE MECHANICAL DATA
D2PAK
REF.
DIMENSIONS
Millimeters
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
R
FOOT PRINT DIMENSIONS (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
6/7
Inches
0.40 typ.
0.016 typ.
STPS1545D/F/FP/R/G
PACKAGE MECHANICAL DATA
TO-220AC
REF.
A
H2
C
L5
L7
ØI
L6
L2
D
L9
F1
L4
M
F
E
G
Type
Marking
Package
Weight
Base qty
Delivery mode
STPS1545D
STPS1545D
TO-220AC
1.86 g
50
Tube
STPS1545F
STPS1545F
ISOWATT220AC
2.0 g
50
Tube
STPS1545FP
STPS1545FP
TO-220FPAC
1.9 g
50
Tube
STPS1545R
STPS1545R
I2PAK
1.7 g
50
Tube
2
1.48 g
50
Tube
2
1.48 g
1000
Tape & Reel
STPS1545G
STPS1545G
STPS1545G-TR
■
■
■
■
A
C
D
E
F
F1
G
H2
L2
L4
L5
L6
L7
L9
M
Diam. I
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
10.00
10.40
0.393
0.409
16.40 typ.
0.645 typ.
13.00
14.00
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
STPS1545G
D PAK
D PAK
Cooling method: by conduction (C)
Recommended torque value: 0.55 N.m.
Maximum torque value: 0.7 N.m.
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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