FERRITE CHIP BEADS Z0 SERIES 1. PART NO. EXPRESSION : Z0K121-RB-10 (a) Series code (e) R : Reel (a)(b)(c) (d) (b) Dimension code (f) Current : C = 300mA (c) Material code (g) (e) (f) (g) (d) Impedance code : 470 = 47ȍ : 10 : RoHS Compliant 11 ~ 99 : Internal controlled number 2. CONFIGURATION & DIMENSIONS : A D C B Unit:m/m B A D C 0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Temp. rise : 30°C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55°C to +125°C d) Operating temp. : -55°C to +125°C ( include self-temp. rise ) e) Resistance to solder heat : 260°C.10secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 11.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 FERRITE CHIP BEADS Z0 SERIES 6. ELECTRICAL CHARACTERISTICS : Impedance (ȍ) Test Frequency ( Hz ) DC Resistance (ȍ) Max. Rated Current ( mA ) Max. Z0K121-RB- 120 ± 25% 100M 0.50 200 Z0K181-RA- 180 ± 25% 100M 0.70 100 Z0M100-RE- 10 ± 25% 100M 0.15 500 Z0M220-RC- 22 ± 25% 100M 0.20 300 Z0M300-RC- 30 ± 25% 100M 0.25 300 Z0M470-RB- 47 ± 25% 100M 0.30 200 Z0M600-RA- 60 ± 25% 100M 0.30 100 Part Number 7. IMPEDANCE VS. FREQUENCY CURVES : Z0K121-RB- Z0K 121-RB-10 FCM0603KF-121T02 40 0 Z0K181-RA- Z0K181-RA-10 FCM0603KF-181T01 500 IMPEDANCE(Ohm ) IMPEDANCE(O hm) 400 30 0 20 0 Z 10 0 R 1 10 Z 200 100 X 0 300 X R 0 100 1 10 00 10 0 100 0 Z0M220-RC- Z0M220-RC-10 FCM0603MF-220T03 Z0M100-RE- Z0M 100-RE-10 FCM 0603MF-100T05 50 10 FREQ UENC Y(M H z) FREQ UENC Y(M Hz) 120 30 Z 20 X IMPEDANCE(Ohm) IMPEDANCE (O hm) 40 80 Z 40 X 10 R 0 1 10 100 R 0 1 00 0 1 F REQ U EN CY(M Hz) 10 100 100 0 F REQU ENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 11.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 FERRITE CHIP BEADS Z0 SERIES 7. IMPEDANCE VS. FREQUENCY CURVES : Z0M300-RC- Z0M300-RC-10 FCM0603MF-300T03 Z0M470-RB- Z0M 470-RB-10 FCM0603M F-470T02 30 0 IMPEDANCE (O hm) IMPEDANCE(O hm) 180 120 Z 60 20 0 Z 10 0 X X R 0 1 10 100 100 0 R 0 1 F REQUE NCY(M H z) 100 1 00 0 F REQ UENCY( MHz) Z0M Z0M600-RA- 600-RA-10 FCM0603MF-600T01 300 IM PEDANCE(O hm ) 10 200 Z 100 X R 0 1 10 100 100 0 F REQ U ENCY(M Hz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 11.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 FERRITE CHIP BEADS Z0 SERIES 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Impedance Refer to standard electrical characteristics list DC Resistance HP4291A, HP4287A+16092A HP4338B Rated Current Temperature Rise Test 30°C max. (ǻt) 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Solder Heat Resistance Appearance : No significant abnormality Impedance change : Within ±30% Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. Preheating Dipping 260°C 150°C 60 seconds Natural cooling 10±0.5 seconds Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 245±5°C Flux for lead free : rosin Dip Time : 4±1sec. More than 90% of the terminal electrode should be covered with solder. Solderability Preheating Dipping 245°C 150°C Terminal Strength 60 seconds Natural cooling 4±1.0 seconds The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. W W Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. For Z Series : Size Force (Kfg) 1 0.2 2 0.5 3 0.6 4 1.0 5 1.0 6 1.0 7 1.5 8 2.0 Time (sec) > 25 Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 11.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 FERRITE CHIP BEADS Z0 SERIES 8. RELIABILITY & TEST CONDITION : ITEM Bending Strength PERFORMANCE TEST CONDITION The ferrite should not be damaged by forces applied on the right condition. Series name mm (inches) Z2 0.80 (0.033) 0.3 Z3 1.40 (0.055) 1.0 2.00 (0.079) 2.5 2.70 (0.106) 2.5 1.0(0.039) R0.5(0.02) Z4 Z5 Chip Z6 A Z7 P-Kgf Z8 Random Vibration Test Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed. Impedance : Within ±30% Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). Loading at High Temperature Appearance : No damage. Impedance : Within ±30% of initial value. Temperature : 125±5°C Applied Current : rated current Duration : 1008±12hrs Measured at room temperature after placing for 2 to 3hrs. Humidity Humidity : 90~95% RH. Temperature : 40±2°C Duration : 1008±12hrs Measured at room temperature after placing for 2 to 3hrs. For Z Series : Condition for 1 cycle Step1 : -55±2°C 30±3 min. Step2 : +125±5°C 30±3 min. Number of cycles : 5 Appearance : No damage. Impedance : Within ±30% of initial value. Thermal Shock Phase Temperature (°C) Times (min.) 1 -55±2°C 30±3 2 +125±5°C 30±3 Measured at room temperature after placing for 2 to 3hrs. Measured : 5 times Low temperature storage test Drop Temperature : -55±2°C Duration : 1008±12hrs Measured at room temperature after placing for 2 to 3hrs. a. No mechanical damage b. Impedance change : ±30% Drop 10 times on a concrete floor from a height of 75cm. Derating Derating Curve 6 Derated Current(A) For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85°C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 5 4 3 2 1 0 6A 5A 4A 3A 2A 1.5A 1A 85 125 Operating Temperature(°C) NOTE : Specifications subject to change without notice. Please check our website for latest information. 11.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 FERRITE CHIP BEADS Z0 SERIES 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 0.80 0.30 0.30 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150°C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350°C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip Soldering Natural cooling Preheating TEMPERATURE °C TEMPERATURE °C Preheating 20~40s TP(260°C/10s max.) 217 200 150 60~150s 60~180s 25 480s max. Time(sec.) Soldering Natural cooling 260 245 150 Gradual Cooling Over 2min. Figure 1. Re-flow Soldering Within 10s TEMPERATURE °C Preheating Soldering 3s (max.) 350 Natural cooling Figure 2. Wave Soldering 10s (max.) 330 150 Over 1min. Gradual Cooling Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 11.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 FERRITE CHIP BEADS Z0 SERIES 9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Upper limit t Recommendable Figure 4 NOTE : Specifications subject to change without notice. Please check our website for latest information. 11.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 FERRITE CHIP BEADS Z0 SERIES 10. PACKAGING INFORMATION : 10-1. Reel Dimension Type A(mm) B(mm) C(mm) D(mm) 7" x 8mm 9.0±0.5 60.0±2.0 13.5±0.5 178.0±2.0 7" x 12mm 13.5±0.5 60.0±2.0 13.5±0.5 178.0±2.0 C D B A 2±0.5 7" x 8mm 7" x 12mm 13.5±0.5 R10.5 R1.9 R0.5 120° 10-2 Tape Dimension / 8mm Material : Paper D:1.5 +0.1 -0.0 Series Ko Ao Po:4±0.1 D:1.56 +0.1 -0.05 t Bo F:3.5±0.1 P2:2±0.1 W:8.0±0.03 Bo P E:1.75±0.1 t P Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 0 0.68±0.05 0.38±0.05 0.50 Max. 2.0±0.05 0.50 Max. none 1 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.1 0.60±0.03 none 2 1.85±0.05 1.05±0.05 0.95±0.05 4.0±0.1 0.95±0.05 none 3(09) 2.30±0.05 1.50±0.05 0.95±0.05 4.0±0.1 0.95±0.05 none Z/L W:8.0±0.1 E:1.75±0.1 Po:4±0.1 F:3.5±0.05 P2:2±0.1 Ko Ao Material : Plastic Po:4±0.1 D:1.5+0.1 t Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 2 1.95±0.10 1.05±0.10 1.05±0.10 4.0±0.1 0.23±0.05 none 3(09) 2.25±0.10 1.42±0.10 1.04±0.10 4.0±0.1 0.22±0.05 1.0±0.1 3(12) 2.35±0.10 1.50±0.10 1.45±0.10 4.0±0.1 0.22±0.05 1.0±0.1 Ko 4 3.50±0.10 1.88±0.10 1.27±0.10 4.0±0.1 0.22±0.05 1.0±0.1 Section A-A 5 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.1 0.22±0.05 1.0±0.1 Series P A D1:1±0.1 Ao Bo W:8.0±0.1 A F:3.5±0.05 E:1.75±0.1 P2:2±0.05 Z/L NOTE : Specifications subject to change without notice. Please check our website for latest information. 11.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 FERRITE CHIP BEADS Z0 SERIES 10-2.1 Tape Dimension / 12mm Po:4±0.1 P2:2±0.05 t A Ao P A Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 6 4.95±0.1 1.93±0.1 1.93±0.1 4.0±0.1 0.24±0.05 1.5±0.1 7 4.95±0.1 3.66±0.1 1.85±0.1 8.0±0.1 0.24±0.05 1.5±0.1 8 6.10±0.1 5.40±0.1 2.00±0.1 8.0±0.1 0.30±0.05 1.5±0.1 Z/L Bo W:12.0±0.1 Series F:5.5±0.05 E:1.75±0.1 D:1.5+0.1 Ko Section A-A D1:1.5±0.1 10-3. Packaging Quantity Chip Size 8 7 6 5 4 3 (12) 3 (09) 2 1 0 Chip / Reel 1000 1000 2000 2500 3000 2000 4000 4000 10000 15000 Inner Box 4000 4000 8000 12500 15000 10000 20000 20000 50000 75000 Middle Box 20000 20000 40000 62500 75000 50000 100000 100000 250000 375000 Carton 40000 40000 80000 125000 150000 100000 200000 200000 500000 750000 Bulk (Bags) 7000 12000 20000 30000 50000 100000 150000 200000 300000 - 10-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (°C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 11.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9