HIGH CURRENT POWER INDUCTORS SSL1308M SERIES 1. PART NO. EXPRESSION : SSL1308M-R21MF-R32 (a) (b) (c) (d) (e) (f) (g) (a) Series code (e) Tolerance code : M = ± 20% (b) Dimension code (f) F : RoHS Compliant (c) Material code (g) DCR code (d) Inductance code 2. CONFIGURATION & DIMENSIONS : E B R21 0939.32 D A H G C I G PCB Pattern Unit:m/m A B C 13.46 Max. 12.95 Max. 8.0 Max. D E G H I 5.08± 0.25 2.54± 0.25 3.18± 0.25 7.11± 0.25 7.62± 0.25 3. SCHEMATIC : 4. GENERAL SPECIFICATION : a) Operating temp. : -40° C to +125° C b) Irms (A) : Will cause coil temp. to rise approximately ǻT=40°C without core loss. c) Isat (A) : Will cause L 0 to drop approximately 20% d) Part temperature (ambient + temp. rise) : Should not exceed 125° C under worst case operating conditions. NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT POWER INDUCTORS SSL1308M SERIES 5. ELECTRICAL CHARACTERISTICS : Part No. Inductance L0 ( uH ) Test Freq. ( Hz ) DCR ( mȍ ) ± 9.4% Irms (A) Max. Isat (A) Max. SSL1308M-R21MF-R32 0.21 ± 20% 0.25V/1M 0.32 45 71 SSL1308M-R26MF-R32 0.26 ± 20% 0.25V/1M 0.32 45 60 SSL1308M-R32MF-R32 0.32 ± 20% 0.25V/1M 0.32 41 50 SSL1308M-R44MF-R32 0.44 ± 20% 0.25V/1M 0.32 30 35 SSL1308M-R21MF-R53 0.21 ± 20% 0.25V/1M 0.53 45 71 SSL1308M-R26MF-R53 0.26 ± 20% 0.25V/1M 0.53 45 60 SSL1308M-R53MF-R53 0.32 ± 20% 0.25V/1M 0.53 41 50 SSL1308M-R44MF-R53 0.44 ± 20% 0.25V/1M 0.53 30 35 6. CHARACTERISTICS CURVES : SSL1308M-R26MF-R32 SSL1308M-R21MF-R32 SLPI1308M- R21M-R32 0 .4 SLPI1308M-R26M-R32 0.5 80 80 70 70 50 0 .2 40 30 0 .1 60 50 0.3 40 0.2 30 TEMP. RISE(oC) 60 INDUCTANCE (uH) 0 .3 TEMP. RISE(oC) INDUCTANCE (uH) 0.4 20 20 0.1 10 10 0 0 0 15 30 45 0 0 60 15 30 60 DC CURRENT(A) DC CURRENT(A) SSL1308M-R44MF-R32 SSL1308M-R32MF-R32 SLPI1308M-R32M-R32 0.6 45 SLPI1308M-R44M-R32 0.8 80 80 70 50 0.3 40 30 0.15 20 INDUCTANCE (uH) 60 0.45 TEMP. RISE(oC) INDUCTANCE (uH) 70 0.6 60 50 0.4 40 30 0.2 20 10 10 0 0 0 10 20 30 40 50 TEMP. RISE(oC) 0 0 0 0 7 DC CURRENT(A) 14 21 28 35 DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT POWER INDUCTORS SSL1308M SERIES 6. CHARACTERISTICS CURVES : SSL1308M-R26MF-R53 SSL1308M-R21MF-R53 SLPI1308M- R21M-R53 0 .4 SLPI1308M-R26M-R53 0 .5 80 80 70 70 50 0 .2 40 30 0 .1 60 50 0 .3 40 0 .2 30 20 TEMP. RISE(oC) 60 INDUCTANCE (uH) 0 .3 TEMP. RISE(oC) INDUCTANCE (uH) 0 .4 20 0 .1 10 0 10 0 15 30 45 0 60 0 0 12 DC CURRENT(A) 36 48 SLPI1308M- R44M-R53 0 .8 80 80 70 60 50 0 .3 40 30 0.15 20 INDUCTANCE (uH) 0.45 TEMP. RISE(oC) INDUCTANCE (uH) 70 0 .6 60 50 0 .4 40 30 0 .2 20 10 10 0 0 0 10 20 30 60 SSL1308M-R44MF-R53 SSL1308M-R32MF-R53 SLPI1308M- R32M-R53 0 .6 24 DC CURRENT(A) 40 50 TEMP. RISE(oC) 0 0 0 0 7 DC CURRENT(A) 14 21 28 35 DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT POWER INDUCTORS SSL1308M SERIES 7. RELIABILITY AND TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Inductance Refer to standard electrical characteristics list HP4284A DCR HIOKI3540 Heat Rated Current (Irms) Irms(A) will cause the coil temperature rise approximately ǻT=40°C without core loss Saturation Current (Isat) Isat(A) will cause Lo to drop approximately 20% Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245° C 150° C 60 seconds Natural cooling 5± 0.5 seconds After fluxing, component shall be dipped in a melted solder bath at 245± 5° C for 5 secs Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ± 20% of initial value Preheat : 150° C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260± 5° C Flux : rosin 260° C Dip Time : 10± 0.5sec. 150° C Preheating Dipping 60 seconds Natural cooling 10± 0.5 seconds Reliability Test High Temperature Life Test Low Temperature Life Test Temperature : 125± 5° C Time : 500± 12 hours Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. 1. Appearance : No damage 2. Inductance : Within ± 20% of initial value. No disconnection or short circuit. Thermal Shock Temperature : -40± 5° C Time : 500± 12 hours Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Conditions of 1 cycle. Step Temperature (° C) 1 -25± 3 Times (min.) 30± 3 2 Room Temperature Within 3 3 85± 3 30± 3 4 Room Temperature Within 3 Total : 5 cycles Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ± 20% of initial value. No disconnection or short circuit. Random Vibration Test Appearance : Cracking, chipping and any other defects harmful to the characteristics should not be allowed. Temperature : 40± 5° C Humidity : 90% to 95% Applied Current : Rated Current Time : 500± 12 hours Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions and times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT POWER INDUCTORS SSL1308M SERIES 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern G Unit:m/m G H H I I G 3.18± 0.25 7.11± 0.25 7.62± 0.25 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 8-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150° C. b) 280° C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Soldering 20~40s max. TP(260° C/10s max.) Natural cooling 217 200 150 60~150s 60~180s 480s max. 25 TIME(sec.) Preheating TEMPERATURE ° C TEMPERATURE ° C Preheating 350 Soldering Natural cooling 300 150 Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 HIGH CURRENT POWER INDUCTORS SSL1308M SERIES 9. PACKAGING INFORMATION : 9-1. Reel Dimension COVER TAPE ØC B D 2.0± 0.5 A EMBOSSED CARRIER Type A(mm) B(mm) C(mm) D(mm) 13" x 24mm 24.0± 0.5 75± 2 13.5± 0.5 330 Ø1.5+0.1 t P 0.15 MIN Ko Ao Series Ao(mm) Bo(mm) Ko(mm) P(mm) SSL1308M 13.8± 0.1 13.8± 0.1 8.2± 0.1 16.0± 0.1 Bo 2.0± 0.1 W 4.0± 0.1 1.75± 0.1 9-2 Tape Dimension W(mm) t(mm) 24.0± 0.3 0.35± 0.05 9-3 Packaging Quantity Size SSL1308M Chip / Reel 400 Inner Box 800 Carton 3200 NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH CURRENT POWER INDUCTORS 9-4. Tearing Off Force SSL1308M SERIES The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions. (referenced ANSI/EIA-481-C-2003 of 4.11 standard) F 165° to 180° Top cover tape Room Temp. (° C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 40° C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7