CERAMIC CHIP INDUCTORS C3 SERIES 1. PART NO. EXPRESSION : C3-1N0S-10 (a) Series code (a) (b) Inductance code : 1N0 = 1.0nH (b) (c) (d) (d) 10 : RoHS Compliant (c) Tolerance code : S = ±0.3nH, J = ±5% 2. CONFIGURATION & DIMENSIONS : A D C B Unit:m/m A B 2.0±0.2 1.25±0.2 C 0.85±0.2 D 1.25±0.2 0.2 ~ 0.8 3. GENERAL SPECIFICATION : a) Operating temp. : -40°C to +85°C b) Storage temp. : -10°C to +40°C c) Humdity range : 70% RH Max. d) Resistance to solder heat : 265°C.6secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS C3 SERIES 4. ELECTRICAL CHARACTERISTICS : Part Number Dim. C ±0.2 Inductance ( nH ) Q Min. Test Frequency ( MHz ) SRF ( GHz ) Min. DCR (ȍ) Max. Rated Current ( mA ) Max. C3-1N0S-10 0.85 1.0 10 100 10 0.10 300 C3-1N2S-10 0.85 1.2 10 100 10 0.10 300 C3-1N5S-10 0.85 1.5 10 100 4.0 0.10 300 C3-1N8S-10 0603 1.8 10 100 4.0 0.10 300 C3-2N2S-10 0603 2.2 10 100 4.0 0.10 300 C3-2N7S-10 0.85 2.7 12 100 4.0 0.10 300 C3-3N3S-10 0.85 3.3 12 100 4.0 0.13 300 C3-3N9S-10 0.85 3.9 12 100 4.0 0.15 300 C3-4N7S-10 0.85 4.7 12 100 3.5 0.20 300 C3-5N6S-10 0.85 5.6 15 100 3.2 0.23 300 C3-6N8J-10 0.85 6.8 15 100 2.8 0.25 300 C3-8N2J-10 0.85 8.2 15 100 2.4 0.28 300 C3-10NJ-10 0.85 10 15 100 2.1 0.30 300 C3-12NJ-10 0.85 12 15 100 1.9 0.35 300 C3-15NJ-10 0.85 15 15 100 1.6 0.40 300 C3-18NJ-10 0.85 18 15 100 1.5 0.45 300 C3-22NJ-10 0.85 22 18 100 1.4 0.50 300 C3-27NJ-10 0.85 27 18 100 1.3 0.55 300 C3-33NJ-10 0.85 33 18 100 1.2 0.60 300 C3-39NJ-10 0.85 39 18 100 1.0 0.65 300 C3-47NJ-10 0.85 47 18 100 0.9 0.70 300 C3-56NJ-10 0.85 56 18 100 0.8 0.75 300 C3-68NJ-10 0.85 68 18 100 0.7 0.80 300 C3-82NJ-10 0.85 82 18 100 0.6 0.90 300 C3-R10J-10 0.85 100 18 100 0.6 0.90 300 C3-R12J-10 0.85 120 13 50 0.5 0.95 300 C3-R15J-10 1.25 150 13 50 0.5 1.00 300 C3-R18J-10 1.25 180 13 50 0.4 1.10 300 C3-R22J-10 1.25 220 12 50 0.35 1.20 300 C3-R27J-10 1.25 270 12 50 0.3 1.30 300 C3-R33J-10 1.25 330 12 50 0.25 1.40 300 C3-R39J-10 1.25 390 10 50 0.25 1.40 300 C3-R47J-10 1.25 470 10 50 0.20 1.50 300 C3-R56J-10 1.25 560 10 25 0.18 5.00 50 C3-R68J-10 1.25 680 10 25 0.16 5.50 50 Tolerance code : S : ±0.3nH J : ±5% NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS C3 SERIES 5. CHARACTERISTICS CURVES : Inductance vs. Frequency Characteristics Q vs. Frequency Characteristics NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS C3 SERIES 6. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE DC Resistance TEST CONDITION HP4338 digital milli-ohm meter Terminal Strength Appearance : No significant abnormality Impedance change : Within ±30% Solder chip on PCB and applied 10N (1.02Kgf) for 10sec DCR : Shall be satisfied Appearance : No significant abnormality Inductance change : Within ±20% 45 45 40 0.8 DCR : Shall be satisfied Solder a chip on a test substrate, bend the substrate by 3mm hold for 10s and then return. Soldering shall be done in accordance with the recommended PC board pattern and reflow soldering bending Substrate Bending Strength 100 Resistance to Solder Heat Appearance : No significant abnormality Electrical and mechanical characteristics shall be satisfied Consult standard MIL-STD-202 METHOD 210 More than 95% coverage of all metabolised area Solderability Consult standard J-STD-002 High Temperature Resistance Appearance : No mechanical damage. Inductance : Within ±20% of initial value. unit : mm Preheat : 100 ~ 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 265±3°C Dip Time : 6±1sec. Measurement to be made after keeping at room temp for 24±2hrs Solder Temperature : 240±5°C Solder : Sn-Ag3.0-Cu0.5 Dip Time : 3±1sec. Temperature : 85±2°C Applied Current : rated current (max. value) Duration : 1008±12hrs Measurement : After placing for 24 hours (min.) at room ambient temperature Humidity Resistance Appearance : No mechanical damage. Inductance : Within ±20% of initial value. Temperature Cycle Appearance : No mechanical damage. Inductance : Within ±20% of initial value. Humidity : 90~95% RH. Temperature : 60±2°C Applied Current : rated current (max. value) Duration : 1008±12hrs Measurement : After placing for 24 hours (min.) at room ambient temperature Condition for 1 cycle Step1 : -40±3°C 30±3 min. Step2 : Room temperature 2 to 5 minutes Step3 : +85±2°C 30±3 min. Step4 : Room temperature 2 to 5 minutes Number of cycles : 100 Measurement : After placing for 24 hours (min.) at room ambient temperature NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 CERAMIC CHIP INDUCTORS C3 SERIES 6. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE Low Temperature Storage test Thermal Shock TEST CONDITION Appearance : No mechanical damage. Temperature : -40±2°C Inductance : Within ±20% of initial value. Measurement : After placing for 24 hours (min.) at room ambient temperature Appearance : No mechanical damage. Temperature : -40°C, +85°C kept stabilized for 30 minutes each Inductance : Within ±20% of initial value. Cycle : 100 cycles Duration : 1008±12hrs Measurement : After placing for 24 hours (min.) at room ambient temperature Vibration Test Appearance : No mechanical damage. Waveform : Sine wave Frequency : 10-55-10Hz for 1 min. Inductance : Within ±20% of initial value. Amplitude : 1.5mm(peak-peak) Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 CERAMIC CHIP INDUCTORS C3 SERIES 7. SOLDERING : 7-1. Reflow soldering conditions Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max. Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time. A TEMPERATURE °C main heating 1 to 5 °C/sec Heat time 50 to 150 sec Heat temperature 120 to 180 °C C Slope of temp. rise 1 to 5 °C/sec D Time over 230°C 90 ~ 120 sec Peak temperature 255 ~ 260 °C Peak hold time 10 max. sec No. of mounting 3 times E 230°C B 180°C pre-heating 120°C normal temperature A B C E D TIME(sec.) Slope of temp. rise (Melting area of solder) 7-2. Soldering Iron Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm f) Limit soldering time to 3 secs. 7-3. Solder Volume : t Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side. Upper limit Recommendable NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS C3 SERIES 8. PACKAGING INFORMATION : 8-1. Paper Carrier Tape Packaging P0 D0 T B W F E P2 P1 A Unreeling direction A(mm) B(mm) W(mm) F(mm) E(mm) P1(mm) P2(mm) P0(mm) D0(mm) t(mm) 1.45±0.05 2.25±0.05 8.00±0.10 3.50±0.05 1.75±0.10 4.00±0.10 2.00±0.05 4.00±0.10 1.55±0.05 0.95±0.05 8-2. Leader And Trailer Tape Components Trailer Empty compartments Leader End Start 20 pitch or more 110mm or more 400 ~ 560mm 8-3. Configuration W1 2±0.5 ±0.5 A(mm) N(mm) W1(mm) W2(mm) QTY (PCS) 178±2.0 50 Min. 10±1.5 20 Max. 4000/Reel A N 1 3 .0 ± 21 8 0. R1.0 W2 NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 CERAMIC CHIP INDUCTORS C3 SERIES 8-4. Tearing Off Force F 165° to 180° Peeling Strength of Cover Tape Top cover tape Cover Tape 10g ~ 100g Base tape Peel Speed : 300mm/min 8-5. Packaging 1. Reel and a bag of desiccant shall be packed in Nylon or plastic bag 2. Maximum of 5 bags shall be packed in an inner box 3. Maximum of 6 inner boxes shall be packed in an outer box Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 40°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8